INSTRUMENTED COUPLING ELECTRONICS

    公开(公告)号:US20220186602A1

    公开(公告)日:2022-06-16

    申请号:US17124400

    申请日:2020-12-16

    IPC分类号: E21B47/01 E21B17/02

    摘要: An compact instrumented downhole coupling that includes a carrier and a set of sensors and electronics that are installed within the carrier. The carrier is a tubular structure having couplings at each end and a bore extending through the carrier from the first end to the second end, forming a carrier wall between the bore and the exterior surface of the carrier. The bore and couplings are offset from a central axis of the carrier (the axis of the cylindrical outer surface of the carrier), resulting in a thicker portion of the carrier wall on one side of the carrier. Cavities are formed (e.g., by drilling holes) within the thicker portion of the carrier wall. One or more sensors and corresponding electronics are then positioned within the cavities, so that the carrier wall itself forms a housing for the sensors and electronics.

    Instrumented coupling electronics

    公开(公告)号:US11506046B2

    公开(公告)日:2022-11-22

    申请号:US17124400

    申请日:2020-12-16

    IPC分类号: E21B47/01 E21B17/02

    摘要: An compact instrumented downhole coupling that includes a carrier and a set of sensors and electronics that are installed within the carrier. The carrier is a tubular structure having couplings at each end and a bore extending through the carrier from the first end to the second end, forming a carrier wall between the bore and the exterior surface of the carrier. The bore and couplings are offset from a central axis of the carrier (the axis of the cylindrical outer surface of the carrier), resulting in a thicker portion of the carrier wall on one side of the carrier. Cavities are formed (e.g., by drilling holes) within the thicker portion of the carrier wall. One or more sensors and corresponding electronics are then positioned within the cavities, so that the carrier wall itself forms a housing for the sensors and electronics.

    SPOOLABLE DEVICE, METHOD FOR MAKING A SPOOLABLE DEVICE, AND SYSTEM

    公开(公告)号:US20230145431A1

    公开(公告)日:2023-05-11

    申请号:US17521345

    申请日:2021-11-08

    IPC分类号: E21B47/01 B65H75/50

    摘要: A spoolable device including a first communication interface, a second communication interface, a power management module, a functional electrical module, and a junction joining each of the above elements together and creating a shared pressure chamber. A method for making a spoolable device comprising welding a functional electrical module to a first portion of a junction box, welding a first communication interface to the first portion of a junction box, welding a power management module to a second portion of a junction box, welding a second communication interface to the second portion of a junction box, and welding the first portion of a junction box to the second portion of the junction box to form a pressure chamber inside the first and second portions of the junction box.