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    Cooling integrated circuits using a cold plate with two phase thin film evaporation
    5.
    发明授权
    Cooling integrated circuits using a cold plate with two phase thin film evaporation 有权
    冷却集成电路采用冷板两相薄膜蒸发

    公开(公告)号：US07265979B2

    公开(公告)日：2007-09-04

    申请号：US10876399

    申请日：2004-06-24

    申请人： Hakan Erturk ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Ioan Sauciuc

    IPC分类号： H05K7/20 ,  H01L23/473

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H05K7/20363 ,  H01L2924/00

    摘要： A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

    摘要翻译： 一种用于冷却半导体电子器件的微通道冷板，其可包括与冷却通道中的液体接触的半透壁。 冷板又可能与集成电路接触。 冷却液通过冷板，开始在微通道内部沸腾。 该壁允许气泡通过，同时防止液体通过。 结果，气泡可以通过向上的浮力从液体流中去除。 在一些实施例中，去除气泡改善了冷板的操作。

    Heat dissipating device with enhanced boiling/condensation structure
    6.
    发明授权
    Heat dissipating device with enhanced boiling/condensation structure 有权
    具有较高沸点/冷凝结构的散热装置

    公开(公告)号：US07353860B2

    公开(公告)日：2008-04-08

    申请号：US10870201

    申请日：2004-06-16

    申请人： Hakan Erturk ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Ioan Sauciuc

    IPC分类号： F28D15/00 ,  H05K7/20 ,  H01L23/34

    CPC分类号： F28D15/046 ,  F28D15/043 ,  F28F13/187 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

    摘要翻译： 散热装置 所述散热装置包括放置在产生热量的装置上的接收板，与所述接收板连接的蒸发器，与所述蒸发器流体连通的冷凝器柱以及从所述冷凝器延伸的一组冷凝器延伸表面。 蒸发器包括调制多孔层并储存液体。 冷凝器柱包括非润湿表面。 冷凝器延伸表面有助于散热。

    Heat dissipating device with enhanced boiling/condensation structure
    7.
    发明申请
    Heat dissipating device with enhanced boiling/condensation structure 有权
    具有较高沸点/冷凝结构的散热装置

    公开(公告)号：US20070035927A1

    公开(公告)日：2007-02-15

    申请号：US11582626

    申请日：2006-10-17

    申请人： Hakan Erturk ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Ioan Sauciuc

    IPC分类号： H05K7/20

    CPC分类号： F28D15/046 ,  F28D15/043 ,  F28F13/187 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

    摘要翻译： 散热装置 所述散热装置包括放置在产生热量的装置上的接收板，与所述接收板连接的蒸发器，与所述蒸发器流体连通的冷凝器柱以及从所述冷凝器延伸的一组冷凝器延伸表面。 蒸发器包括调制多孔层并储存液体。 冷凝器柱包括非润湿表面。 冷凝器延伸表面有助于散热。

    Method and system to cool memory
    8.
    发明申请
    Method and system to cool memory 有权

    公开(公告)号：US20080158812A1

    公开(公告)日：2008-07-03

    申请号：US11646065

    申请日：2006-12-27

    申请人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201

    摘要： A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

    Heat dissipating device with enhanced boiling/condensation structure
    9.
    发明申请
    Heat dissipating device with enhanced boiling/condensation structure 有权
    具有较高沸点/冷凝结构的散热装置

    公开(公告)号：US20050280996A1

    公开(公告)日：2005-12-22

    申请号：US10870201

    申请日：2004-06-16

    申请人： Hakan Erturk ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Ioan Sauciuc

    IPC分类号： F28D15/02 ,  F28D15/04 ,  F28F13/18 ,  H01L23/427 ,  H05K7/20

    CPC分类号： F28D15/046 ,  F28D15/043 ,  F28F13/187 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

    摘要翻译： 散热装置 所述散热装置包括放置在产生热量的装置上的接收板，与所述接收板连接的蒸发器，与所述蒸发器流体连通的冷凝器柱以及从所述冷凝器延伸的一组冷凝器延伸表面。 蒸发器包括调制多孔层并储存液体。 冷凝器柱包括非润湿表面。 冷凝器延伸表面有助于散热。

    Apparatus and method for cooling integrated circuit devices
    10.
    发明授权
    Apparatus and method for cooling integrated circuit devices 有权
    用于冷却集成电路器件的装置和方法

    公开(公告)号：US06917522B1

    公开(公告)日：2005-07-12

    申请号：US10747978

    申请日：2003-12-29

    申请人： Hakan Erturk ,  Ioan Sauciuc ,  Edgar J. Unrein

    发明人： Hakan Erturk ,  Ioan Sauciuc ,  Edgar J. Unrein

    IPC分类号： H01L23/427 ,  H05K7/20

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

    摘要翻译： 描述用于冷却集成电路器件的方法和装置的一些实施例。 在一个实施例中，该装置包括具有联接到热源的第一表面的蒸发器部分和耦合到远离热源的第一表面的蒸发器部分的冷凝器部分的热虹吸管。 远程热交换器耦合到热虹吸管的冷凝器。 此外，一个或多个热电元件连接在热交换器和热虹吸管的冷凝器之间。 在一个实施例中，热虹吸管的远程热交换器，热电元件和冷凝器部分位于一个机架单元（1U）服务器计算机的机架外部。