公开(公告)号：US11996505B2

公开(公告)日：2024-05-28

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: B29C45/34 ,  B29C33/12 ,  B29C70/88 ,  B29C71/02 ,  B29C71/04 ,  B29D11/00 ,  H01L25/16 ,  H01L33/56 ,  B29C45/00 ,  B29C45/14 ,  B29K63/00 ,  B29L31/34 ,  H05K3/28

CPC classification number: H01L33/56 ,  B29C33/12 ,  B29D11/00307 ,  B29D11/00807 ,  H01L25/167 ,  B29C2045/0075 ,  B29C45/14065 ,  B29C2045/14114 ,  B29C45/14639 ,  B29C2791/006 ,  B29K2063/00 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2933/005 ,  H05K3/284

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

公开(公告)号：US20220020901A1

公开(公告)日：2022-01-20

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: H01L33/56 ,  B29D11/00 ,  H01L25/16 ,  B29C33/12 ,  H01L33/00

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).