公开(公告)号：US20100150757A1

公开(公告)日：2010-06-17

申请号：US12712151

申请日：2010-02-24

申请人： Yu-liang Lin ,  Yu-lung Dung ,  Yueh-lung Huang ,  Chen-Lin Huang

发明人： Yu-liang Lin ,  Yu-lung Dung ,  Yueh-lung Huang ,  Chen-Lin Huang

IPC分类号： F04B17/00 ,  H05K7/20

CPC分类号： H05K1/0272 ,  F04B15/08 ,  F04D25/0633 ,  F04D25/068 ,  F04D29/5813 ,  F04D29/5853 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10689 ,  H01L2924/00

摘要： A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component.A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.

摘要翻译： 适于风扇的电路板包括电路区域和散热膜。 电路区域设置在电路板的第一表面上，并且在其上包括至少一个发热部件。 散热膜涂覆在第一表面的边缘部分上并与发热部件接触。 为了提高散热效率，已经公开并要求了通过散热膜的多个开口，电路板的突起，突起中的切口以将发热部件暴露于气流等。 也可以在与电路板的第一表面相对的第二表面上设置散热器。 散热器连接到散热片，以帮助消散风扇运行产生的热量。