COOLING-ARRANGEMENT
    1.
    发明申请
    COOLING-ARRANGEMENT 审中-公开
    冷却布置

    公开(公告)号:US20120111532A1

    公开(公告)日:2012-05-10

    申请号:US13288237

    申请日:2011-11-03

    申请人: Jean Le Besnerais

    发明人: Jean Le Besnerais

    IPC分类号: F01P9/00

    摘要: A cooling-arrangement is provided. The arrangement for cooling includes a device and a heat exchanger. The device is coupled with the heat exchanger in a way, that heat, which is generated inside the device, is transferred from the device to the heat exchanger. The heat exchanger is at least partly arranged into an ambient airflow. The heat exchanger is constructed in a way that the heat is transferred from the heat exchanger into the ambient airflow. The heat exchanger contains a suction side and a pressure side, which are arranged and constructed in a way that the ambient air, which passes by close to the sides, is accelerated for an improved heat transfer.

    摘要翻译: 提供冷却装置。 冷却装置包括装置和热交换器。 该装置以一种方式与热交换器联接,使得在装置内部产生的热量从装置转移到热交换器。 热交换器至少部分地布置在环境气流中。 热交换器的构造方式是将热量从热交换器传递到环境气流中。 热交换器包括吸入侧和压力侧,其被布置和构造成使得靠近侧面通过的环境空气被加速以改善传热。