Food Slicer
    2.
    发明申请
    Food Slicer 审中-公开
    食品切片机

    公开(公告)号:US20140047964A1

    公开(公告)日:2014-02-20

    申请号:US13589110

    申请日:2012-08-18

    申请人: Gang Zhao

    发明人: Gang Zhao

    IPC分类号: B26D3/28 B26D7/02

    摘要: A food slicer for slicing food, comprising: a housing, a cutting board with generally curved cutting surface mounted inside the housing, a cutting blade oriented generally transverse to the cutting direction having a peripheral cutting edge and defining a blade plane, an electric drive motor for drivingly rotating the cutting blade of the food slicer, a first slider slidable along a first guide rail which is oriented generally parallel to the cutting direction, a first spring connected between the first slider and the housing for propelling the first slider toward the cutting board, so the first slider pushes the food articles toward the cutting board for preventing the food articles on the cutting board from moving. The food slicer further includes a board pivotally mounted in the housing with surface oriented generically parallel to the blade plane for supporting the unsliced food articles.

    摘要翻译: 1,一种切片食品的食品切片机,其特征在于,包括:壳体,具有安装在壳体内部的大致弯曲的切割面的切割板,大致横切切割方向的切割刀片,具有周边切割边缘并限定叶片平面;电驱动马达 用于驱动地旋转食品切片机的切割刀片,沿第一导轨滑动的第一滑动件,第一导轨大致平行于切割方向定位;第一弹簧,连接在第一滑块和壳体之间,用于将第一滑块推向切割板 因此第一滑块将食品推向切割板,以防止切割板上的食物移动。 食品切片机还包括一个可枢转地安装在壳体中的板,其表面一般地平行于叶片平面定位,用于支撑未被切割的食品。

    Trimmer block pad, trimmer, and method of trimming
    3.
    发明授权
    Trimmer block pad, trimmer, and method of trimming 有权
    修剪块,修剪器和修剪方法

    公开(公告)号:US08646367B2

    公开(公告)日:2014-02-11

    申请号:US12874621

    申请日:2010-09-02

    申请人: Jennifer Senft

    发明人: Jennifer Senft

    IPC分类号: B26D7/02 B26D5/08

    摘要: The present disclosure relates to a trimmer block pad, a trimmer, and a process of trimming. The process includes inserting a book into a trimmer, positioning a trimmer block pad to abut the book, the trimmer block comprising a first non-square exterior corner and a second non-square exterior corner, and trimming a portion of the book. The positioning of the trimmer block pad applies a distributed force to the book.

    摘要翻译: 本发明涉及修剪器块垫,修剪器和修整过程。 该过程包括将书籍插入修剪器中,定位修剪器块垫以邻接书本,修剪器块包括第一非正方形外角和第二非正方形外角,以及修剪书的一部分。 修剪器块垫的定位对书进行分布式的力。

    Three-side trimmer, especially for short runs
    4.
    发明授权
    Three-side trimmer, especially for short runs 有权
    三边修剪器,特别适用于短路

    公开(公告)号:US08171834B2

    公开(公告)日:2012-05-08

    申请号:US12399707

    申请日:2009-03-06

    申请人: Horst Rathert

    发明人: Horst Rathert

    IPC分类号: B26D1/06

    摘要: A trimmer including a common support frame and first and second cutting units movably mounted on the common support frame. Each respective cutting unit including a unit frame, a cutting strip connected to each respective unit frame, and a knife movably mounted on each respective unit frame for an oblique swing cut against a respective cutting strip. Each respective unit frame absorbing all cutting forces between the knife and the cutting strip during the oblique swing cut.

    摘要翻译: 包括公共支撑框架的修剪器和可移动地安装在公共支撑框架上的第一和第二切割单元。 每个相应的切割单元包括单元框架,连接到每个相应单元框架的切割条和可移动地安装在每个相应单元框架上用于相对于相应切割条倾斜摆动切割的刀片。 每个相应的单元框架在倾斜摆动切割期间吸收刀和切割条之间的所有切割力。

    Paper cutting device having receiving part
    5.
    发明授权
    Paper cutting device having receiving part 有权
    具有接收部分的切纸装置

    公开(公告)号:US08146472B2

    公开(公告)日:2012-04-03

    申请号:US11884365

    申请日:2006-03-06

    IPC分类号: B26D7/02 B26D5/08 B26D7/20

    摘要: A paper cutting device, for cutting multiple sheets of paper stacked in layers on a table, comprises a paper retainer (2) descending from an upper side along a guide and a cutter (3) diagonally ascending from the lower side. A receiving part (18) is mounted on the lower surface of a paper retaining frame (20). The receiving part (18) is formed by joining a base plate (36) with a large elastic modulus such as a metal to a resin receiving plate (37). A slip prevention structure is installed on the junction surfaces of the base plate (36) and the receiving plate (37) to suppress the extension/retraction of the receiving part of the paper retainer so as to prevent wrinkles from occurring in the paper near a blade receiving surface when the paper is cut off.

    摘要翻译: 用于将多张堆叠在桌子上的多张纸张切割的切纸装置包括沿着引导件从上侧下降的纸张保持器(2)和从下侧对角地上升的切割器(3)。 接收部件(18)安装在纸张保持框架(20)的下表面上。 接收部(18)通过将具有大的弹性模量的基板(36)与金属接合而形成在树脂接受板(37)上。 防滑结构安装在基板(36)和接收板(37)的接合表面上,以抑制纸张保持器的接收部分的延伸/缩回,以防止在纸张附近发生皱纹 当纸被切断时刀片接收表面。

    Vise assembly
    8.
    发明申请
    Vise assembly 失效
    背心组装

    公开(公告)号:US20090133558A1

    公开(公告)日:2009-05-28

    申请号:US12292194

    申请日:2008-11-13

    申请人: Kenji Abe

    发明人: Kenji Abe

    IPC分类号: B26D7/02

    摘要: In a bench circular sawing machine as one example of a cutting machine, a vise assembly to be mounted to a guide fence includes a pressing part (e.g., an arm and a feed screw) configured to be capable of moving upward and downward and fixed at a desired height, in a position protrusively frontward of the guide fence, and a second pressing part (e.g., stopper plate) configured to be capable of moving along the guide surface upward and downward and fixed at a desired height. One of the pressing part and the second pressing part is selected for use in holding a workpiece down from above.

    摘要翻译: 在作为切割机的一个实例的台式圆锯机中,要安装到导向栅栏的虎钳组件包括:构造成能够向上和向下移动并固定在其上的固定的按压部分(例如,臂和进给螺杆) 在引导栅栏的前方位置处的所需高度,以及构造成能够沿着引导表面向上和向下移动并固定在期望高度的第二按压部(例如,止动板)。 选择按压部和第二按压部之一用于从上方保持工件。

    Lead cutter and method of fabricating semiconductor device
    10.
    发明申请
    Lead cutter and method of fabricating semiconductor device 有权
    铅刀和制造半导体器件的方法

    公开(公告)号:US20070232027A1

    公开(公告)日:2007-10-04

    申请号:US11727916

    申请日:2007-03-29

    申请人: Tooru Kumamoto

    发明人: Tooru Kumamoto

    IPC分类号: H01L21/00 B26D7/02

    摘要: Aimed at stably forming sheared surfaces of leads of semiconductor devices, and at raising ratio of formation of plated layers onto the sheared surfaces of the leads, a lead cutter has a die 106, and a cutting punch 110 having a cutting edge at least on the surface facing the die, wherein clearance T between the die 106 and the cutting punch 110 is set within the range from not smaller than 2.3% and smaller than 14.0% of the total thickness of the leads to be cut and plated layers formed on the upper and the lower surfaces thereof.

    摘要翻译: 针对稳定地形成半导体器件的引线的剪切表面,并且在引线的剪切表面上形成镀层的升高比率,引线切割器具有模具106和切割冲头110,切割冲头110具有至少在 其中模具106和切割冲头110之间的间隙T设定在不小于2.3%且小于待切割的引线的总厚度的14.0%的范围内,并且在上部形成的镀层 及其下表面。