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公开(公告)号：US10253210B2
公开(公告)日：2019-04-09
申请号：US15512220
申请日：2015-09-01
发明人： Mamoru Tamura , Makoto Nakajima , Tomoyuki Enomoto
IPC分类号： C09D175/08 , C09D183/06 , H05K3/28 , C08G18/48 , C08G18/50 , C08G18/80
摘要： There is provided a film-forming composition for forming a film that covers a substrate and exhibits good electrical insulation properties, heat resistance, and solvent resistance after heating at a low temperature. A film-forming composition including a polymer (A) containing a unit structure of Formula (1): (wherein T1 is an arylene group or a combination of an arylene group with T0, T0 is an alkylene group, a fluorinated alkylene group, a carbonyl group, a sulfonyl group, or a combination thereof, R1 is a carboxyl group, an amino group, or an imino group, and n1 is an integer of 1 to 6), and a compound (B) having at least two isocyanate groups or blocked isocyanate groups. The polymer (A) is a polymer containing a unit structure of Formula (1) or a structure (A-1) having a combination of the unit structure of Formula (1) with a unit structure of Formula (2):
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公开(公告)号：US10208184B2
公开(公告)日：2019-02-19
申请号：US15535116
申请日：2015-12-14
发明人： Takuya Ohashi , Tetsuo Sato , Mamoru Tamura , Tomoyuki Enomoto
IPC分类号： C08K5/103 , C08K5/09 , C09J175/16 , C08L75/16 , G03F7/027 , G03F7/031 , C08G18/62 , C08G18/67 , C09J4/06 , G03F7/035
摘要： A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.
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3.发明授权公开(公告)号：US11542366B2
公开(公告)日：2023-01-03
申请号：US17070645
申请日：2020-10-14
发明人： Hiroto Ogata , Yuki Usui , Mamoru Tamura , Takahiro Kishioka
IPC分类号： C08G63/688 , G03F7/20 , G03F7/09 , H01L21/027 , C08G63/42 , C08G63/58 , G03F7/16
摘要： A method includes applying a composition for forming a resist underlayer film to a substrate having a recess in a surface, and baking the composition for forming a resist underlayer film to form a resist underlayer film for filling at least the recess. The composition for forming a resist underlayer film has a copolymer having a structural unit of following formula (1), a cross-linkable compound, a cross-linking catalyst, and a solvent: wherein R1 and R2 are each independently a C1-3 alkylene group or a single bond, Z is an —O— group, a —S— group, or a —S—S— group, and Ar is an arylene group.
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4.发明授权公开(公告)号：US10048585B2
公开(公告)日：2018-08-14
申请号：US15563752
申请日：2016-03-09
发明人： Mamoru Tamura , Tomoyuki Enomoto
IPC分类号： G03F7/11 , C08G65/40 , C09D171/00 , G03F7/038 , G03F7/039 , G03F7/40 , G03F7/023 , G03F7/16 , G03F7/20 , G03F7/32 , C08G65/48 , G03F7/075
摘要： A resin composition for forming an insulating film including a polymer having a structural unit of the following formula (1a) and a structural unit of the following formula (1b); and an organic solvent; wherein T0 is a divalent organic group containing at least one arylene group in which at least one hydrogen atom is substituted with an amino group; and T1 is a divalent organic group containing at least one arylene group having at least one substituent, wherein the substituent is a substituent of the following formula (2); and wherein Z is a divalent, aliphatic, aromatic, or alicyclic group optionally having a substituent.
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公开(公告)号：US09567435B2
公开(公告)日：2017-02-14
申请号：US14778164
申请日：2014-03-18
发明人： Mamoru Tamura , Takuya Ohashi , Tomoyuki Enomoto
IPC分类号： C08G73/06 , C09J179/04 , C08G59/40 , C09J161/34 , C09J163/00 , C08L61/34 , C08L63/00 , H01L23/00 , C08K5/544 , C08K9/06 , C08L79/04 , H01L23/29 , H01L23/31 , H01L21/56
CPC分类号： C08G73/06 , C08G59/40 , C08K3/013 , C08K5/54 , C08K5/544 , C08K9/06 , C08L61/34 , C08L63/00 , C08L79/04 , C09J161/34 , C09J163/00 , C09J179/04 , H01L21/563 , H01L23/295 , H01L23/3142 , H01L24/26 , H01L24/29 , H01L2224/2919 , H01L2924/0665 , H01L2924/186 , C08K3/0033
摘要： There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of R1 and R2 is independently a hydrogen atom or a C1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Z1 is a carbonyl group or a —CONH— group, Z2 is a C1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C1-5 alkyl group)}.
摘要翻译： （其中Z1是羰基或-CONH-基，Z2是C1-5亚烷基或含有至少一个氮原子的5或6元二价饱和杂环基，Z 3是5-或6-元， 含有两个氮原子的三元芳族杂环基，其中至少一个氢原子可被C 1-5烷基取代）}。
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公开(公告)号：US10202528B2
公开(公告)日：2019-02-12
申请号：US15097399
申请日：2016-04-13
IPC分类号： C09J179/04 , C09D11/10 , C08G73/06 , H01L23/29 , H01L21/02 , C08G59/26 , C08G59/32 , C09J163/00 , C08K5/04 , C08K5/07 , C09J11/06 , C09D11/102 , G03F7/11 , G03F7/09
摘要： There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.
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7.发明授权公开(公告)号：US10174168B2
公开(公告)日：2019-01-08
申请号：US15202133
申请日：2016-07-05
发明人： Mamoru Tamura , Hiroshi Ogino , Tomoyuki Enomoto
IPC分类号： C08G8/02 , C08G65/40 , C08G65/48 , C08G75/20 , H01L21/02 , H01L21/56 , H01L23/29 , H01L23/31 , H01L23/48 , H01L29/06 , C09D161/16 , C09D171/12 , C09D181/06 , H01L21/768
摘要： There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T0-O Formula (i) (where T0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L1-O-T1-O Formula (1)
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公开(公告)号：US09657128B2
公开(公告)日：2017-05-23
申请号：US14900489
申请日：2014-06-04
发明人： Mamoru Tamura , Takuya Ohashi , Tomoyuki Enomoto
IPC分类号： C08G73/06 , C08G14/06 , C09J179/02 , C08G14/12 , C08L61/34 , C08L63/00 , C08K3/00 , C09J161/34 , H01L23/29 , H01L23/31
CPC分类号： C08G14/06 , C08G14/12 , C08G73/06 , C08K3/013 , C08L61/34 , C08L63/00 , C09J161/34 , C09J179/02 , H01L23/295 , H01L23/296 , H01L23/3142 , H01L2924/0002 , H01L2924/00
摘要： Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C1-4 alkyl group, phenyl group, or a C3-6 cyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a C1-5 alkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and R3 is a hydrogen atom or methyl group).
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9.发明申请COMPOSITION FOR FORMING PASSIVATION FILM, INCLUDING RESIN HAVING CARBON-CARBON MULTIPLE BOND 审中-公开形成钝化膜的组合物，包括具有碳碳多孔粘结剂的树脂公开(公告)号：US20140374887A1
公开(公告)日：2014-12-25
申请号：US14374668
申请日：2013-02-08
发明人： Mamoru Tamura , Hiroshi Ogino , Tomoyuki Enomoto
IPC分类号： H01L21/56 , C09D161/16 , H01L29/06 , C09D181/06 , H01L21/02 , C08G8/02 , C08G75/20
CPC分类号： C08G75/20 , C08G8/02 , C08G65/40 , C08G65/48 , C09D161/16 , C09D171/12 , C09D181/06 , H01L21/02118 , H01L21/02318 , H01L21/56 , H01L21/76898 , H01L23/293 , H01L23/3171 , H01L23/481 , H01L29/06 , H01L2924/0002 , H01L2924/00
摘要： There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T0-O Formula (i) (where T0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L1-O-T1-O Formula (1)
摘要翻译： 提供了一种用于形成钝化膜的组合物，其同时满足电绝缘性，耐热性，耐溶剂性和干蚀刻性能。 一种用于形成钝化膜的组合物，包括：含有式（ⅰ）单元结构的聚合物：式（ⅰ）（其中，T0是磺酰基，氟代亚烷基，亚环烷基或亚芳基 具有取代基的基团，或者是可以具有取代基的亚芳基和氟代亚烷基或亚环烷基的组合），其中所述聚合物具有式（2-A）结构的基团中的至少一个，基团 具有式（2-B）的结构或在聚合物的末端，侧链或主链中具有两个结构的基团：聚合物可以含有式（1）的单元结构， ：L1-O-T1-O式式（1）
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