摘要:
According to the invention, an electromagnetic radiation shielding cap is located over an electronic cartridge substrate. The electromagnetic radiation shielding cap includes an electromagnetic radiation shielding plate and an electromagnetic radiation shielding rim extending around a periphery of the electronic cartridge substrate. An edge of the electromagnetic radiation shielding rim contacts a thermally and electrically conductive heat plate located on an opposing side of the electronic cartridge substrate. The heat plate and the electromagnetic radiation shielding cap jointly define an electromagnetic radiation shielding enclosure around the electronic cartridge substrate.
摘要:
A metal shield case which encloses a circuit board 11 on which an electronic circuit part is mounted, shielding electromagnetic wave disturbance, wherein a tongue 15 is provided in a case cover 12a by a cutout in correspondence with a heat generating part 10 mounted on the circuit board 11, the tongue 15 being held in press contact with the heat generating part 10 to allow the heat of the heat generating part to escape to the shield case through the tongue, thereby achieving a heat dissipating effect.
摘要:
According to the invention, an electromagnetic radiation shielding cap is located over an electronic cartridge substrate. The electromagnetic radiation shielding cap includes an electromagnetic radiation shielding plate and an electromagnetic radiation shielding rim extending around a periphery of the electronic cartridge substrate. An edge of the electromagnetic radiation shielding rim contacts a thermally and electrically conductive heat plate located on an opposing side of the electronic cartridge substrate. The heat plate and the electromagnetic radiation shielding cap jointly define an electromagnetic radiation shielding enclosure around the electronic cartridge substrate.
摘要:
A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.
摘要:
An electromagnetic interference and compatibility (EMI/EMC) shielding enclosure for a printed circuit board (PCB) or other electronic components has a conductive plastic top housing portion and a conductive bottom housing portion. The top housing portion has projecting fingers integral therewith. The bottom housing portion has an inner surface with walls projecting therefrom for substantially encompassing the PCB. When the enclosure is assembled, the PCB is located between the top housing portion and the bottom housing portion, the fingers from the top housing portion surround at least a major portion of the PCB and the fingers physically contact the bottom housing portion or are sufficiently close for capacitive coupling.
摘要:
An assembly for attaching a printed circuit board to a chassis includes a mounting rail for engagement with the printed circuit board and a guide member for engagement with the chassis. In one embodiment, the mounting rail includes an elongated body member having a first side and a second side and a spacer formed in the first side. A lock member for engaging the printed circuit board is coupled to the spacer. The guide member defines a guide slot for slidably receiving the mounting rail.
摘要:
An electronic instrument having a housing containing a circuit assembly with a hole. A first shield in the housing is positioned adjacent the hole on one side of the circuit assembly, and a second shield is positioned on the opposite side of the circuit assembly. A spring has a first portion compressed between the circuit assembly and the first shield, and a second portion extending through the hole and biased against the second shield. The spring may be a coil spring with the first portion having a larger diameter to provide a shoulder to rest against the circuit, and the second portion having a smaller diameter to pass through the hole.
摘要:
A shock resistant dielectric material comprising TiO.sub.2 particles disped in a matrix material which is (1) the polyurea reaction product of a poly(tetramethylene ether)glycol-di-p-aminobenzoate prepolymer and an aromatic diisocyanate or (2) a blend of the polyurea reaction product and a cyanate ester homopolymer of bis(4-cyanatophenyl)-1,1-ethane.
摘要:
A shock resistant dielectric material comprising TiO.sub.2 particles disped in a matrix material which is (1) the polyurea reaction product of a poly(tetramethylene ether)glycol-di-p-aminobenzoate prepolymer and an aromatic diisocyanate or (2) a blend of the polyurea reaction product and a cyanate ester homopolymer of bis(4-cyanatophenyl)-1,1-ethane.
摘要:
A conductive strap configured to attach to a circuit board containing a component sensitive to electronmagnetic interference (EMI) and to slidably contact an enclosure having a conductive internal surface can reduce or eliminate EMI in an electronic device. The strap is positioned on the circuit board to shield the sensitive component from EMI. Slidable contact between the shielding strap and the enclosure internal surface renders the strap suitable for almost any enclosure configuration without any design modification.