公开(公告)号：US20230420598A1

公开(公告)日：2023-12-28

申请号：US17885802

申请日：2022-08-11

申请人： JINKO SOLAR CO., LTD. ,  ZHEJIANG JINKO SOLAR CO., LTD.

发明人： Wusong TAO ,  Tingting LI ,  Jingyu CAO

IPC分类号： H01L31/18 ,  H01L31/0224

CPC分类号： H01L31/186 ,  H01L31/022433

摘要： Disclosed are a welding method for a photovoltaic cell and a photovoltaic module. The photovoltaic cell includes a first cell and a second cell that are adjacent to each other and welded to each other by a solder strip. The welding method includes providing a substrate of each of the first cell and the second cell, and providing a first solder layer at a preset position of the substrate where an electrode pad of the substrate is located; and lapping one end of the solder strip on the first solder layer of the first cell, lapping another end of the solder strip on the first solder layer of the second cell, and connecting the first cell and the second cell together by welding.

公开(公告)号：US20230420580A1

公开(公告)日：2023-12-28

申请号：US18163871

申请日：2023-02-02

申请人： ZHEJIANG JINKO SOLAR CO., LTD. ,  JINKO SOLAR CO., LTD.

发明人： Bike ZHANG ,  Jingsheng JIN ,  Xinyu ZHANG ,  Jingyu CAO ,  Haiyan CHENG

IPC分类号： H01L31/02 ,  H01L31/048 ,  H01L31/0224 ,  H01L31/028 ,  H01L31/0368 ,  H01L31/0376 ,  H01L31/05 ,  H01L31/068

CPC分类号： H01L31/0201 ,  H01L31/048 ,  H01L31/022433 ,  H01L31/028 ,  H01L31/03685 ,  H01L31/03762 ,  H01L31/0504 ,  H01L31/068

摘要： Embodiments of the present disclosure provide a solar cell and a photovoltaic module. The solar cell includes a substrate, a tunneling dielectric layer formed on the substrate, a doped conductive layer formed on the tunneling dielectric layer, at least one conductive connection structure, a passivation layer over the doped conductive layer and the at least one conductive connection structure, and a plurality of finger electrodes. The doped conductive layer has a plurality of protrusions arranged along a first direction, each protrusion extends along a second direction perpendicular to the first direction. The at least one conductive connection structure is formed between two adjacent protrusions and connected with sidewalls of the two adjacent protrusions. Each finger electrode of the plurality of finger electrodes extends along the second direction to penetrate the passivation layer and connect to a respective protrusion.