公开(公告)号：US20240014628A1

公开(公告)日：2024-01-11

申请号：US18245185

申请日：2021-08-30

Applicant: ams-OSRAM International GmbH

Inventor： Zeljko Pajkic ,  Markus Boss ,  Michael Müller

IPC: H01S5/02315 ,  H01S5/02257 ,  H01S5/068

CPC classification number: H01S5/02315 ,  H01S5/02257 ,  H01S5/06825 ,  H01S5/183

Abstract: In a method of manufacturing a package, in particular an injection molded circuit carrier, MID, at least one injection molded cover plate forming a cavity is provided having a cover area and a perimeter defining the cover area; wherein the cover area includes an opening. Two conductive traces having a first portion on a top edge of the surround, a second portion on a side surface of the surround, and a third portion on the cover area are formed, and then an optical element is formed in the opening of the cover area. Finally, a loop-shaped interlock circuit is applied to the optical element in an edge portion between the opening and the cover area, wherein one end of the loop-shaped interlock circuit is connected to each of the first and second conductive paths.

公开(公告)号：US12078687B2

公开(公告)日：2024-09-03

申请号：US17998912

申请日：2021-05-10

Applicant: ams-OSRAM International GmbH

Inventor： Dirk Becker ,  Zeljko Pajkic ,  Thomas Kippes

IPC: G01R31/67 ,  G01R31/28

CPC classification number: G01R31/67 ,  G01R31/2879 ,  G01R31/2884

Abstract: In an embodiment a method includes providing a substrate having at least one conductor track situated thereon, applying at least one accumulation of an electrically conductive material to a surface of the conductor track, providing a carrier having at least one electrical contact, applying an electrically conductive adhesive to the at least one accumulation of the electrically conductive material and/or the at least one electrical contact and arranging the substrate and the carrier such that the accumulation of the electrically conductive material and the at least one electrical contact are situated opposite and at a distance from one another, wherein the electrically conductive adhesive forms a mechanical and electrical connection between the accumulation of the electrically conductive material and the at least one electrical contact, and wherein an interspace between the at least one accumulation of the electrically conductive material and the at least one electrical contact is filled with the electrically conductive adhesive.

公开(公告)号：US20230213595A1

公开(公告)日：2023-07-06

申请号：US17998912

申请日：2021-05-10

Applicant: ams-OSRAM International GmbH

Inventor： Dirk Becker ,  Zeljko Pajkic ,  Thomas Kippes

IPC: G01R31/67 ,  G01R31/28

CPC classification number: G01R31/67 ,  G01R31/2884 ,  G01R31/2879

Abstract: In an embodiment a method includes providing a substrate having at least one conductor track situated thereon, applying at least one accumulation of an electrically conductive material to a surface of the conductor track, providing a carrier having at least one electrical contact, applying an electrically conductive adhesive to the at least one accumulation of the electrically conductive material and/or the at least one electrical contact and arranging the substrate and the carrier such that the accumulation of the electrically conductive material and the at least one electrical contact are situated opposite and at a distance from one another, wherein the electrically conductive adhesive forms a mechanical and electrical connection between the accumulation of the electrically conductive material and the at least one electrical contact, and wherein an interspace between the at least one accumulation of the electrically conductive material and the at least one electrical contact is filled with the electrically conductive adhesive.