摘要:
A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.
摘要:
A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.
摘要:
A light emitting diode (LED) heat dissipation module is suitable to dissipate heat for at least a LED. The LED heat dissipation module includes a heat dissipation base, at least a heat conductor, and a plurality of heat dissipation fins. The heat dissipation base has a first surface and a second surface corresponding to the first surface. The LED is provided on the first surface and the heat conductor is provided on the second surface. In addition, the heat dissipation fins are provided at the heat conductor, and the heat dissipation fins are separated from the heat dissipation base.
摘要:
A heat dissipation module is suitable to dissipate heat for a heat source on a circuit board, wherein a plurality of locking holes are disposed around the heat source. The heat dissipation module includes a heat sink, a locking rod, and two fasteners. The heat sink has a groove, and the locking rod has a rod body and two hooks extended from two ends of the rod body. The rod body is across the groove. In addition, each fastener is connected to each corresponding hook, and is fastened at the locking hole.
摘要:
A heat dissipation module is disclosed. The heat dissipation module suitable to dissipates heat generating by for a heat source, and multiple fixing parts are disposed around the heat source. The heat dissipation module includes a heat sink, two first rods, and two second rods corresponding to the first rods. The first rods and the second rods are pivotally provided on the heat sink. Each first shaft rod is suitable to rotate about a first axis. Two hooks of each first rod fasten the fixing parts easily. Each second rod is suitable to rotate about a second axis and leans against the heat sink. Thus, each second rod tightly fits with each first rod, and two hooks of each first rod tightly fasten the fixing parts. The heat sink is forced by the first rods, and the heat sink and the heat source abut against each other tightly.
摘要:
A heat-dissipating device includes: a base plate for disposing on a mounting surface, a plurality of cooling fins extending vertically from the base plate to define a first channel and a second channel on an upper surface of the base plate, and a fastening member. The fastening member includes a first portion disposed in the first channel and having an engaging element for engaging a lower surface of the base plate adjacent to one end thereof, a second portion disposed in the second channel and extending integrally from the first portion, and a third portion extending integrally from the second portion. The first and second portions are located in a plane, which cooperates with the third portion to define an angle. The third portion has a hook for securing the base plate onto the mounting surface.
摘要:
An optical receiver communication system converts optical signals modulated by analog or digital waveforms to RF signals. The optical receiver contains an automatic level control circuit to adjust the electronic gain of the system across a broad bandwidth spectrum. Two impedance matching circuits are designed using broad band matching technique to expand the bandwidth for increasing the maximum receivable frequencies to 1 GHz. A RLC impedance matching circuit forms a resonant combination to maintain .+-.1 dB fluctuation between the low-and-high-frequency limits of the bandwidth, and a 75.OMEGA. impedance matching circuit creates a 180.degree. phase shift between outgoing and incoming signals to ensure low return loss.
摘要:
An LED heat dissipation module including a heat pipe, an LED and a heat sink is provided. The heat pipe has at least a flat portion having a surface. The LED is provided at the surface of the flat portion of the heat pipe. The heat sink is coupled to the heat pipe. The heat dissipation efficiency of the LED heat dissipation module is increased.
摘要:
A light emitting diode (LED) light source device includes a plurality of LED modules, a base and a clip. The base has a first base body, a second base body, and a third base body. The second base body and the third base body extend from two sides of the first base body and are corresponding to each other. The LED modules are provided at inside surfaces of the first base body, the second base body and the third base body. The clip holds the LED modules and fastens the second base body and the third base body to enable the LED modules to be tightly assembled at the base.
摘要:
This invention relates to a method for forming a nickel-based layered structure and a boundary layer containing a solid solution of magnesium and an M-metal on a magnesium alloy substrate. A surface-treated magnesium alloy article made from the above method, and a cleaning solution and a surface treatment solution used in the above method are also disclosed.