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    SYSTEMS AND METHODS OF GLASS CUTTING BY INDUCING PULSED LASER PERFORATIONS INTO GLASS ARTICLES
    2.
    发明申请
    SYSTEMS AND METHODS OF GLASS CUTTING BY INDUCING PULSED LASER PERFORATIONS INTO GLASS ARTICLES 有权
    通过将脉冲激光进入玻璃制品的玻璃切割的系统和方法

    公开(公告)号：US20160009586A1

    公开(公告)日：2016-01-14

    申请号：US14794378

    申请日：2015-07-08

    Applicant: Corning Incorporated

    Inventor： Dana Craig Bookbinder ,  Lewis Kirk Klingensmith ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Helmut Schillinger ,  Pushkar Tandon ,  Sergio Tsuda

    IPC: C03B33/06 ,  C03B33/09 ,  C03B33/10 ,  C03B17/04

    CPC classification number: C03B33/06 ,  B23K2103/54 ,  C03B9/12 ,  C03B33/0222 ,  C03B33/095 ,  C03B33/0955

    Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

    Abstract translation: 激光切割激光波长透明玻璃制品的本方法的实施例包括将至少一个玻璃制品馈送到具有至少一个脉冲激光的脉冲激光组件，其中脉冲激光器限定长度为0.1-100的激光束焦线 mm，所述玻璃制品由两个端部部分组成，以及纵向设置在所述端部之间的至少一个侧面。 该方法还包括将玻璃制品的侧表面上的至少一个穿孔线激光切割，同时在玻璃制品和脉冲激光器之间存在相对运动并沿着至少一个穿孔线分离玻璃制品以产生激光切割玻璃 文章。

    GLASS TUBE CLEANING AND CUTTING DEVICE AND METHOD FOR SAME
    3.
    发明申请
    GLASS TUBE CLEANING AND CUTTING DEVICE AND METHOD FOR SAME 有权
    玻璃管清洁和切割装置及其方法

    公开(公告)号：US20140366693A1

    公开(公告)日：2014-12-18

    申请号：US14373480

    申请日：2012-11-20

    Applicant: NIPPON ELECTRIC GLASS CO., LTD.

    Inventor： Kenichi Hoshiba ,  Masahiro Ichikawa ,  Toru Hasegawa

    IPC: C03B33/10

    CPC classification number: C03B33/105 ,  B08B5/023 ,  C03B33/095 ,  Y10T83/0443 ,  Y10T83/242

    Abstract: A glass tube cleaning and cutting device and a method for same configured to cut a continuous glass tube at a predetermined length by intermittently contacting a cutting blade with the outer circumference surface of the continuously travelling continuous glass tube formed by tube pulling while blowing air to impose scratches and thermal shock on the outer circumference surface of the continuous glass tube so as to obtain a plurality of cut-off glass tubes, the glass tube cleaning and cutting device includes: a blower provided on a more downstream side of the travelling continuous glass tube than the cutting blade, the blower being configured to blow opposing air opposed to air into a tip end opening of the continuous glass tube.

    Abstract translation: 一种玻璃管清洗切割装置及其制造方法，其特征在于，通过间歇地将切割刀片与通过管拉动而形成的连续行进的连续玻璃管的外周面间断地接触而将规定长度的连续玻璃管切断，同时吹送空气 在连续玻璃管的外周表面上产生划痕和热冲击，以获得多个切断的玻璃管，玻璃管清洗和切割装置包括：设置在行进的连续玻璃管的更下游侧的鼓风机 鼓风机被配置为将与空气相对的相对空气吹入连续玻璃管的顶端开口中。

    Method of producing slices
    5.
    发明授权
    Method of producing slices 失效
    生产切片的方法

    公开(公告)号：US5918587A

    公开(公告)日：1999-07-06

    申请号：US608190

    申请日：1996-02-28

    Applicant: Fumihiko Hasegawa ,  Hitoshi Misaka ,  Toshihiro Tsuchiya

    Inventor： Fumihiko Hasegawa ,  Hitoshi Misaka ,  Toshihiro Tsuchiya

    IPC: B26F3/06 ,  B28D5/00 ,  C03B33/095 ,  H01L21/304 ,  B26F3/02

    CPC classification number: C03B33/095 ,  B28D5/0005 ,  Y10T225/304

    Abstract: The invention seeks to provide a method of producing slices, such as semiconductor wafers, from a rod-like ingot, which does not require any cutting margin for slicing so that less material is consumed, and also is free from warping or denatured layer of the slices, as well as being free from operating environment deterioration with high quality. A cylindrical ingot is obtained by cutting or grinding the outer periphery of a rod-like ingot, and it is then formed with a plurality of annular grooves at a predetermined pitch in its longitudinal direction to obtain a cylindrical work with annular grooves. The work is then severed in the section defined by the bottom of each annular groove by generating a stress in excess of the rupture strength of the slice in the groove.After the heating of the cylindrical work with annular grooves, the under-process end face of the work is suitably cooled quickly by cooling water jet from a jet nozzle from the outer periphery toward the center of the work.

    Abstract translation: 本发明寻求提供一种从棒状锭生产切片例如半导体晶片的方法，其不需要任何切割余量用于切片，从而消耗更少的材料，并且也不会有翘曲或变性层 切片，以及高品质的环境恶化。 通过切割或研磨棒状锭的外周而获得圆柱形锭，然后在其长度方向上以预定间距形成多个环形槽，以获得具有环形槽的圆柱形加工。 然后通过产生超过槽中切片的断裂强度的应力在每个环形槽的底部限定的部分中切断工件。 在用环形槽加热圆筒形工件之后，通过从射流喷嘴从外周向工件的中心冷却水射流，工件的处理前端面被适当地冷却。

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