公开(公告)号：US20180262163A1

公开(公告)日：2018-09-13

申请号：US15908354

申请日：2018-02-28

申请人： pSemi Corporation

发明人： Ikumi Tokuda ,  Tero Tapio Ranta ,  Keith Bargroff ,  Christopher C. Murphy ,  Robert Mark Englekirk

IPC分类号： H03F1/30 ,  H03F3/19 ,  H03F3/21

CPC分类号： H03F1/30 ,  G05F3/26 ,  H03F1/56 ,  H03F3/19 ,  H03F3/195 ,  H03F3/21 ,  H03F3/245 ,  H03F2200/129 ,  H03F2200/408 ,  H03F2200/411 ,  H03F2200/447 ,  H03F2200/451 ,  H03F2200/468 ,  H04B1/04 ,  H04B2001/0408

摘要： Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal. Another bias compensation circuit embodiment includes a temperature-sensitive element having a positive temperature coefficient (PTC) for regulating the bias signal.

公开(公告)号：US10439562B2

公开(公告)日：2019-10-08

申请号：US15908354

申请日：2018-02-28

申请人： pSemi Corporation

发明人： Ikumi Tokuda ,  Tero Tapio Ranta ,  Keith Bargroff ,  Christopher C. Murphy ,  Robert Mark Englekirk

IPC分类号： H03F1/30 ,  H03F3/19 ,  H03F3/21 ,  G05F3/26 ,  H03F1/56 ,  H03F3/195 ,  H03F3/24 ,  H04B1/04

摘要： Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal. Another bias compensation circuit embodiment includes a temperature-sensitive element having a positive temperature coefficient (PTC) for regulating the bias signal.