摘要:
The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.
摘要:
The invention provides systems and methods for cooling and lubrication of high power density electric machines with an enhanced fluid injection system. Multiple fluid flow passages may be provided within the electric machine, which may include a stator fluid flow pathway between the stator and the machine housing. The stator fluid flow pathway may comprise one or more passages which may allow a fluid to directly contact the stator and the rotor. A method for cooling the electric machine may include directing a fluid to flow through one or more passages between the stator and the housing, which may provide the opportunity to transfer heat from the stator and the rotor to the fluid, thereby cooling the stator and the rotor.
摘要:
The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.
摘要:
The invention provides systems and methods for power connection, which may be a sealed power connection. The sealed power connection may be used with an electric machine or any device that may require electrical and/or mechanical connection for power. The sealed power connection may provide an effective electrical connection while providing a robust mechanical connection. The electric machine or device may be fluid-sealed and/or fluid-cooled. The sealed power connection may provide for electrical insulation of the connection from the machine or device enclosure, and may also be sealed to provide for fluid sealing and/or internal fluid cooling of the electric machine or device, as well as fluid cooling of the connection. The sealed power connection may include a high electrical conductivity member in which a high strength insert is located. The insert may be internally threaded.
摘要:
The invention provides systems and methods for power connection, which may be a sealed power connection. The sealed power connection may be used with an electric machine or any device that may require electrical and/or mechanical connection for power. The sealed power connection may provide an effective electrical connection while providing a robust mechanical connection. The electric machine or device may be fluid-sealed and/or fluid-cooled. The sealed power connection may provide for electrical insulation of the connection from the machine or device enclosure, and may also be sealed to provide for fluid sealing and/or internal fluid cooling of the electric machine or device, as well as fluid cooling of the connection.
摘要:
The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.
摘要:
The invention provides systems and methods for cooling and lubrication of high power density electric machines with an enhanced fluid injection system. Multiple fluid flow passages may be provided within the electric machine, which may include one or more bearing fluid flow pathways and one or more rotor fluid flow pathways. The bearing fluid flow pathway may comprise one or more passages which may direct a fluid to contact one or more bearings for lubrication and cooling of the one or more bearings. The rotor fluid flow pathway may comprise one or more passages which may direct a fluid along the rotatable shaft toward the rotor and stator for cooling of the rotor and stator. The electric machine may also include a fluid flow passage leading to a junction, wherein the fluid flow pathway may split between the bearing fluid flow pathway and the rotor fluid flow pathway. Additionally, the electric machine may include a fluid flow metering device at the junction between the bearing fluid flow pathway and the rotor fluid flow pathway, wherein the metering device is configured to determine the relative amount of fluid that flows to the bearing and fluid that flows toward the rotor and stator.
摘要:
Systems and methods are provided for cooling and lubrication of high power density electric machines with an enhanced fluid injection system. Multiple fluid flow passages are within the electric machine, which include a bearing fluid flow pathway and a rotor fluid flow pathway. The bearing fluid flow pathway comprises a passage which directs fluid to contact a bearing for lubrication and cooling. The rotor fluid flow pathway comprises a passage which directs fluid along the rotatable shaft toward the rotor and stator for cooling. A fluid flow passage may lead to a junction, and may split between the bearing fluid flow pathway and the rotor fluid flow pathway. Additionally, a fluid flow metering device at the junction between the bearing fluid flow pathway and the rotor fluid flow pathway, may determine the relative amount of fluid that flows to the bearing and that flows toward the rotor and stator.
摘要:
The invention provides systems and methods for cooling and lubrication of high power density electric machines with an enhanced fluid injection system. Multiple fluid flow passages may be provided within the electric machine, which may comprise a stator fluid flow pathway, a rotor fluid flow pathway, and a bearing fluid flow pathway. The fluid within the electric machine may be used to cool and/or lubricate internal components of the electric machine.
摘要:
The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.