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公开(公告)号：US5866657A
公开(公告)日：1999-02-02
申请号：US970587
申请日：1997-11-14
CPC分类号： C08G18/6229 , C08G18/706 , C08G18/809 , C09D5/002 , Y10S525/902
摘要： In order to provide a general-purpose aqueous primer composition requiring no organic solvent and capable of improving adhesive strength and durability while ensuring an adequate application life required for the work of primer coating process, a primer composition according to the present invention contains (a) a modified polyisocyanate obtained by reaction of polyisocyanate; an emulsifying agent having an active hydrogen group reactable to an isocyanate group; and a silane coupling agent having an active hydrogen group reactable to an isocyanate group and (b) a core shell emulsion having a core layer of a rubbery polymer and a shell layer of a glassy polymer and having an active hydrogen group reactable to an isocyanate group in the core layer and/or the shell layer.
摘要翻译： 为了提供不需要有机溶剂的通用水性底漆组合物，并且能够在确保底漆涂布工序所需的适当使用寿命的同时提高粘合强度和耐久性，根据本发明的底漆组合物含有（a） 通过多异氰酸酯反应得到的改性多异氰酸酯; 具有可与异氰酸酯基团反应的活性氢基团的乳化剂; 和具有可与异氰酸酯基团反应的活性氢基团的硅烷偶联剂和（b）具有橡胶状聚合物的核心层和玻璃状聚合物的壳层的具有可与异氰酸酯基团反应的活性氢基团的核壳乳液 在芯层和/或壳层中。
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2.发明授权Ceramic chip-type electronic component with electrode covering resin and method of making the same 有权具有电极覆盖树脂的陶瓷片式电子元件及其制造方法公开(公告)号：US07362559B2
公开(公告)日：2008-04-22
申请号：US11401509
申请日：2006-04-11
申请人： Yukio Tominaga
发明人： Yukio Tominaga
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A chip-type electronic component includes a ceramic chip body incorporating an element, an external electrode formed on a side surface of the chip body, a conductive elastic resin film which is larger in width than the external electrode and formed to cover the external electrode and extend onto part of a mount surface of the chip body, and a metal plating film for soldering formed on the conductive elastic resin film.
摘要翻译： 芯片型电子部件包括：陶瓷芯片体，其包括元件;外部电极，形成在芯片主体的侧面;导电性弹性树脂膜，其宽度大于外部电极，形成为覆盖外部电极; 延伸到芯片主体的安装表面的一部分上，以及形成在导电性弹性树脂膜上的用于焊接的金属镀膜。
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3.发明申请Dielectric porcelain composition, multilayer ceramic capacitor, and electronic component 有权介电陶瓷组合物，多层陶瓷电容器和电子元器件公开(公告)号：US20060240973A1
公开(公告)日：2006-10-26
申请号：US10568157
申请日：2004-08-11
CPC分类号： C22C9/00 , C04B35/468 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3239 , C04B2235/3241 , C04B2235/3262 , C04B2235/3287 , C04B2235/3418 , C04B2235/80 , H01B3/12 , H01G4/1227
摘要： A dielectric ceramic composition of the present invention includes 100 parts by mole of BaTiO3, x1 parts by mole of MnO, x2 parts by mole of Cr2O3, x3 parts by mole of Y2O3 and/or Ho2O3, x4 parts by mole of oxide selected from the group consisting of BaO, CaO and SrO, and x5 parts by mole of SiO2 and/or GeO2, where 0.5≦x1≦4.5, 0.05≦x2≦1.0, x1+x2≦4.55, 0.25≦x3≦1.5, 0.5 ≦x4≦6 and 0.5≦x5≦6. A multilayer ceramic capacitor of the present invention includes a laminated structure of a ceramic dielectric made of such a composition and an electrode made of Ni or Ni alloy.
摘要翻译： 本发明的电介质陶瓷组合物包含100份摩尔的BaTiO 3 N 3，X 1分子摩尔的MnO，x2分子由 摩尔的Cr 2 O 3 3，X 3摩尔的Y 2 O 3 3， 和/或Ho 2 O 3，x 4份（摩尔）选自BaO，CaO和SrO的氧化物， 和x 5分子摩尔的SiO 2和/或GeO 2 2，其中0.5 <= X <1 < = 4.5,0.05 <= X 2 <= 1.0，X 1 + x 2 <= 4.55，0.25 <= X 3 = 1.5，0.5 <= X 4 <= 6和0.5 <= X 5 <= 6。 本发明的多层陶瓷电容器包括由这种组成的陶瓷电介质和由Ni或Ni合金制成的电极的叠层结构。
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4.发明申请Ceramic chip-type electronic component with electrode covering resin and method of making the same 有权具有电极覆盖树脂的陶瓷片式电子元件及其制造方法公开(公告)号：US20060238948A1
公开(公告)日：2006-10-26
申请号：US11401509
申请日：2006-04-11
申请人： Yukio Tominaga
发明人： Yukio Tominaga
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A chip-type electronic component includes a ceramic chip body incorporating an element, an external electrode formed on a side surface of the chip body, a conductive elastic resin film which is larger in width than the external electrode and formed to cover the external electrode and extend onto part of a mount surface of the chip body, and a metal plating film for soldering formed on the conductive elastic resin film.
摘要翻译： 芯片型电子部件包括：陶瓷芯片体，其包括元件;外部电极，形成在芯片主体的侧面;导电性弹性树脂膜，其宽度大于外部电极，形成为覆盖外部电极; 延伸到芯片主体的安装表面的一部分上，以及形成在导电性弹性树脂膜上的用于焊接的金属镀膜。
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公开(公告)号：US07397118B2
公开(公告)日：2008-07-08
申请号：US11403741
申请日：2006-04-13
申请人： Yukio Tominaga
发明人： Yukio Tominaga
CPC分类号： H01G4/30 , H01G4/2325
摘要： A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. The metal powder is exposed at an obverse surface of the conductive elastic resin film. The metal plating film is formed on the obverse surface of the conductive elastic resin film at which the metal powder is exposed.
摘要翻译： 芯片型电子部件包括陶瓷芯片体，形成在芯片体上的外部电极，由金属粉末和弹性树脂的混合物构成并形成为覆盖外部电极的导电性弹性树脂膜和金属镀膜。 金属粉末在导电性弹性树脂膜的正面露出。 金属电镀膜形成在导电性弹性树脂膜的暴露金属粉末的正面上。
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6.发明授权Dielectric porcelain composition, multilayer ceramic capacitor, and electronic component 有权介电陶瓷组合物，多层陶瓷电容器和电子元器件公开(公告)号：US07351676B2
公开(公告)日：2008-04-01
申请号：US10568157
申请日：2004-08-11
IPC分类号： C04B35/46
CPC分类号： C22C9/00 , C04B35/468 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3239 , C04B2235/3241 , C04B2235/3262 , C04B2235/3287 , C04B2235/3418 , C04B2235/80 , H01B3/12 , H01G4/1227
摘要： A dielectric ceramic composition of the present invention includes 100 parts by mole of BaTiO3, x1 parts by mole of MnO, x2 parts by mole of Cr2O3, x3 parts by mole of Y2O3 and/or Ho2O3, x4 parts by mole of oxide selected from the group consisting of BaO, CaO and SrO, and x5 parts by mole of SiO2 and/or GeO2, where 0.5≦x1≦4.5, 0.05≦x2≦1.0, x1+x2≦4.55, 0.25≦x3≦1.5, 0.5 ≦x4≦6 and 0.5≦x5≦6. A multilayer ceramic capacitor of the present invention includes a laminated structure of a ceramic dielectric made of such a composition and an electrode made of Ni or Ni alloy.
摘要翻译： 本发明的电介质陶瓷组合物包含100份摩尔的BaTiO 3 N 3，X 1分子摩尔的MnO，x2分子由 摩尔的Cr 2 O 3 3，X 3摩尔的Y 2 O 3 3， 和/或Ho 2 O 3，x 4份（摩尔）选自BaO，CaO和SrO的氧化物， 和x 5分子摩尔的SiO 2和/或GeO 2 2，其中0.5 <= X <1 < = 4.5,0.05 <= X 2 <= 1.0，X 1 + x 2 <= 4.55，0.25 <= X 3 = 1.5，0.5 <= X 4 <= 6和0.5 <= X 5 <= 6。 本发明的多层陶瓷电容器包括由这种组成的陶瓷电介质和由Ni或Ni合金制成的电极的叠层结构。
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公开(公告)号：US5424433A
公开(公告)日：1995-06-13
申请号：US260800
申请日：1994-06-16
申请人： Kazunori Ohno , Osamu Odai , Yukio Tominaga , Kiyoshi Furukawa , Makoto Oka
发明人： Kazunori Ohno , Osamu Odai , Yukio Tominaga , Kiyoshi Furukawa , Makoto Oka
IPC分类号： A61K31/4245 , A61K31/435 , A61K31/4375 , C07D271/02 , C07D271/06 , C07D271/10 , C07D471/04
CPC分类号： C07D471/04
摘要： 3-Oxadiazolyl-5,6,7,8-tetrahydro-1,6-naphthyridine derivative of the formula (I): ##STR1## wherein Het is an oxadiazole ring, R.sub.1 is hydrogen atom, an acyl group, a lower alkyl group or a group of the formula: --CH.sub.2 R.sub.1' (in which R.sub.1' is a cyclo-lower alkyl group, a lower alkenyl group, a lower alkynyl group, benzyl group, aryl group or a heteroaromatic group), R.sub.2 is a lower alkyl group, a cyclo-lower alkyl group, a lower alkenyl group, a lower alkynyl group, aryl group, a heteroaromatic group, a halogeno-lower alkyl group, a lower alkoxy-lower alkyl group, a lower alkoxy group, a lower alkenyloxy group, a phenoxy group or a lower alkylthio group, or a pharmaceutically acceptable acid addition salt thereof, which are useful as benzodiazepine receptor agonist.
摘要翻译： 式（I）的3-恶二唑基-5,6,7,8-四氢-1,6-萘啶衍生物：其中Het是恶二唑环，R 1是氢原子，酰基， 低级烷基或式-CH 2 R 1'（其中R 1'为环低级烷基，低级烯基，低级炔基，苄基，芳基或杂芳族基团）的基团，R 2为 低级烷基，低级烷基，低级烯基，低级炔基，芳基，杂芳基，卤代低级烷基，低级烷氧基 - 低级烷基，低级烷氧基，低级烷基 烯氧基，苯氧基或低级烷硫基，或其药学上可接受的酸加成盐，可用作苯并二氮杂受体激动剂。
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公开(公告)号：US20060256495A1
公开(公告)日：2006-11-16
申请号：US11403741
申请日：2006-04-13
申请人： Yukio Tominaga
发明人： Yukio Tominaga
IPC分类号： H02H9/06
CPC分类号： H01G4/30 , H01G4/2325
摘要： A chip-type electronic component includes a ceramic chip body, an external electrode formed on the chip body, a conductive elastic resin film made of a mixture of metal powder and elastic resin and formed to cover the external electrode, and a metal plating film. The metal powder is exposed at an obverse surface of the conductive elastic resin film. The metal plating film is formed on the obverse surface of the conductive elastic resin film at which the metal powder is exposed.
摘要翻译： 芯片型电子部件包括陶瓷芯片体，形成在芯片体上的外部电极，由金属粉末和弹性树脂的混合物构成并形成为覆盖外部电极的导电性弹性树脂膜和金属镀膜。 金属粉末在导电性弹性树脂膜的表面露出。 金属电镀膜形成在导电性弹性树脂膜的暴露金属粉末的正面上。
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9.发明授权Bicyclic amino group-substituted pyridonecarboxylic acid derivatives, esters thereof and salts thereof, and bicyclic amines useful as intermediates thereof 失效双环氨基取代的吡啶酮羧酸衍生物，其酯及其盐，以及可用作其中间体的双环胺
公开(公告)号：US5990106A
公开(公告)日：1999-11-23
申请号：US875728
申请日：1997-08-04
申请人： Masato Sakamoto , Katsumi Chiba , Yukio Tominaga , Akira Minami
发明人： Masato Sakamoto , Katsumi Chiba , Yukio Tominaga , Akira Minami
IPC分类号： A61K31/435 , A61K31/44 , A61K31/47 , A61K31/535 , B01D39/16 , B01D47/02 , B01D47/06 , B01D50/00 , B01D53/04 , B01D53/14 , B01J20/28 , B60H3/06 , C07D209/52 , C07D401/04 , C07D471/04 , C07D498/06 , A61K31/40
CPC分类号： C07D209/52 , B01D39/1623 , B01D47/02 , B01D50/006 , B01D53/0407 , B01D53/14 , B01J20/28014 , B01J20/28021 , B01J20/28023 , B60H3/06 , B60H3/0633 , B60H3/0658 , C07D401/04 , C07D471/04 , B60H2003/0691 , Y02P20/55
摘要： This invention relates to bicyclic amino group-substituted pyridonecarboxylic acid derivatives of the general formulaA--Priesters thereof and salts thereof, wherein: Pri is a pyridonecarboxylic acid residue, and A is a bicyclic amino group represented by the following formula and joined to the 7-position of the pyridonecarboxylic acid or a position equivalent to the 7-position thereof. ##STR1## wherein R.sub.1 and R.sub.2 may be the same or different and each represents a hydrogen atom, a lower alkyl group or an amino-protecting group; R.sub.3 and R.sub.4 may be the same or different and each represents a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, an oxo group, a lower alkoxy group or a lower alkyl group; and n is an integer of 0 or 1.The above-described pyridonecarboxylic acid derivatives, esters thereof and salts thereof are useful as antibacterial agents.This invention also relates to bicyclic amine compounds useful as direct intermediates for the synthesis of the above-described pyridonecarboxylic acid derivatives.
摘要翻译： PCT No.PCT / JP95 / 00135 Sec。 371日期：1997年8月4日 102（e）日期1997年8月4日PCT提交1995年2月2日PCT公布。 WO95 / 21163 PCT出版物 日本特开1995年8月10日本发明涉及通式A-二酯的双环氨基取代吡啶并羧酸衍生物及其盐，其中：Pri为吡啶酮羧酸残基，A为由下式表示的双环氨基， 连接到吡啶酮羧酸的7-位或与其7-位相当的位置。 其中R1和R2可以相同或不同，并且各自表示氢原子，低级烷基或氨基保护基; R 3和R 4可以相同或不同，各自表示氢原子，卤素原子，氰基，羟基，氧代基，低级烷氧基或低级烷基。 并且n为0或1的整数。上述吡啶酮羧酸衍生物，其酯及其盐可用作抗菌剂。 本发明还涉及可用作合成上述吡啶酮羧酸衍生物的直接中间体的双环胺化合物。
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公开(公告)号：US5424434A
公开(公告)日：1995-06-13
申请号：US260835
申请日：1994-06-16
申请人： Kazunori Ohno , Osamu Odai , Yukio Tominaga , Kiyoshi Furukawa , Makoto Oka
发明人： Kazunori Ohno , Osamu Odai , Yukio Tominaga , Kiyoshi Furukawa , Makoto Oka
IPC分类号： A61K31/4245 , A61K31/435 , A61K31/4375 , C07D271/02 , C07D271/06 , C07D271/10 , C07D471/04
CPC分类号： C07D471/04
摘要： 3-Oxadiazolyl-5,6,7,8-tetrahydro-1,6-naphthyridine derivative of the formula (I): ##STR1## wherein Het is an oxadiazole ring, R.sub.1 is hydrogen atom, an acyl group, a lower alkyl group or a group of the formula: --CH.sub.2 R.sub.1 ' (in which R.sub.1 ' is a cyclo-lower alkyl group, a lower alkenyl group, a lower alkynyl group, benzyl group, aryl group or a heteroaromatic group), R.sub.2 is a lower alkyl group, a cyclo-lower alkyl group, a lower alkenyl group, a lower alkynyl group, aryl group, a heteroaromatic group, a halogeno-lower alkyl group, a lower alkoxy-lower alkyl group, a lower alkoxy group, a lower alkenyloxy group, a phenoxy group or a lower alkylthio group, or a pharmaceutically acceptable acid addition salt thereof, which are useful as benzodiazepine receptor agonist.
摘要翻译： 式（I）的3-恶二唑基-5,6,7,8-四氢-1,6-萘啶衍生物：其中Het是恶二唑环，R 1是氢原子，酰基， 低级烷基或式-CH 2 R 1'（其中R 1'为环低级烷基，低级烯基，低级炔基，苄基，芳基或杂芳族基团）的基团，R 2为 低级烷基，低级烷基，低级烯基，低级炔基，芳基，杂芳基，卤代低级烷基，低级烷氧基 - 低级烷基，低级烷氧基，低级烷基 烯氧基，苯氧基或低级烷硫基，或其药学上可接受的酸加成盐，可用作苯并二氮杂受体激动剂。
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