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公开(公告)号：US10352764B2
公开(公告)日：2019-07-16
申请号：US15274055
申请日：2016-09-23
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Jens Geiger , Frank Sobel , Rene Kromhof , Alberto Soppelsa , Kevin Hauser , Robert Lenart
Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
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公开(公告)号：US10908208B2
公开(公告)日：2021-02-02
申请号：US16472141
申请日：2018-01-09
Applicant: AMS SENSORS SINGAPORE PTE, LTD.
Inventor： Jens Geiger , Yeoh Ging Sheng , Kevin Hauser
Abstract: Testing apparatus operable to collect optical performance data of optoelectronic devices at different temperatures includes thermal-adjustment devices in thermal and mechanical contact with the optoelectronic devices via optoelectronic device stages. The thermal-adjustment devices can direct thermal energy to the optoelectronic devices under test without heating test targets in close proximity. Consequently, in some instances, spurious results can be avoided and rapid measurement of the optoelectronic devices different temperatures can be achieved.
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公开(公告)号：US20190324081A1
公开(公告)日：2019-10-24
申请号：US16472141
申请日：2018-01-09
Applicant: ams Sensors Singapore Pte, Ltd.
Inventor： Jens Geiger , Yeoh Ging Sheng , Kevin Hauser
Abstract: Testing apparatus operable to collect optical performance data of optoelectronic devices at different temperatures includes thermal-adjustment devices in thermal and mechanical contact with the optoelectronic devices via optoelectronic device stages. The thermal-adjustment devices can direct thermal energy to the optoelectronic devices under test without heating test targets in close proximity. Consequently, in some instances, spurious results can be avoided and rapid measurement of the optoelectronic devices different temperatures can be achieved.
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