公开(公告)号：US08143668B2

公开(公告)日：2012-03-27

申请号：US12481551

申请日：2009-06-09

申请人： Yusuke Morita ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Nobuyuki Sugii ,  Shinichiro Kimura

发明人： Yusuke Morita ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Nobuyuki Sugii ,  Shinichiro Kimura

IPC分类号： H01L29/78

CPC分类号： H01L21/823814 ,  H01L21/823828 ,  H01L21/823864

摘要： Performance of a semiconductor device having a MIS transistor is improved. A semiconductor device includes: a pair of source/drain regions each formed by stacking a semiconductor layer on a main surface of a silicon substrate; a sidewall insulating film covering each sidewall of the source/drain regions; a gate electrode arranged so as to interpose a gate insulating film on the main surface of the silicon substrate at a position sandwiched by the sidewall insulating films in a plane; and extension regions formed to extend from a portion below and lateral to the gate electrode to a portion below and lateral to each of the source/drain regions, wherein a sidewall of the sidewall insulating film being adjacent to the gate insulating film and the gate electrode has an inclination of a forward tapered shape.

摘要翻译： 提高了具有MIS晶体管的半导体器件的性能。 半导体器件包括：一对源极/漏极区域，每个源极/漏极区域通过在硅衬底的主表面上层叠半导体层而形成; 覆盖源极/漏极区域的每个侧壁的侧壁绝缘膜; 栅电极，被布置成在平面内被所述侧壁绝缘膜夹持的位置处在所述硅衬底的主表面上插入栅极绝缘膜; 以及延伸区域，其形成为从栅极电极下方和横向的部分延伸到每个源极/漏极区域的下方和侧面的部分，其中侧壁绝缘膜的侧壁与栅极绝缘膜和栅极电极相邻 具有向前锥形的倾斜。

公开(公告)号：US20120061774A1

公开(公告)日：2012-03-15

申请号：US13299471

申请日：2011-11-18

申请人： Yusuke Morita ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Nobuyuki Sugii ,  Shinichiro Kimura

发明人： Yusuke Morita ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Nobuyuki Sugii ,  Shinichiro Kimura

IPC分类号： H01L29/78

CPC分类号： H01L21/823814 ,  H01L21/823828 ,  H01L21/823864

摘要： Performance of a semiconductor device having a MIS transistor is improved. A semiconductor device includes: a pair of source/drain regions each formed by stacking a semiconductor layer on a main surface of a silicon substrate; a sidewall insulating film covering each sidewall of the source/drain regions; a gate electrode arranged so as to interpose a gate insulating film on the main surface of the silicon substrate at a position sandwiched by the sidewall insulating films in a plane; and extension regions formed to extend from a portion below and lateral to the gate electrode to a portion below and lateral to each of the source/drain regions, wherein a sidewall of the sidewall insulating film being adjacent to the gate insulating film and the gate electrode has an inclination of a forward tapered shape.

摘要翻译： 提高了具有MIS晶体管的半导体器件的性能。 半导体器件包括：一对源极/漏极区域，每个源极/漏极区域通过在硅衬底的主表面上层叠半导体层而形成; 覆盖源极/漏极区域的每个侧壁的侧壁绝缘膜; 栅电极，被布置成在平面内被所述侧壁绝缘膜夹持的位置处在所述硅衬底的主表面上插入栅极绝缘膜; 以及延伸区域，其形成为从栅极电极下方和横向的部分延伸到每个源极/漏极区域的下方和侧面的部分，其中侧壁绝缘膜的侧壁与栅极绝缘膜和栅极电极相邻 具有向前锥形的倾斜。

公开(公告)号：US20120018807A1

公开(公告)日：2012-01-26

申请号：US13145108

申请日：2010-01-18

申请人： Ryuta Tsuchiya ,  Nobuyuki Sugii ,  Yusuke Morita ,  Hiroyuki Yoshimoto ,  Takashi Ishigaki ,  Shinichiro Kimura

发明人： Ryuta Tsuchiya ,  Nobuyuki Sugii ,  Yusuke Morita ,  Hiroyuki Yoshimoto ,  Takashi Ishigaki ,  Shinichiro Kimura

IPC分类号： H01L27/12 ,  B82Y99/00

CPC分类号： H01L21/84 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/665 ,  H01L29/78648

摘要： In an SOI-MISFET that operates with low power consumption at a high speed, an element area is reduced. While a diffusion layer region of an N-conductivity type MISFET region of the SOI type MISFET and a diffusion layer region of a P-conductivity type MISFET region of the SOI type MISFET are formed as a common region, well diffusion layers that apply substrate potentials to the N-conductivity type MISFET region and the P-conductivity type MISFET region are separated from each other by an STI layer. The diffusion layer regions that are located in the N- and P-conductivity type MISFET regions) and serve as an output portion of a CMISFET are formed as a common region and directly connected by silicified metal so that the element area is reduced.

摘要翻译： 在以高功率低功耗工作的SOI-MISFET中，元件面积减小。 虽然SOI型MISFET的N导电型MISFET区域的扩散层区域和SOI型MISFET的P导电型MISFET区域的扩散层区域形成为公共区域，但是施加衬底电位的阱扩散层 通过STI层将N导电型MISFET区域和P导电型MISFET区域相互分离。 位于N和P导电型MISFET区域中的扩散层区域）作为CMISFET的输出部分形成为公共区域，并通过硅化金属直接连接，使元件面积减小。

公开(公告)号：US08183635B2

公开(公告)日：2012-05-22

申请号：US12756451

申请日：2010-04-08

申请人： Nobuyuki Sugii ,  Ryuta Tsuchiya ,  Shinichiro Kimura ,  Takashi Ishigaki ,  Yusuke Morita ,  Hiroyuki Yoshimoto

发明人： Nobuyuki Sugii ,  Ryuta Tsuchiya ,  Shinichiro Kimura ,  Takashi Ishigaki ,  Yusuke Morita ,  Hiroyuki Yoshimoto

IPC分类号： H01L21/00

CPC分类号： H01L27/1203 ,  H01L21/76283

摘要： A technique to be applied to a semiconductor device for achieving low power consumption by improving a shape at a boundary portion of a shallow trench and an SOI layer of an SOI substrate. A position (SOI edge) at which a main surface of a silicon substrate and a line extended along a side surface of an SOI layer are crossed is recessed away from a shallow-trench isolation more than a position (STI edge) at which a line extended along a sidewall of a shallow trench and a line extended along the main surface of the silicon substrate are crossed, and a corner of the silicon substrate at the STI edge has a curved surface.

摘要翻译： 通过改善在SOI衬底的浅沟槽和SOI层的边界部分的形状来实现低功耗的半导体器件的技术。 硅衬底的主表面和沿着SOI层的侧表面延伸的线交叉的位置（SOI边缘）比浅沟槽隔离更远离位于（STI边缘）的位置（STI边缘），在该位置处 沿着浅沟槽的侧壁延伸并且沿着硅衬底的主表面延伸的线交叉，并且在STI边缘处的硅衬底的拐角具有弯曲表面。

公开(公告)号：US08643117B2

公开(公告)日：2014-02-04

申请号：US13145108

申请日：2010-01-18

申请人： Ryuta Tsuchiya ,  Nobuyuki Sugii ,  Yusuke Morita ,  Hiroyuki Yoshimoto ,  Takashi Ishigaki ,  Shinichiro Kimura

发明人： Ryuta Tsuchiya ,  Nobuyuki Sugii ,  Yusuke Morita ,  Hiroyuki Yoshimoto ,  Takashi Ishigaki ,  Shinichiro Kimura

IPC分类号： H01L21/70

CPC分类号： H01L21/84 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/665 ,  H01L29/78648

摘要： In an SOI-MISFET that operates with low power consumption at a high speed, an element area is reduced. While a diffusion layer region of an N-conductivity type MISFET region of the SOI type MISFET and a diffusion layer region of a P-conductivity type MISFET region of the SOI type MISFET are formed as a common region, well diffusion layers that apply substrate potentials to the N-conductivity type MISFET region and the P-conductivity type MISFET region are separated from each other by an STI layer. The diffusion layer regions that are located in the N- and P-conductivity type MISFET regions) and serve as an output portion of a CMISFET are formed as a common region and directly connected by silicified metal so that the element area is reduced.

摘要翻译： 在以高功率低功耗工作的SOI-MISFET中，元件面积减小。 虽然SOI型MISFET的N导电型MISFET区域的扩散层区域和SOI型MISFET的P导电型MISFET区域的扩散层区域形成为公共区域，但是施加衬底电位的阱扩散层 通过STI层将N导电型MISFET区域和P导电型MISFET区域相互分离。 位于N和P导电型MISFET区域中的扩散层区域）作为CMISFET的输出部分形成为公共区域，并通过硅化金属直接连接，使元件面积减小。

公开(公告)号：US20090096036A1

公开(公告)日：2009-04-16

申请号：US12248250

申请日：2008-10-09

申请人： Takashi ISHIGAKI ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii ,  Shinichiro Kimura ,  Toshiaki Iwamatsu

发明人： Takashi ISHIGAKI ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii ,  Shinichiro Kimura ,  Toshiaki Iwamatsu

IPC分类号： H01L27/088 ,  H01L21/8234

CPC分类号： H01L21/84 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/76283 ,  H01L21/823418 ,  H01L21/823481 ,  H01L21/823814 ,  H01L21/823878 ,  H01L27/1203 ,  H01L27/1207

摘要： There is provided an SOI-MISFET including: an SOI layer; a gate electrode provided on the SOI layer interposing a gate insulator; and a first elevated layer provided higher in height from the SOI layer than the gate electrode at both sidewall sides of the gate electrode on the SOI layer so as to constitute a source and drain. Further, there is also provided a bulk-MISFET including: a gate electrode provided on a silicon substrate interposing a gate insulator thicker than the gate insulator of the SOI MISFET; and a second elevated layer configuring a source and drain provided on a semiconductor substrate at both sidewalls of the gate electrode. A the first elevated layer is thicker than the elevated layer, and the whole of the gate electrodes, part of the source and drain of the SOI-MISFET, and part of the source and drain of the bulk-MISFET are silicided.

摘要翻译： 提供了SOI-MISFET，其包括：SOI层; 设置在插入栅极绝缘体的SOI层上的栅电极; 以及第一升高层，其在SOI层上的栅电极的两个侧壁侧的SOI层高于栅电极，从而构成源极和漏极。 此外，还提供了一种体MISFET，包括：设置在硅衬底上的栅电极，其插入比SOI MISFET的栅极绝缘体更厚的栅极绝缘体; 以及构造在栅电极的两个侧壁处设置在半导体衬底上的源极和漏极的第二升高层。 第一升高层比升高的层厚，并且整个栅电极，SOI-MISFET的源极和漏极的一部分以及体MISFET的源极和漏极的一部分被硅化。

公开(公告)号：US08183115B2

公开(公告)日：2012-05-22

申请号：US13088020

申请日：2011-04-15

申请人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii ,  Shinichiro Kimura ,  Toshiaki Iwamatsu

发明人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii ,  Shinichiro Kimura ,  Toshiaki Iwamatsu

IPC分类号： H01L21/8234

CPC分类号： H01L21/84 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/76283 ,  H01L21/823418 ,  H01L21/823481 ,  H01L21/823814 ,  H01L21/823878 ,  H01L27/1203 ,  H01L27/1207

摘要： There is provided an SOI-MISFET including: an SOI layer; a gate electrode provided on the SOI layer interposing a gate insulator; and a first elevated layer provided higher in height from the SOI layer than the gate electrode at both sidewall sides of the gate electrode on the SOI layer so as to constitute a source and drain. Further, there is also provided a bulk-MISFET including: a gate electrode provided on a silicon substrate interposing a gate insulator thicker than the gate insulator of the SOI MISFET; and a second elevated layer configuring a source and drain provided on a semiconductor substrate at both sidewalls of the gate electrode. The first elevated layer is thicker than the second elevated layer, and the whole of the gate electrodes, part of the source and drain of the SOI-MISFET, and part of the source and drain of the bulk-MISFET are silicided.

摘要翻译： 提供了SOI-MISFET，其包括：SOI层; 设置在插入栅极绝缘体的SOI层上的栅电极; 以及第一升高层，其在SOI层上的栅电极的两个侧壁侧的SOI层高于栅电极，从而构成源极和漏极。 此外，还提供了一种体MISFET，包括：设置在硅衬底上的栅电极，其插入比SOI MISFET的栅极绝缘体更厚的栅极绝缘体; 以及构造在所述栅电极的两个侧壁处设置在半导体衬底上的源极和漏极的第二升高层。 第一升高层比第二升高层厚，并且整个栅电极，SOI-MISFET的源极和漏极的一部分以及体MISFET的源极和漏极的一部分被硅化。

公开(公告)号：US20100258869A1

公开(公告)日：2010-10-14

申请号：US12757090

申请日：2010-04-09

申请人： Yusuke MORITA ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Hiroyuki Yoshimoto ,  Nobuyuki Sugii ,  Shinichiro Kimura

发明人： Yusuke MORITA ,  Ryuta Tsuchiya ,  Takashi Ishigaki ,  Hiroyuki Yoshimoto ,  Nobuyuki Sugii ,  Shinichiro Kimura

IPC分类号： H01L27/12 ,  H01L21/336

CPC分类号： H01L21/76283 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203

摘要： An n well and a p well disposed at a predetermined interval on a main surface of a SOI substrate with a thin BOX layer are formed, and an nMIS formed on the p well has a pair of n-type source/drain regions formed on semiconductor layers stacked on a main surface of the SOI layer at a predetermined distance, a gate insulating film, a gate electrode and sidewalls sandwiched between the pair of n-type source/drain regions. A device isolation is formed between the n well and the p well, and a side edge portion of the device isolation extends toward a gate electrode side more than a side edge portion of the n-type source/drain region (sidewall of the BOX layer).

摘要翻译： 形成在具有薄BOX层的SOI衬底的主表面上以预定间隔布置的n阱和p阱，并且在p阱上形成的nMIS具有形成在半导体层上的一对n型源极/漏极区 堆叠在SOI层的主表面上，预定距离处，栅极绝缘膜，栅电极和夹在该对n型源极/漏极区之间的侧壁。 在n阱和p阱之间形成器件隔离，并且器件隔离的侧边缘部分比n型源极/漏极区域的侧边缘部分（BOX层的侧壁）朝向栅电极侧延伸 ）。

公开(公告)号：US20100258871A1

公开(公告)日：2010-10-14

申请号：US12759559

申请日：2010-04-13

申请人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii

发明人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/785 ,  H01L29/66795

摘要： Characteristics of a semiconductor device having a FINFET are improved. The FINFET has: a channel layer arranged in an arch shape on a semiconductor substrate and formed of monocrystalline silicon; a front gate electrode formed on a part of an outside of the channel layer through a front gate insulating film; and a back gate electrode formed so as to be buried inside the channel layer through a back gate insulating film. The back gate electrode arranged inside the arch shape is arranged so as to pass through the front gate electrode.

摘要翻译： 具有FINFET的半导体器件的特性得到改善。 FINFET具有：在半导体衬底上以拱形形式布置并由单晶硅形成的沟道层; 前栅电极，其通过前栅极绝缘膜形成在沟道层的外部的一部分上; 以及形成为通过背栅绝缘膜埋设在沟道层内的背栅电极。 布置在拱形内侧的背栅极布置成穿过前栅电极。

公开(公告)号：US08350328B2

公开(公告)日：2013-01-08

申请号：US12759559

申请日：2010-04-13

申请人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii

发明人： Takashi Ishigaki ,  Ryuta Tsuchiya ,  Yusuke Morita ,  Nobuyuki Sugii

IPC分类号： H01L29/76

CPC分类号： H01L29/785 ,  H01L29/66795

摘要： Characteristics of a semiconductor device having a FINFET are improved. The FINFET has: a channel layer arranged in an arch shape on a semiconductor substrate and formed of monocrystalline silicon; a front gate electrode formed on a part of an outside of the channel layer through a front gate insulating film; and a back gate electrode formed so as to be buried inside the channel layer through a back gate insulating film. The back gate electrode arranged inside the arch shape is arranged so as to pass through the front gate electrode.

摘要翻译： 具有FINFET的半导体器件的特性得到改善。 FINFET具有：在半导体衬底上以拱形形式布置并由单晶硅形成的沟道层; 前栅电极，其通过前栅极绝缘膜形成在沟道层的外部的一部分上; 以及形成为通过背栅绝缘膜埋设在沟道层内的背栅电极。 布置在拱形内侧的背栅极布置成穿过前栅电极。