摘要:
A method of depositing a top clad layer for an optical waveguide of a planar lightwave circuit. A GeBPSG top clad layer for an optical waveguide structure of a planar lightwave circuit is fabricated such that the top clad layer comprises doped silica glass, wherein the dopant includes Ge (Germanium), P (Phosphorus), and B (Boron). In depositing a top clad layer for the optical waveguide, three separate doping gasses (e.g., GeH4, PH3, and B2H6) are added during the PECVD (plasma enhanced chemical vapor deposition) process to make Ge, P and B doped silica glass (GeBPSG). The ratio of the Ge, P, and B dopants is configured to reduce the formation of crystallization areas within the top clad layer and maintain a constant refractive index within the top clad layer across an anneal temperature range. A thermal anneal process for the top clad layer can be a temperature within a range of 950C to 1050C. The GeBPSG top clad layer reduces the insertion loss of passive arrayed waveguide grating devices and active planar lightwave circuit devices.
摘要:
Optical integrated circuits are disclosed having a gap traversing the lens or the waveguide grating and an actuator that controllably positions the optical integrated circuit on each side of the gap. As a result, the thermal sensitivity of the optical integrated circuits, for example, arrayed waveguide gratings, is mitigated. Also disclosed are methods for fabricating optical integrated circuits employing the gap and actuator.
摘要:
One aspect of the present invention relates to a method of dicing a substrate containing a plurality of non-rectangular shaped optical integrated circuits, involving forming stop cracks in the wafer, each stop crack adjacent and substantially parallel one of the non-rectangular shaped optical integrated circuits, and cutting the substrate in a curvilinear manner substantially parallel to a stop crack. Another aspect of the present invention relates to an optical structure containing a substrate; a plurality of non-rectangular shaped optical integrated circuits on the substrate, each non-rectangular shaped optical integrated circuit having an active region; and at least one stop crack positioned adjacent each non-rectangular shaped optical integrated circuit.
摘要:
The present invention provides an arrayed waveguide such that each waveguide of the grating has a substantially uniform width, but the width of any single waveguide in the grating is selected based on a predetermined birefringence required for the waveguide. Generally, the narrowest grating waveguide has the longest overall length and the widest grating waveguide has the shortest overall length. The remaining intermediate waveguides have widths that are interpolated between the narrowest and widest waveguide gratings. With an appropriate width for each waveguide, an arrayed waveguide grating is provided that has low polarization dependent wavelength.
摘要:
A hybrid digital electro-optic switch has core and/or cladding areas that contain at least two different materials which undergo a change in their refractive index when an electric field is applied. One of the two different materials used in core regions, for example, has a change in refractive index that is less than the change in refractive index for the other material when the materials are exposed to the same electric field. A hybrid digital electro-optic switch functions by modulating the propagation constants of the eigenmodes of the switch with a voltage-induced refractive-index change, so that the propagation constants of the two materials are equal either in the presence or absence of the electric field. These electro-optic modulations change the evanescent coupling between the waveguides of the waveguide regions of the switch and transfer an optical signal that was input into one of the waveguides to a coupled waveguide. Compared to earlier digital electro-optic switch designs, the new switch has lower switching voltage, smaller device size, a sharper optical signal transfer, and wider manufacturing and use tolerances, and the switch can use a wide array of materials in its construction. The new switch can also be integrated with both the microstrip and coplanar traveling wave electrodes for very high speed photonic switching applications.
摘要:
Polarization dependent loss may be reduced by providing at least one dummy waveguide or at least one dummy metal structure. Polarization dependent loss may also be reduced by imposing a mechanical force on the OIC to exert mechanical stress thereby changing at least one of the birefringence and the optical axes of at least one waveguide. And polarization dependent loss may be reduced by forming a metal heater using a first set of metal deposition parameters; forming a conductive metal structure contacting the metal heater using a second set of metal deposition parameters; and selecting the first set of metal deposition parameters and the second set of metal deposition parameters to reduce stress.
摘要:
Waveplate, planar lightwave circuit incorporating the waveplate, and method of making an optical device. The waveplate is formed of a mesogen-containing polymer film having a backbone and sidechains containing mesogen groups. The waveplate may be formed by producing a mesogen-containing polymer film having a nonzero birefringence of suitable dimensions for insertion into a planar lightwave circuit. The waveplate may be so inserted into an optical circuit of a planar lightwave circuit so that an optical signal traversing the waveplate is changed, for instance, to have two polarization states.
摘要:
Optical circuits are disclosed having a source waveguide, a first tap waveguide and a second tap waveguide. Optical power is transferred via evanescent coupling from the source waveguide to the first tap waveguide and from the first tap waveguide to the second tap waveguide such that power loss is minimized. Also disclosed are methods for fabricating optical integrated circuits.
摘要:
An apparatus and method to vertically route and physically pass multiple optical fibers through the walls of a package. One variation is a method to route an optical fiber ribbon through a wall of a package by routing and securing the width of the optical fiber ribbon perpendicularly to a component within the package. Another variation involves a package having an enclosure with an opening through which a group of optical fibers are arrayed in a rectangular cross-section with a width which is longer than a thickness. The package includes a component inside the enclosure, a group of optical fibers routed through the opening to the component where the width of the rectangular cross-section is perpendicularly oriented to the base of the enclosure, and a clamp to secure the width of the rectangular cross-section of the group of optical fibers perpendicularly to the base of the enclosure.
摘要:
A method of making a polarization insensitive optical waveguide structure. An optical core layer is formed on a substrate, wherein the optical core layer has a higher refractive index than the substrate. A mask is formed over the optical core layer. The unmasked areas of the optical core layer are then over-etched to define the core, wherein the over-etching removes the unmasked area of the optical core layer and a portion of the substrate disposed beneath the unmasked area, and defines the optical core. The mask is subsequently removed from the optical core. A cladding layer is then formed over the optical core and the substrate, the cladding layer having a lower refractive index than the optical core, to form a polarization insensitive optical waveguide structure. The amount of over-etching can be controlled to control an amount of substrate disposed beneath the unmasked area of the optical core layer that is removed. The amount of substrate removed, in turn, controls the polarization sensitivity of the optical waveguide structure. The amount of the portion of the substrate removed during the over-etching can be determined to minimize the polarization dependent wavelength shift and the polarization dependent loss of the optical waveguide structure. The amount of the portion of the substrate removed during the over-etching can be determined in accordance with a blanket stress of the cladding layer. The over-etching can be within a range between 7.5 percent and 30 percent.