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公开(公告)号:US20060121647A1
公开(公告)日:2006-06-08
申请号:US11042939
申请日:2005-01-24
申请人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
发明人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
CPC分类号: H01L21/568 , H01L23/3107 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48465 , H01L2224/48997 , H01L2224/49171 , H01L2224/85001 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.
摘要翻译: 提供了一种无载体半导体封装及其制造方法。 该制造方法包括以下步骤:提供其上形成有多个电触头的载体; 在载体上安装至少一个芯片; 通过多个接合线将芯片电连接到电触点; 在每个所述电触点上形成涂层,以将每个所述接合线的接合端封装在所述电触点上; 进行成型工艺以形成用于封装芯片,接合线和电触头的密封剂; 并移除载体,使得电触点的底表面从密封剂暴露出来。 这获得不具有载体的半导体封装,并且涂层可以增强电触点和密封剂之间的粘附。
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2.
公开(公告)号:US20060151862A1
公开(公告)日:2006-07-13
申请号:US11071389
申请日:2005-03-02
申请人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
发明人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
IPC分类号: H01L23/495
CPC分类号: H01L23/49503 , H01L21/565 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要: A lead-frame-based semiconductor package and a lead frame thereof are proposed. The semiconductor package includes: the lead frame having at least one die pad and a plurality of leads around the die pad, wherein a plurality of grooves and runners are formed on a surface of the die pad, and each of the grooves is connected to an edge of the die pad by at least one of the runners; at least one chip mounted on the other surface of the die pad and electrically connected to the plurality of leads; and an encapsulant for encapsulating the chip, with the runners and grooves being exposed from the encapsulant. Thus, the flash problem in the prior art can be solved by means of the runners and grooves.
摘要翻译: 提出了一种引线框架半导体封装及其引线框架。 所述半导体封装包括:所述引线框架具有至少一个管芯焊盘和围绕所述管芯焊盘的多个引线,其中在所述管芯焊盘的表面上形成多个沟槽和流道,并且每个所述沟槽连接到 由至少一个跑步者的模具垫的边缘; 至少一个芯片安装在所述管芯焊盘的另一个表面上并电连接到所述多个引线; 以及用于封装芯片的密封剂,其中流道和凹槽从密封剂暴露出来。 因此,现有技术中的闪光灯问题可以通过滑道和槽来解决。
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公开(公告)号:US07314820B2
公开(公告)日:2008-01-01
申请号:US11042939
申请日:2005-01-24
申请人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
发明人: Yu-Wei Lin , Fu-Di Tang , Chun-Yuan Li , Terry Tsai , Yu-Ting Ho
IPC分类号: H01L21/44 , H01L21/50 , H01L21/48 , H01L23/52 , H01L23/48 , H01L23/495 , H01L23/498
CPC分类号: H01L21/568 , H01L23/3107 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48465 , H01L2224/48997 , H01L2224/49171 , H01L2224/85001 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.
摘要翻译: 提供了一种无载体半导体封装及其制造方法。 该制造方法包括以下步骤:提供其上形成有多个电触头的载体; 在载体上安装至少一个芯片; 通过多个接合线将芯片电连接到电触点; 在每个所述电触点上形成涂层,以将每个所述接合线的接合端封装在所述电触点上; 进行成型工艺以形成用于封装芯片,接合线和电触头的密封剂; 并移除载体,使得电触点的底表面从密封剂暴露出来。 这获得不具有载体的半导体封装,并且涂层可以增强电触点和密封剂之间的粘附。
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公开(公告)号:US5812473A
公开(公告)日:1998-09-22
申请号:US746655
申请日:1996-11-13
申请人: Terry Tsai
发明人: Terry Tsai
CPC分类号: G11C7/1006 , G11C7/1072
摘要: A synchronous dynamic random access memory (SDRAM) has a plurality of memory cell arrays including a plurality of bit line pairs with each bit line connected to a plurality of memory cells, a plurality of sense amplifiers with each sense amplifier connected to a bit line pair of each memory cell array through a bank select switch, and a plurality of data line pairs. A plurality of pass gates includes a first pair of pass gates connecting a sense amplifier output of a bit line pair to a first data line pair, and a second pair of pass gates connecting the sense amplifier output of a bit line pair to a second data line pair, whereby each bit line pair is connectable through a sense amplifier to first and second data line pairs. In operation, the first data line pair and the second data line pair are toggled alternately in connection to the bit line pairs by alternating column select line signals (CSLA, CSLB).
摘要翻译: 同步动态随机存取存储器(SDRAM)具有多个存储单元阵列,其包括多个位线对,每个位线连接到多个存储单元;多个读出放大器,每个读出放大器连接到位线对 每个存储单元阵列通过存储体选择开关,以及多个数据线对。 多个通过门包括将位线对的读出放大器输出连接到第一数据线对的第一对通孔和将位线对的读出放大器输出连接到第二数据的第二对通孔 线对,由此每个位线对可通过读出放大器连接到第一和第二数据线对。 在操作中,通过交替列选择线信号(CSLA,CSLB),第一数据线对和第二数据线对被交替地与位线对交替地切换。
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