公开(公告)号：US20070225438A1

公开(公告)日：2007-09-27

申请号：US11587049

申请日：2005-02-15

申请人： Yuji Hasegawa ,  Yasuhisa Odagawa ,  Tooru Kikuchi

发明人： Yuji Hasegawa ,  Yasuhisa Odagawa ,  Tooru Kikuchi

IPC分类号： C08L79/08

CPC分类号： H01L24/83 ,  C08G73/106 ,  C09J179/08 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

摘要： A resin paste for die bonding that can be supplied and applied easily by a printing method. The resin paste for die bonding of the present invention comprises: a polyimide resin (PI), which is obtained by reacting a tetracarboxylic dianhydride (A) comprising a tetracarboxylic dianhydride represented by the formula (I) shown below: (wherein, n represents an integer from 2 to 20), with a diamine (B) comprising a siloxane-based diamine represented by the formula (II) shown below: (wherein, Q1 and Q2 each represent, independently, an alkylene group of 1 to 5 carbon atoms or a phenylene group, Q3, Q4, Q5 and Q6 each represent, independently, an alkyl group of 1 to 5 carbon atoms, a phenyl group, or a phenoxy group, and p represents an integer from 1 to 50); a filler (F); and a printing solvent (S), wherein the resin paste has been adjusted to have a solid fraction from 20 to 70% by weight, a thixotropic index from 1.5 to 8.0, and a viscosity (25° C.) from 5 to 1,000 Pa·s.

摘要翻译： 用于芯片接合的树脂糊剂，其可以通过印刷方法容易地供应和应用。 本发明的芯片接合用树脂膏包括：将由下述式（I）表示的四羧酸二酐的四羧酸二酐（A）反应得到的聚酰亚胺树脂（PI）：其中，n表示 与二胺（B）包含由下式（II）表示的硅氧烷基二胺的二胺（B）：（其中，Q 1和Q 2 各自独立地表示1〜5个碳原子的亚烷基或亚苯基，Q 3，Q 4，Q 5和 Q 6各自独立地表示1〜5个碳原子的烷基，苯基或苯氧基，p表示1〜50的整数）。 填料（F）; 和印刷溶剂（S），其中将树脂糊调节至固体成分为20〜70重量％，触变指数为1.5〜8.0，粘度（25℃）为5〜1000Pa .s。

公开(公告)号：US20070290369A1

公开(公告)日：2007-12-20

申请号：US11629876

申请日：2005-06-17

申请人： Yuji Hasegawa ,  Tooru Kikuchi ,  Satoshi Ebana ,  Yasuhisa Odagawa ,  Masao Kawasumi ,  Mitsuo Yamazaki

发明人： Yuji Hasegawa ,  Tooru Kikuchi ,  Satoshi Ebana ,  Yasuhisa Odagawa ,  Masao Kawasumi ,  Mitsuo Yamazaki

IPC分类号： H01L21/30 ,  C09B67/00 ,  H01L23/48

CPC分类号： H01L24/29 ,  C08K3/013 ,  C08L13/00 ,  C08L63/00 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  C08L2666/16 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

摘要： Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste following drying and curing is within a range from 1 to 300 MPa (25° C.). The solid fraction is preferably from 40 to 90% by weight, the thixotropic index is preferably from 1.5 to 8.0, and the viscosity (25° C.) is preferably from 5 to 1,000 Pa·s. Using this resin paste, a semiconductor device is produced by a method comprising (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to effect B-staging of the resin, (3) mounting a semiconductor chip on the B-staged resin, and (4) conducting post-curing of the resin.

摘要翻译： 公开了包含丁二烯均聚物或具有羧酸端基的共聚物（A），热固性树脂（B），填料（C）和印刷溶剂（D）的模片接合用树脂糊料，其中弹性模量 干燥固化后的树脂糊料在1〜300MPa（25℃）的范围内。 固体成分优选为40〜90重量％，触变指数优选为1.5〜8.0，粘度（25℃）优选为5〜1,000Pa·s。 使用该树脂膏，通过以下方法制造半导体装置，该方法包括：（1）将规定量的树脂膏施加到基板上，（2）干燥树脂浆料以实现树脂的B阶分级，（3） B阶树脂上的半导体芯片，（4）进行树脂的后固化。

公开(公告)号：US5356953A

公开(公告)日：1994-10-18

申请号：US181206

申请日：1994-01-13

申请人： Koki Harada ,  Yasuhisa Odagawa

发明人： Koki Harada ,  Yasuhisa Odagawa

IPC分类号： C08F257/02 ,  C08F283/01 ,  C08L67/06

CPC分类号： C04B26/18 ,  C08F257/02 ,  C08F283/01 ,  C08L67/06 ,  C04B2111/545

摘要： Disclosed are a resin composition for artificial marble comprising:(I) an unsaturated polyester obtained by using a divalent alcohol containing hydrogenated hisphenol A as an essential component and an .alpha.,.beta.-ethylenic unsaturated dibasic acid;(II) a copolymerizable monomer;(III) an unsaturated alcohol which can be copolymerized with the unsaturated polyester (I) and the copolymerizable monomer (II); and(IV) a low molecular weight styrene-maleic anhydride copolymer having a molar ratio of styrene to maleic anhydride being 3:1 to 7:1 and a number average molecular weight of less than 5,000,wherein the unsaturated alcohol (III) is used in such an amount that the weight ratio of the unsaturated alcohol (III) to the copolymerizable monomer (II) is 1:99 to 50:50, the weight ratio of the unsaturated polyester (I) to (the copolymerizable monomer (II)+the unsaturated alcohol (III)) is 30:70 to 70:30, and the weight ratio of the styrene-maleic anhydride copolymer (IV) to (the unsaturated polyester (I)+the copolymerizable monomer (II)+the unsaturated alcohol (III)) is 10:90 to 40:60, a bulk molding compound or sheet molding compound using the same, and a process for preparing artificial marble using the same.

摘要翻译： 公开了一种人造大理石树脂组合物，其包含：（I）通过使用含有氢化苯酚A作为主要成分的二价醇和α，β-亚乙烯基不饱和二元酸得到的不饱和聚酯; （II）可共聚单体; （III）可与不饱和聚酯（I）和可共聚单体（II）共聚的不饱和醇; 和（IV）苯乙烯与马来酸酐的摩尔比为3:1至7:1的低分子量苯乙烯 - 马来酸酐共聚物，数均分子量小于5,000，其中使用不饱和醇（III） 使不饱和醇（III）与可共聚单体（II）的重量比为1:99〜50:50的量，不饱和聚酯（I）与（可共聚单体（II）+ 不饱和醇（III））为30:70〜70:30，苯乙烯 - 马来酸酐共聚物（IV）与（不饱和聚酯（I）+可共聚单体（II）+不饱和醇 III））为10:90〜40:60，使用该组合物的片状模塑料或片状模塑料，以及使用其制备人造大理石的方法。