COMPOSITION FOR FORMING PASSIVATION FILM, INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND
    1.
    发明申请
    COMPOSITION FOR FORMING PASSIVATION FILM, INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND 审中-公开
    形成钝化膜的组合物,包括具有碳碳多孔粘结剂的树脂

    公开(公告)号:US20140374887A1

    公开(公告)日:2014-12-25

    申请号:US14374668

    申请日:2013-02-08

    摘要: There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T0-O  Formula (i) (where T0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L1-O-T1-O  Formula (1)

    摘要翻译: 提供了一种用于形成钝化膜的组合物,其同时满足电绝缘性,耐热性,耐溶剂性和干蚀刻性能。 一种用于形成钝化膜的组合物,包括:含有式(ⅰ)单元结构的聚合物:式(ⅰ)(其中,T0是磺酰基,氟代亚烷基,亚环烷基或亚芳基 具有取代基的基团,或者是可以具有取代基的亚芳基和氟代亚烷基或亚环烷基的组合),其中所述聚合物具有式(2-A)结构的基团中的至少一个,基团 具有式(2-B)的结构或在聚合物的末端,侧链或主链中具有两个结构的基团:聚合物可以含有式(1)的单元结构, :L1-O-T1-O式式(1)