公开(公告)号：US07413714B1

公开(公告)日：2008-08-19

申请号：US09617068

申请日：2000-07-16

申请人： Thomas Schwalbe ,  Klaus Golbig ,  Michael Hohmann ,  Andreas Oberbeck ,  Shahriyar Taghavi-Moghadam

发明人： Thomas Schwalbe ,  Klaus Golbig ,  Michael Hohmann ,  Andreas Oberbeck ,  Shahriyar Taghavi-Moghadam

IPC分类号： B01J19/24

CPC分类号： C07C233/00 ,  B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00337 ,  B01J2219/00389 ,  B01J2219/00495 ,  B01J2219/0059 ,  B01J2219/00686 ,  B01J2219/00689 ,  B01J2219/00704 ,  B01J2219/0072 ,  C40B40/04 ,  C40B50/08 ,  C40B60/14 ,  Y10T436/115831 ,  Y10T436/12

摘要： An automated sequential reaction system that can be used to either sequentially produce a plurality of different products each requiring a single reaction, or to produce a desired product that requires a series of sequential reactions. A system controller controls an automated reactant supply, a solvent supply, a reaction module, a detector, and a product collector. Prior to initiating any reaction, the system is flushed with solvent and a heat exchanger supplies the reaction module with a temperature-conditioned fluid to maintain the reaction module at a desired temperature. For single reactions, a plurality of reactants are injected into a chemical reactor included in the reaction module. As fluid exits the chemical reactor, the detector determines if the fluid is a desired chemical product or solvent, and routes the fluid to the appropriate receptacle. Once a predetermined volume of a desired product is obtained, the system is flushed with solvent, and a different set of reactants are injected into the chemical reactor to produce the next desired product. The process is repeated until a substance library of the desired products is obtained. For products requiring sequential reaction steps, either a plurality of reactors are employed, or an intermediate product produced by a previous reaction is reintroduced into the reaction module with an appropriate reactant to complete the next sequential reaction.

摘要翻译： 一种自动化顺序反应系统，其可用于顺序地产生多个不同的产物，每个产物需要单次反应，或产生需要一系列顺序反应的所需产物。 系统控制器控制自动反应物供应源，溶剂供应源，反应模块，检测器和产品收集器。 在开始任何反应之前，系统用溶剂冲洗，热交换器向反应模块提供温度调节的流体，以将反应模块保持在所需温度。 对于单次反应，将多个反应物注入包含在反应模块中的化学反应器中。 当流体离开化学反应器时，检测器确定流体是否是期望的化学产品或溶剂，并将流体引导到适当的容器。 一旦获得了预定体积的所需产物，则用溶剂冲洗该系统，并将不同组的反应物注入化学反应器以产生下一个所需产物。 重复该过程，直到获得所需产物的物质文库。 对于需要顺序反应步骤的产物，使用多个反应器，或者通过先前反应产生的中间产物用适当的反应物引入反应模块中以完成下一个顺序反应。

公开(公告)号：US09194035B2

公开(公告)日：2015-11-24

申请号：US13537867

申请日：2012-06-29

申请人： Kyung Il Park ,  Keun-Ik Jeon ,  Sang-Su Kim ,  Youn-Yong Lee

发明人： Kyung Il Park ,  Keun-Ik Jeon ,  Sang-Su Kim ,  Youn-Yong Lee

IPC分类号： C23C14/24 ,  C23C14/34 ,  H01J37/32 ,  H01J37/34

CPC分类号： C23C14/3407 ,  H01J37/32522 ,  H01J37/3435 ,  H01J37/3497 ,  Y10T29/49947

摘要： A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.

摘要翻译： 非粘合溅射结构包括具有板形的溅射靶; 以及具有板形的背板。 背板面对溅射靶，并且溅射靶和背板的相对表面彼此接触。 背板包括具有纵向轴线的主体; 以及冷却构件，冷却材料通过所述冷却构件沿主体的纵向方向基本上平行于纵向轴线流动。 冷却材料将溅射靶产生的热从溅射传导到背板外部。 非粘合性溅射结构还包括多个不粘合的紧固构件，其保持背板和溅射靶的相对表面彼此接触。 非粘合的紧固构件延伸穿过背板的厚度并且对应于除了冷却构件之外的背板的区域。

公开(公告)号：US20130001077A1

公开(公告)日：2013-01-03

申请号：US13537867

申请日：2012-06-29

申请人： Kyung Il PARK ,  Keun-Ik JEON ,  Sang-Su KIM ,  Youn-Yong LEE

发明人： Kyung Il PARK ,  Keun-Ik JEON ,  Sang-Su KIM ,  Youn-Yong LEE

IPC分类号： C23C14/34 ,  B23P11/00

CPC分类号： C23C14/3407 ,  H01J37/32522 ,  H01J37/3435 ,  H01J37/3497 ,  Y10T29/49947

摘要： A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.

摘要翻译： 非粘合溅射结构包括具有板形的溅射靶; 以及具有板形的背板。 背板面对溅射靶，并且溅射靶和背板的相对表面彼此接触。 背板包括具有纵向轴线的主体; 以及冷却构件，冷却材料通过所述冷却构件沿主体的纵向方向基本上平行于纵向轴线流动。 冷却材料将溅射靶产生的热从溅射传导到背板外部。 非粘合性溅射结构还包括多个不粘合的紧固构件，其保持背板和溅射靶的相对表面彼此接触。 非粘合的紧固构件延伸穿过背板的厚度并且对应于除了冷却构件之外的背板的区域。