公开(公告)号：US5494149A

公开(公告)日：1996-02-27

申请号：US256528

申请日：1994-07-15

申请人： Georg Sillner

发明人： Georg Sillner

IPC分类号： B65G15/48 ,  B65G15/58 ,  B65G17/32 ,  B65G49/05 ,  B65G49/06 ,  H05K13/00 ,  H05K13/04 ,  B65G17/46

CPC分类号： B65G17/323 ,  H05K13/0092 ,  H05K13/0439 ,  B65G2201/02 ,  H01L2924/0002

摘要： The invention concerns a novel design for a conveyor (12) for, preferably, electrical components (5). The conveyor includes a conveyor (13) in the form of a closed loop passing over at least two pulleys (14,15), plus holders (28), disposed on the conveyor, to hold the components (5).

摘要翻译： PCT No.PCT / DE93 / 00021 Sec。 371日期1994年7月15日 102（e）1994年7月15日PCT PCT 1993年1月13日PCT公布。 公开号WO93 / 14009 日期：1993年7月22日。本发明涉及一种用于优选电气部件（5）的输送机（12）的新型设计。 输送机包括通过设置在输送机上的至少两个皮带轮（14,15）和保持器（28）的闭环形式的输送机（13），以保持部件（5）。

公开(公告)号：US5133390A

公开(公告)日：1992-07-28

申请号：US616328

申请日：1990-11-21

申请人： J. Gregg Ellis

发明人： J. Gregg Ellis

IPC分类号： H05K13/02 ,  H05K13/04

CPC分类号： H05K13/023 ,  H05K13/0439 ,  Y10T29/4913 ,  Y10T29/5191 ,  Y10T29/53183 ,  Y10T29/53261 ,  Y10T29/53478

摘要： An tape automated bonding feeder apparatus employs a vertical carrier extraction unit to successively supply electronic circuit components to an output station from which a component is seized for placement and attachment to a circuit board. The feeder apparatus, which may be mounted on a rollable cart, includes a generally rectilinear housing on a top plate of which one or more magazines are mounted. A magazine contains a stack of circuit component carriers. The bottom of the magazine has a carrier extraction unit which controllably allows an individual component carrier at the bottom of the stack to drop away onto an underlying carrier shuttle. The carrier shuttle is supported for movement betweeen the magazine and a lead forming unit. The lead forming unit detaches a component from the carrier and forms the leads of the excised component for mounting the component to a circuit board. A processed component transport unit is coupled to an anvil of the lead forming unit and transports a processed component to the output station.

摘要翻译： 带式自动接合输送装置采用垂直载体提取单元，将电子电路部件连续地供给到一个输出站，一个部件被从其中被抓取用于放置和连接到电路板。 可以安装在可滚动推车上的馈送装置包括在其上安装有一个或多个盒的顶板上的大致直线的壳体。 杂志包含一堆电路组件载体。 储物盒的底部具有载体提取单元，其可控制地允许堆叠底部的单个分量载体落到下面的载体梭上。 承载梭被支撑在料仓和引线形成单元之间的运动。 引线形成单元将部件从载体分离并形成用于将部件安装到电路板的切除部件的引线。 经处理的部件传送单元耦合到引线形成单元的砧座，并将经处理的部件传送到输出站。

公开(公告)号：US4566071A

公开(公告)日：1986-01-21

申请号：US451842

申请日：1982-12-21

申请人： Hiroshi Takahashi

发明人： Hiroshi Takahashi

IPC分类号： H05K13/00 ,  H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0434 ,  H05K13/0439 ,  Y10T29/53178

摘要： An automatic insertor for inserting pins of ICs into holes formed in a printed circuit board includes a cassette holding section for holding a number of cassettes, each of which contains a plurality of ICs of the same kind, an IC discharging section for selectively discharging desired ICs successively from given cassettes, an IC carrier section for carrying the ICs successively supplied from the cassettes into an inlet of an IC rail arranged in inclined fashion, an inferior IC rejecting section for removing inferior ICs when the pins of the IC are deformed beyond an acceptable range, a first gate for stopping the ICs supplied from the inferior IC rejecting section and supplying the stopped ICs at a given timing, a pin correcting and cutting section for correcting the position and posture of IC pins and cutting the tips of the IC pins into V-shape, a second gate for temporarily retaining the ICs supplied from the pin correcting and cutting section, a polarity detecting and inverting section for detecting the polarity of ICs and turning the ICs over 180.degree. when the detected polarity is opposite to that denoted during a copy mode, a third gate for temporarily retaining the ICs, and an inserting section for gripping the IC pins and inserting them into the holes in the printed circuit board, which is mounted on an XY table which is driven by positional data stored during the copy mode into given inserting positions.

摘要翻译： 用于将IC引脚插入印刷电路板中的孔的自动插入器包括：盒保持部，用于保持多个盒，每个盒包含多个相同类型的IC; IC放电部，用于选择性地放出期望的IC 从IC卡载体部分连续地将从卡带供给的IC运送到以倾斜方式布置的IC导轨的入口的IC载体部分，当IC的引脚变形超过可接受的IC时，用于去除劣质IC的劣质IC拒绝部分 范围，用于停止从劣质IC拒绝部分提供的IC并在给定的时间提供停止的IC的第一门，用于校正IC引脚的位置和姿势并将IC引脚的尖端切割成的引脚校正和切割部分 V形，用于临时保持从引脚校正和切割部分提供的IC的第二门极性检测和反转秒 当检测到的极性与复印模式下所显示的极性相反时，检测IC的极性并将IC转过180°，用于暂时保持IC的第三栅极和用于夹持IC引脚并将其插入的插入部分 印刷电路板上的孔，安装在由复印模式下存储的位置数据驱动的XY工作台上的给定插入位置。

公开(公告)号：US4544003A

公开(公告)日：1985-10-01

申请号：US627120

申请日：1984-07-02

申请人： Richard L. Bumann ,  Patrick G. Chipman

发明人： Richard L. Bumann ,  Patrick G. Chipman

IPC分类号： B21F1/02 ,  H01L23/48 ,  H01L23/50 ,  H05K13/04

CPC分类号： H05K13/0439

摘要： A mechanism for straightening bent terminals on an integrated circuit package comprises a base having a pair of spaced apart arms pivotally coupled thereto. Rollers attach to the arms to support and move a plate when the arms are pivoted. The plate has a first set of holes which are tapered to accept bent terminals and to straighten them when they are forced into the taper. A plurality of pins extend from the base between the arms and stop parallel to the plate. The plate has a second set of holes through which the pins move when the arms are pivoted. A plurality of intermeshed gears couple to the base and the arms to pivot the arms in synchronization and move the plate perpendicular to the pins which push the integrated circuit package straight out of the first set of holes.

摘要翻译： 用于校正集成电路封装件上的弯曲端子的机构包括具有可枢转地联接到其上的一对间隔开的臂的基座。 当手臂枢转时，滚轮附着到臂上以支撑和移动板。 板具有第一组孔，其锥形以接受弯曲端子，并且当它们被迫进入锥形时将其伸直。 多个销在臂之间从基部延伸并平行于板停止。 板具有第二组孔，当臂枢转时，销通过该孔穿过。 多个相互啮合的齿轮联接到基座和臂以同步地枢转臂并且将板垂直于销将板移动，从而将集成电路组件直接推出第一组孔。

公开(公告)号：US4529315A

公开(公告)日：1985-07-16

申请号：US461798

申请日：1983-01-28

申请人： Brian S. Cohen ,  Arthur C. Sanderson ,  Kevin J. Dowling

发明人： Brian S. Cohen ,  Arthur C. Sanderson ,  Kevin J. Dowling

IPC分类号： G01B11/00 ,  B23Q15/24 ,  H05K13/04

CPC分类号： B23Q15/24 ,  H05K13/0413 ,  H05K13/0439

摘要： The invention is a multi-channel position detection system which utilizes several separate emitters and a single photodetector to, for example, align a multi-lead component manipulator with a predetermined location in a printed circuit board. An oscillator circuit generates a modulated signal for each emitter and a multiplier circuit develops an output signal based upon the oscillator output and the photodetector output. The photodetector provides an output responsive to the emitter signal as attenuated by the circuit board location relative to the emitter. When the lead hole of the circuit board is aligned with the emitter and photodetector minimum attenuation of the signal occurs.

摘要翻译： 本发明是一种多通道位置检测系统，其利用多个单独的发射器和单个光电检测器来例如将多引线部件操纵器与印刷电路板中的预定位置对准。 振荡器电路为每个发射器产生调制信号，乘法器电路基于振荡器输出和光电检测器输出产生输出信号。 光电探测器提供响应于由电路板相对于发射器的位置衰减的发射极信号的输出。 当电路板的引线孔与发射极对准时，光电探测器发生信号的最小衰减。

公开(公告)号：US2901127A

公开(公告)日：1959-08-25

申请号：US65624357

申请日：1957-05-01

申请人： IBM

发明人： HAZEL HERBERT K

IPC分类号： H05K13/04

CPC分类号： H05K13/0439 ,  Y10T29/53183

公开(公告)号：US2748388A

公开(公告)日：1956-06-05

申请号：US48676455

申请日：1955-02-08

申请人： UNITED SHOE MACHINERY CORP

发明人： CARDANI CHARLES P

IPC分类号： H05K13/04

CPC分类号： H05K13/0439 ,  Y10T29/515 ,  Y10T29/53183

公开(公告)号：US07414308B2

公开(公告)日：2008-08-19

申请号：US11297047

申请日：2005-12-07

申请人： Wolfgang Hauser ,  Heiko Dreher ,  Christian Kimstedt ,  Markus Rogalla

发明人： Wolfgang Hauser ,  Heiko Dreher ,  Christian Kimstedt ,  Markus Rogalla

IPC分类号： H01L23/48

CPC分类号： H01L23/49555 ,  H01L2924/0002 ,  H05K13/0439 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.

摘要翻译： 集成电路包括封装并且在封装的两个相对侧上具有相邻的连接引脚，每个第二连接引脚被向内弯曲，使得连接引脚被偏移。 向内弯曲的连接销的端部和外部连接销的端部各自位于直线上，其中偏移连接销以不同的角度弯曲离开包装的平面。

公开(公告)号：US20060164794A1

公开(公告)日：2006-07-27

申请号：US10521754

申请日：2003-07-17

申请人： Shozo Kadota ,  Kazuaki Kosaka ,  Minoru Kitani

发明人： Shozo Kadota ,  Kazuaki Kosaka ,  Minoru Kitani

IPC分类号： H02B1/00

CPC分类号： H05K13/0404 ,  H05K3/306 ,  H05K13/0439 ,  H05K13/0456 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/53183

摘要： In a component insertion apparatus, there are provided a component insertion apparatus and a component insertion method capable of realizing productivity improvement by simplifying apparatus construction, downsizing the apparatus and further reducing the time required for component insertion. In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion comes to be placed at a component insertion position, by which correction of insertion posture of the component is performed, and the lead wire of the component that has been corrected in its insertion posture is inserted into an insertion hole of a board.

摘要翻译： 在部件插入装置中，提供了一种通过简化装置结构，减小装置尺寸并进一步减少部件插入所需时间来实现生产率提高的部件插入装置和部件插入方法。 在部件插入头中，通过用装置卡盘夹持部件的装置部分，将引线在由导线的夹持位置由转移卡盘给出的支点上拉伸，使得装置部分被放置 在部件插入位置，通过该零件插入位置执行部件的插入姿势的校正，并且已经将其插入姿势中被校正的部件的引线插入到板的插入孔中。

公开(公告)号：US20060108679A1

公开(公告)日：2006-05-25

申请号：US11297047

申请日：2005-12-07

申请人： Wolfgang Hauser ,  Heiko Dreher ,  Christian Kimstedt ,  Markus Rogalla

发明人： Wolfgang Hauser ,  Heiko Dreher ,  Christian Kimstedt ,  Markus Rogalla

IPC分类号： H01L23/48

CPC分类号： H01L23/49555 ,  H01L2924/0002 ,  H05K13/0439 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means. Since every second connecting pin (12) is not bent inward immediately before insertion of the connecting pins (11, 12), no subsequent corrective alignment of the offset connecting pins (11, 12) is required.

摘要翻译： 本发明涉及具有连接销（1）的封装（2）以及将封装（2）安装在板（5）上的芯片的制造和测试，从而为了将封装 （2）具有带有偏置连接销（11,12）的封装（2）的优点的带有内联连接引脚（1）的封装（2）由线内连接引脚（1）制成并插入测试插座 3）进行测试。 在安装在板（5）上之前，封装（2）的至少一个连接销（优选地每个第二连接销（12））由弯曲工具（6）向内弯曲，以实现 连接销（11,12）。 包装（2）优选使用弯曲工具（6）安装在板（5）上。 一个简单，廉价的测试插座（3）足以用于测试芯片。 廉价生产的引导支架（4）例如适合作为包装装置。 由于每个第二连接销（12）在插入连接销（11,12）之前不向内弯曲，所以不需要随后的偏移连接销（11,12）的校正对准。