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公开(公告)号：US12121943B2
公开(公告)日：2024-10-22
申请号：US17913129
申请日：2022-05-09
发明人： Bin Hua , Xunbing Zhou , Bangyong Wan , Wenxuan Li
CPC分类号： B08B9/0325 , B08B9/023 , F26B21/004 , B08B2209/032
摘要： A cleaning apparatus for a quartz tube includes a cleaning cover with an opening in a bottom, a base vertically assembled with the cleaning cover through movable inserting, a bearing table arranged in the base and holding the quartz tube, and a driving apparatus; a top of the cleaning cover has a first nozzle; a side wall of the cleaning cover vertically has multiple second nozzles; the bearing table vertically has an inner spray tube; a top and a side of the inner spray tube above the bearing table have multiple third nozzles; a rotary sealing apparatus is embedded in the base; the inner spray tube continuously and vertically penetrates through the bearing table and the rotary sealing apparatus; the driving apparatus drives the bearing table to rotate; the inner spray tube remains stationary during rotation of the bearing table.
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公开(公告)号：US12085124B2
公开(公告)日：2024-09-10
申请号：US17918223
申请日：2022-08-09
发明人： Bin Hua , Xianmiao Sun , Xinyu Shi , Wenxuan Li
IPC分类号： H01L21/67 , F16C19/36 , H01L21/673
CPC分类号： F16C19/36 , H01L21/67057 , H01L21/67326
摘要： A bearing assembly includes a bearing cantilever, a supporting assembly connected to the bearing cantilever and a first driving device, where the bearing cantilever includes a bearing portion for bearing the semiconductor apparatus accommodating device, a connecting plate and a substrate, the bearing portion being composed of a bearing plate and a bearing support that are horizontally inserted, an opening for exposing a semiconductor apparatus is formed at a bottom of the semiconductor apparatus accommodating device, the bearing plate is provided with a rotatable rotating roller located below the opening, the rotating roller makes contact with an edge of the semiconductor apparatus, and the first driving device drives the rotating roller to rotate by means of a power transmission member, so as to apply a rotating force by means of the rotating roller, to an edge of the semiconductor apparatus inserted into the semiconductor apparatus accommodating device.
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