公开(公告)号：US20140036465A1

公开(公告)日：2014-02-06

申请号：US13863400

申请日：2013-04-16

Applicant: ZHEN DING TECHNOLOGY CO., LTD.

Inventor： CHU-CHIN HU ,  SHIH-PING HSU ,  E-TUNG CHOU

IPC: H05K1/18 ,  H05K3/40

CPC classification number: H05K1/181 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/0097 ,  H05K3/4038 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.

Abstract translation: 封装基板包括铜箔基板，溅射铜层，电介质层，多个导电连接点以及导电图案层。 在铜箔基板上形成溅射铜层。 导电连接点形成在溅射铜层的远离铜箔衬底的表面上。 电介质层夹在导电图案层和溅射铜层之间。 多个第一通孔形成在第一电介质层中。 导电图案层包括多个导电迹线和多个连接焊盘。 每个导电连接点通过第一盲通孔电连接到导电迹线。

公开(公告)号：US20140078706A1

公开(公告)日：2014-03-20

申请号：US13971854

申请日：2013-08-21

Applicant: ZHEN DING TECHNOLOGY CO., LTD.

Inventor： CHU-CHIN HU ,  SHIH-PING HSU ,  E-TUNG CHOU ,  CHIH-JEN HSIAO

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73104 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract translation: 包装基板包括支撑片，铜箔，多个连接焊盘，多个焊球，树脂层，布线层和焊料掩模层。 铜箔通过粘合片附着在支撑片材的表面上。 连接焊盘形成在铜箔上。 焊球形成在连接焊盘上。 树脂层填充焊球之间的间隙。 布线层形成在树脂层和焊球上。 焊料球的背离连接焊盘的端子部分电连接到布线层。 在布线层上形成焊料掩模层。 焊接掩模层限定暴露部分布线层的多个开口。 通过开口露出的布线层的部分作为接触垫。