摘要:
The present disclosure provides an apparatus for manufacturing a carbon nanotube heat sink. The apparatus includes a board, and a plurality of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes. A method for manufacturing multiple carbon nanotube heat sinks is also provided.
摘要:
An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.
摘要:
A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.
摘要:
A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.
摘要:
A method for making carbon nanotubes that includes the following steps. A metal substrate is provided. The surface of the metal substrate is polished. The polished metal substrate is put into a reaction device. A protecting gas is introduced to the reaction device while the environment inside of the reaction device is heated to about 400 to 800 degrees. A mixture of carbon source gas and protecting gas is introduced to the reaction device, whereby the carbon nanotubes are grown on the metal substrate on the polished metal substrate.
摘要:
The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.
摘要:
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
摘要:
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
摘要:
A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.
摘要:
A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.