Assembly And Method For Cleaving A Glass Body With A Laser

    公开(公告)号:US20230115162A1

    公开(公告)日:2023-04-13

    申请号:US17905696

    申请日:2021-07-22

    Abstract: A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

    Systems and methods for minimizing SHR from piercing during pharmaceutical part converting using a gas flow

    公开(公告)号:US11420893B2

    公开(公告)日:2022-08-23

    申请号:US16197187

    申请日:2018-11-20

    Abstract: Systems for producing articles from glass tube include a converter having a base with a plurality of processing stations and a turret moveable relative to the base. The turret indexes a plurality of holders for holding the glass tubes successively through the processing stations. The systems further include a gas flow system or a suction system for producing a flow of gas through the glass tube during one or more heating, forming, separating or piercing operations. The flow of gas through the glass tube produced by the gas flow system or suction system may be sufficient to evacuate or purge volatile constituents of the glass from the glass tube and/or pierce a meniscus formed on the glass tube during separation, thereby reducing the Surface Hydrolytic Response (SHR) of the interior surface of the glass tube and articles made therefrom.

    Method of breaking a brittle substrate
    8.
    发明申请
    Method of breaking a brittle substrate 有权
    破碎脆性基材的方法

    公开(公告)号:US20050263503A1

    公开(公告)日:2005-12-01

    申请号:US10524982

    申请日:2003-07-18

    Abstract: The invention relates to a method of breaking a substrate of a brittle material, the method comprising the steps of providing a substrate (1) of a brittle material, heating the substrate with a laser beam (3) to create a heated spot on the substrate, moving the laser beam and the substrate with respect to each other to create a line of heated spots on the substrate (2), cooling the heated spots on the substrate by locally applying a cooling medium (4) behind the heated spots such that a micro-crack is propagated in the line of heated spots, and breaking the substrate along the line of the propagated micro-cracks by applying a mechanical force on the substrate wherein, the cooling medium comprises an aqueous surfactant solution. The surfactants will connect to the broken siloxane bonds inside the surface cracks. Then recombination and healing of the broken siloxane bonds will not occur and the required breaking load will remain constant over time.

    Abstract translation: 本发明涉及一种破碎脆性材料的基材的方法,所述方法包括以下步骤:提供脆性材料的基材(1),用激光束(3)加热基材以在基材上产生加热点 相对于彼此移动激光束和衬底以在衬底(2)上产生一线加热点,通过在加热点之后局部施加冷却介质(4)来冷却衬底上的加热点,使得 微裂纹在加热点的线中传播,并且通过在基底上施加机械力来破坏基底,沿着传播的微裂纹的线,其中冷却介质包含表面活性剂水溶液。 表面活性剂将连接到表面裂纹内的破裂的硅氧烷键。 然后,破裂的硅氧烷键的复合和愈合将不会发生,并且所需的断裂载荷随时间保持恒定。

    Method of producing slices
    9.
    发明授权
    Method of producing slices 失效
    生产切片的方法

    公开(公告)号:US5918587A

    公开(公告)日:1999-07-06

    申请号:US608190

    申请日:1996-02-28

    CPC classification number: C03B33/095 B28D5/0005 Y10T225/304

    Abstract: The invention seeks to provide a method of producing slices, such as semiconductor wafers, from a rod-like ingot, which does not require any cutting margin for slicing so that less material is consumed, and also is free from warping or denatured layer of the slices, as well as being free from operating environment deterioration with high quality. A cylindrical ingot is obtained by cutting or grinding the outer periphery of a rod-like ingot, and it is then formed with a plurality of annular grooves at a predetermined pitch in its longitudinal direction to obtain a cylindrical work with annular grooves. The work is then severed in the section defined by the bottom of each annular groove by generating a stress in excess of the rupture strength of the slice in the groove.After the heating of the cylindrical work with annular grooves, the under-process end face of the work is suitably cooled quickly by cooling water jet from a jet nozzle from the outer periphery toward the center of the work.

    Abstract translation: 本发明寻求提供一种从棒状锭生产切片例如半导体晶片的方法,其不需要任何切割余量用于切片,从而消耗更少的材料,并且也不会有翘曲或变性层 切片,以及高品质的环境恶化。 通过切割或研磨棒状锭的外周而获得圆柱形锭,然后在其长度方向上以预定间距形成多个环形槽,以获得具有环形槽的圆柱形加工。 然后通过产生超过槽中切片的断裂强度的应力在每个环形槽的底部限定的部分中切断工件。 在用环形槽加热圆筒形工件之后,通过从射流喷嘴从外周向工件的中心冷却水射流,工件的处理前端面被适当地冷却。

Patent Agency Ranking