公开(公告)号：US11029598B2

公开(公告)日：2021-06-08

申请号：US16119464

申请日：2018-08-31

Applicant: eChem Solutions Corp.

Inventor： Tz Jin Yang ,  Ming Che Chung

IPC: G03F7/20 ,  G03F7/023 ,  G03F7/039 ,  G03F7/004 ,  C08G73/10 ,  G03F7/38 ,  G03F7/26 ,  G03F7/16 ,  G03F7/075 ,  G03F7/022

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

公开(公告)号：US09529260B1

公开(公告)日：2016-12-27

申请号：US15099493

申请日：2016-04-14

Applicant: eChem Solutions Corp.

Inventor： Che Wei Chang ,  Ming Che Chung

IPC: G03F7/023 ,  G03F7/40 ,  G03F7/022 ,  G03F7/038 ,  G03F7/16

CPC classification number: G03F7/0226 ,  G03F7/0048 ,  G03F7/022 ,  G03F7/0233 ,  G03F7/038 ,  G03F7/40

Abstract: The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.

Abstract translation: 本发明提供一种光敏绝缘树脂组合物及其绝缘膜的制造方法。 包含以下组分的光敏绝缘树脂组合物可以均匀地涂覆在基材的表面台阶上以形成完全覆盖的绝缘膜。 含有酚基的碱溶性树脂; 含醌二叠氮基的化合物; 交联剂; 沸点高于或等于130℃的高沸点溶剂; 和沸点等于或低于130℃的低沸点溶剂，其中两个高沸点溶剂和低沸点溶剂的沸点差为 范围为30℃〜100℃，高沸点溶剂与低沸点溶剂的重量比为8:92〜40:60。

公开(公告)号：US20190243241A1

公开(公告)日：2019-08-08

申请号：US16119464

申请日：2018-08-31

Applicant: eChem Solutions Corp.

Inventor： Tz Jin Yang ,  Ming Che Chung

IPC: G03F7/023 ,  G03F7/039 ,  G03F7/004 ,  C08G73/10 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/38

CPC classification number: G03F7/0233 ,  C08G73/1046 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/16 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/38

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.