公开(公告)号：US20230086746A1

公开(公告)日：2023-03-23

申请号：US17490108

申请日：2021-09-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  CHING-HSUAN LIN ,  WAN-LING HSIAO ,  REN-YU YEH

IPC: C08G73/16 ,  C07C229/60 ,  C07C41/09 ,  C07C201/12 ,  C07C227/04 ,  C08J5/18 ,  H05K1/03

Abstract: A diamine monomer compound with a structural formula of wherein n1 is an integer greater than 1, forms the basis of a dielectric material with reduced dielectric losses for improved signals transmission. A method for preparing the compound, a polyimide resin made from the compound, a flexible film, and an electronic device including the polyimide resin are also disclosed. The compound has a long but flexible even numbered carbon chain and a liquid crystal unit structure. The reduced regularity and rigidity of the molecular chain make the polyimide resin convenient for film-forming. Dimensional stability is improved, the coefficient of thermal expansion of the materials is reduced, and the materials have good mechanical and thermal properties, the electron loss factor and coefficient of thermal expansion of the materials being reduced.

公开(公告)号：US20230091989A1

公开(公告)日：2023-03-23

申请号：US17490119

申请日：2021-09-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  CHING-HSUAN LIN ,  WAN-LING HSIAO ,  REN-YU YEH

IPC: C08G73/10 ,  C08J5/18

Abstract: A diamine monomer compound with reduced dielectric losses for better integrity and stability in digital transmissions is represented by a structural formula of wherein n1 is an integer greater than 1. A method for preparing the diamine monomer compound and a polyimide resin developed therefrom are disclosed. The diamine monomer compound introduces a long even numbered carbon chain and a liquid crystal unit structure, the long even numbered carbon chain giving flexibility, which reduces the regularity and rigidity of the molecular chain and facilitates film-forming processing. Dimensional stability is improved, and the coefficient of thermal expansion of the materials is reduced, the materials have good mechanical and heat-tolerant thermal properties, the loss factor and the coefficient of thermal expansion of the materials being reduced. A flexible film of the resin and an electronic device are also disclosed.

公开(公告)号：US20190359852A1

公开(公告)日：2019-11-28

申请号：US16533932

申请日：2019-08-07

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  NAN-KUN HUANG ,  YU-WEN KAO ,  CHIA-YIN TENG ,  CHING-HSUAN LIN

IPC: C09D179/08 ,  C08G73/10 ,  C08L63/00

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

公开(公告)号：US20180201805A1

公开(公告)日：2018-07-19

申请号：US15689166

申请日：2017-08-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  NAN-KUN HUANG ,  YU-WEN KAO ,  CHIA-YIN TENG ,  CHING-HSUAN LIN

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

CPC classification number: C09D179/08 ,  C08G73/101 ,  C08G73/1028 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08L63/00 ,  C08L2203/202 ,  C08K7/22

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.