摘要:
A motor driven fuel pump adapted for use with a fuel injection system of an internal combustion engine has a pump housing and an impeller of regenerative pump type rotatably disposed in the housing and provided with circumferential rows of grooves formed in the opposite end faces of the impeller along the outer peripheral edges thereof. The housing is formed therein with suction and discharge ports and cooperates with the impeller to define a fuel pressurizing passage extending circumferentially of the impeller and surrounding the grooved outer peripheral section thereof. The fuel pressurizing passage is circumferentially interrupted by a partition wall disposed between the suction and discharge ports and extending radially inwardly into close contacting relationship to the outer peripheral section of the impeller to prevent flow of fuel from the discharge port toward the suction port. The discharge port is tangential to the fuel pressurizing passage to facilitate smooth flow of the pressurized fuel from the passage into the discharge port and reduce the amount of material required for the pump housing.
摘要:
A capacitor which can be manufactured easily without an addition of photo masks and manufacturing processes is obtained.The capacitor has a plural via plugs (1a to 1c) which function as a first electrode and a plural via plugs (2a to 2c) which function as a second electrode. The via plugs (1a to 1c) are formed in a row along an X direction, and similarly, the via plugs (2a to 2c) are also formed in a row along the X direction. The capacitor is formed in a multilayer wiring structure of a semiconductor device, and the via plugs (1a to 1c) and the via plugs (2a to 2c) face each other with part of an interlayer insulating film between. Part of the interlayer insulating film which is put between the via plugs (1a to 1c) and the via plugs (2a to 2c) function as a capacitor dielectric film.
摘要:
A thermoelectric converting element is constituted of an N-type semiconductor region, a P-type semiconductor region and metal interconnections. The N-type semiconductor region is formed simultaneously with an n31 impurity region and an n+ impurity region of a transistor in an element forming region. The P-type semiconductor region is formed simultaneously with a p− impurity region and a p+ impurity region of another transistor. In addition, the interconnections in the thermoelectric converting element are formed simultaneously with a metal interconnection connected to the transistor. Thus, a semiconductor device can be obtained, in which cooling effect can be readily achieved without increasing production cost.
摘要:
A semiconductor substrate wafer 2 is supported on a wafer-supporting table 3 so that a surface to be polished is directed upward, a polishing roller 1 is bring to contact with the surface to be polished of the semiconductor substrate wafer 2, and the polishing roller is rolled over the wafer under a pressure whereby a scattering of polishing to the surface of the semiconductor substrate wafer can be eliminated while productivity is increased.