摘要:
To provide a method of manufacturing a press molding by molding a molding material comprising reinforced fibers and a thermoplastic resin by a cold press method. The method of manufacturing a press molding comprising reinforced fibers and a thermoplastic resin, includes the steps of: holding the molding material heated at a temperature not lower than the softening temperature with a plurality of grippers installed on a carrier; carrying the molding material between the upper mold and the lower mold of a mold for molding; pushing the molding material with pushers to preform it at a predetermined preforming rate; and press molding the preformed molding by closing the upper mold and the lower mold and applying pressure.
摘要:
A control device which controls an industrial machine according to an aspect of the invention includes a unit which determines whether the user is a registrant registered in advance, a unit which, when the user is determined to be the registrant, selects one of a setting permission state and a setting inhibition state individually for at least one operating condition of the industrial machine in accordance with the operation of the registrant, and a setting unit which accepts from the registrant a setting of the operating condition for which the setting permission state is selected.
摘要:
The force pushing the ejector pin when a molded product is ejected is obtained from the driving torque of the servomotor. A malfunction is detected in the ejection step as follows. First, a reference pattern is obtained in advance, when a molded product is normally removed. As the reference pattern, the relationship between torque of the servomotor and time from the initiation of ejecting the ejector pin or the position of an ejector pin is used. At least one monitoring zone is set based on the pattern and the upper and lower limits of torque of each of the monitoring zones are set. A torque value is monitored in each monitoring zone and when the torque value falls outside the upper and lower limits of any one of the monitoring zones, it is determined that a malfunction occurred and an alarm is raised.
摘要:
An injection molding apparatus comprises a cell assembly that has a tiered frame. The tiered frame is provided with lower unit storage sections and upper unit storage sections. The lower unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. The upper unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. Material supply pipes, temperature control piping, etc. of the injection molding machine units are arranged in a layout space on the side of a back portion of the cell assembly.
摘要:
An electric injection molding machine comprises a barrel which holds a screw therein, a voice coil type linear motor which moves the screw in the axial direction thereof. The linear motor has a coil, a yoke extending along the coil, and a magnet movable relatively to the coil in the axial direction thereof. The injection molding machine comprises a coolant passage in the yoke and a cooling device for cooling the coil. Temperature related to the coil or a coolant is detected, and the coolant is control in accordance with the detected temperature.
摘要:
A toggle mechanism is supported at the front face of the housing and a forward end of the toggle mechanism is connected to a back face of the movable platen. Upon the closing and opening of dies, the toggle mechanism is stretched and contracted to move the movable platen forward and backward along the tie bars. An automatic control device calculates, before the dies are mounted, from a die thickness input and the kind of the dies input, such a stop position for the link housing as impart a target value to the stretching/contraction amount that the toggle mechanism has when the dies are in closed state, and calculates, from the kind of the dies input, an appropriate contraction amount greater than the target value, and the automatic controlling device moves the link housing to the stop position calculated and the toggle mechanism by the appropriate contraction amount calculated.
摘要:
A method for setting up a program profile in the control of an injection speed of injection molding machines where a dwelling phase switching position Pc, a filling stroke L or an injection starting point Ps, a maximum speed ratio Rvm and a initial speed ratio Rvs to the maximum speed mentioned in the specification of the molding machine, and an initial speed period ratio Rps to the filling stroke L or the injection starting position Ps are inputted to a profile setting means; in the profile setting means, the dwelling phase switching position Ps and the filling stroke L or the injection starting position Ps are directly set up according to the inputted values; and the maximum speed Vmax, the initial speed Vs and the initial speed period are set up by automatic computing using the maximum speed ratio Rvm and the initial speed ratio Rvs and the initial speed period ratio Rps as parameters; thereby all aspects of the profile are set up automatically.
摘要:
In press molding, a shaft (metal mold 13) is moved by positional or torque control to cause upper and lower molds to reach a set position slightly before a position where the upper and lower molds are set in a final mold closed state. As soon as the upper and lower molds reaches the set position, the control is switched to torque control using a small force which does not deform a glass material to perform feedback control. For this reason, when the cooling process is started, the mobile shaft is moved by the same amount as a contraction amount of the shaft, the actual position of the shaft is moved. However, a tight contact state between the molds and the glass material is kept without changing the thickness of the glass material, and positional control and torque control can be apparently performed at once. Thereafter, when temperature reaches an almost glass transition point, final pressing is performed. A position where the material is press-molded is exactly controlled by correcting an origin position of lower mold by closing the molds before press-molding. According to this method, a highly accurate optical element having thickness reproducibility can be obtained.
摘要:
The present invention provides a method of control in thickness of the biaxially oriented film of a plastic material to be extruded via an extrusion port gap adjustable by adjustment of a plurality of die bolts provided on an automatic T-die. A position corresponding to the die bolt is set on the film biaxially oriented so that a thickness of the film at the above position is measured to find a deviation of the measured thickness from a reference thickness predetermined to thereby carry out a feed-back control of the adjustment of the die bolt in accordance with the deviation. It is important for the present invention that the feed-back control in the adjustment of the die bolt is carried out with reference to partial side-drawing rates different in a width direction of a sheet to be drawn prior to formation of the film, where the partial sidedrawing rates are determined for parts aligned in the width direction of the film. The determination of the partial side-drawing rates are made together with setting a corresponding position on the sheet to the die bolt.
摘要:
This invention provides an epitaxial growth method capable of decreasing variations of the resistance of an epitaxial layer resulting from an in-plane temperature distribution of a silicon wafer and also capable of reducing particles and haze. This epitaxial growth method is an epitaxial growth method of growing a boron- or phosphorus-doped silicon epitaxial layer on the surface of a silicon wafer with an in-plane temperature distribution of 2 to 50.degree. C., and includes the steps of arranging the silicon wafer in a reaction vessel, supplying into the reaction vessel a source gas containing (a) silane, (b) 5 to 600 vol % of hydrogen chloride added to the silane, and (c) a dopant consisting of a boron compound or a phosphorus compound, and growing a boron- or phosphorus-doped silicon epitaxial layer on the surface of the wafer by setting a vacuum degree of 10 to 200 torr in the reaction vessel and heating the wafer to 900 to 1100.degree. C.