公开(公告)号：US20040245093A1

公开(公告)日：2004-12-09

申请号：US10488352

申请日：2004-03-01

发明人： Egon Hubel

IPC分类号： B23H007/26

CPC分类号： C25D17/28 ,  C25D21/12 ,  H05K3/241

摘要： In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50 mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.x, as far as they are located directly opposite the respective various counter electrodes 5.x.

摘要翻译： 为了避免在传送带系统中的工件3x的电解处理期间产生边缘效应（在电解处理的工件的边缘处增加的电场线密度），来自各种对置电极5的电流。 x被设定为工件3x的电解处理表面积的函数值，只要它们与各个对置电极5.x的相应位置正好相对。 此外，工件3x和对置电极5.x之间的距离选择为最大为50mm。 用于单独控制和调整对置电极5.x的每个单个电流供应单元15.x的装置19用于此目的。 所述装置19被构造成使得源自各种对置电极5.x的各个电流可以被设置为工作片3.x的被电解处理的表面区域的功能的值，只要它们是 位于相应的各个对电极5.x的正对面。

公开(公告)号：US20020148814A1

公开(公告)日：2002-10-17

申请号：US10108425

申请日：2002-03-29

申请人： ELENIX, INC.

发明人： Hiroshi Ishiwata ,  Tomoshige Ishiwata ,  Shigeharu Yokomichi

IPC分类号： B23H001/00 ,  B23H007/26 ,  B23H009/14 ,  B23H007/30

CPC分类号： B23H9/14 ,  B23H1/00 ,  B23H7/265

摘要： Disclosed is a method of depth-specific processing with a small hole electric discharge machine drill. Firstly, a specified processing depth A and tolerance null are registered with a program. Secondary, an origin of initiation of drilling is set on a surface of a workpiece by contacting a tip of an electrode D with the surface of the workpiece at a check point. Thirdly, the electrode is moved to a processing position to process until the specified processing depth. Fourthly, the electrode is moved to a position above the check point. Fifthly, the electrode is moved downward until the electrode contacts the surface of the workpiece, a Z-axis coordinate upon contact is defined as C. And finaly, a condition judgment is made concerning C which is found in the fifth step, as to whether or not nullCnullnullnull is satisfied. If the condition is satisfied, then processing is completed.

摘要翻译： 公开了一种利用小孔放电加工机钻深度特定处理的方法。 首先，在程序中注册指定的处理深度A和公差α。 次要地，通过在检查点处接触电极D的尖端与工件的表面，将钻孔开始的起点设置在工件的表面上。 第三，将电极移动到处理位置，直到指定的加工深度。 第四，将电极移动到检查点上方的位置。 第五，电极向下移动直到电极接触到工件的表面，接触后的Z轴坐标被定义为C.最后，对第五步中发现的C进行条件判断，判断是否 或不满足| C | <=α。 如果满足条件，则处理完成。

公开(公告)号：US20040238497A1

公开(公告)日：2004-12-02

申请号：US10483829

申请日：2004-07-23

发明人： Titus Meister ,  Johann Bermann ,  Anton Fischer ,  Max Schmidtner

IPC分类号： B23H007/26

CPC分类号： B23H9/14 ,  B21J15/50 ,  B23H9/00

摘要： Spark erosion system for removing connection elements from a structure (W, 60), having a drill head (3) null(4)nullnull, a rotational drive (10) by means of which a tool is caused to rotate, a positioning system (15) for moving the tool as well as a process control (48) for controlling the overall system, the system comprising an energy unit (30) and an electric circuit, and in that, furthermore, the tool is a tube electrode (5) through whose interior (5a) a dielectric can be guided to the surface (61a) of the connection element (61) to be detached, which surface (61a) faces the interior (7a), in order to cause a voltage between the tube electrode (5) and the connection element (61) to be detached, for implementing a spark erosion.

摘要翻译： 用于从具有钻头（3）[（4）]的结构（W，60）上移除连接元件的火花侵蚀系统，通过其旋转工具的旋转驱动装置（10），定位系统 （15）以及用于控制整个系统的过程控制（48），所述系统包括能量单元（30）和电路，并且此外，工具是管电极（5） ）通过其内部（5a）电介质可以被引导到所述连接元件（61）的待分离的表面（61a），该表面（61a）面向内部（7a），以便在管 电极（5）和要拆卸的连接元件（61），以实现火花侵蚀。

公开(公告)号：US20040140227A1

公开(公告)日：2004-07-22

申请号：US10469830

申请日：2004-02-12

发明人： Christophe Mazzara ,  Nathalie El Khiati ,  Joana Girard

IPC分类号： B23H007/26

CPC分类号： C25F3/14 ,  H01J9/02 ,  H01J2217/49207

摘要： A process for electrochemically etching a layer (11) with electric conduction properties, of the doped metal oxide type, on a transparent substrate (10) of the glass type, fitted with a mask capable of being removed after etching, and the process consisting in: bringing at least one region (13) to be etched of the layer into contact with an electrically conducting solution (20), immersing an electrode (30) in the solution (20) and in placing it facing and at a distance (d) from the region (13), applying an electrical voltage (U) between the electrode (30) and the layer (11) to be etched, characterized in that the electrode has an oblong shape such that the etching is carried out on several regions of the layer over a width l of the substrate.

摘要翻译： 一种用于在玻璃类型的透明基板（10）上电化学蚀刻具有导电性质的层（11）的掺杂金属氧化物类型的方法，其中装配有能够在蚀刻之后被去除的掩模，并且该工艺由 使至少一个被蚀刻的区域（13）与导电溶液（20）接触，将电极（30）浸入溶液（20）中并将其放置在距离（d）处， 从所述区域（13）中，在所述电极（30）和所述被蚀刻层（11）之间施加电压（U），其特征在于，所述电极具有长方形形状，使得所述蚀刻在 该层在衬底的宽度l上。

公开(公告)号：US20020153246A1

公开(公告)日：2002-10-24

申请号：US10120570

申请日：2002-04-10

发明人： Hui Wang

IPC分类号： C25C007/00 ,  C25F007/00 ,  C25B009/00 ,  C25D017/04 ,  C25D017/06 ,  C25D017/16 ,  C25F003/00 ,  B23H005/00 ,  B23H007/00 ,  B23H007/26 ,  B23H009/00 ,  B23H003/00 ,  B23H011/00 ,  H01L021/00 ,  H05K003/07

CPC分类号： H01L21/32115 ,  C25F3/22 ,  C25F7/00 ,  H01L21/32134 ,  H01L21/7684

摘要： An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.

摘要翻译： 用于电抛光晶片的装置包括晶片卡盘和静止射流。 晶片卡盘配置成旋转和平移晶片。 固定喷射器构造成当晶片被晶片卡盘平移和旋转时，将电解质施加到晶片。

公开(公告)号：US20020050452A1

公开(公告)日：2002-05-02

申请号：US09811261

申请日：2001-03-16

发明人： Martin Bleck ,  Kenneth C. Haugan ,  Larry R. Radloff ,  Harry Geyer

IPC分类号： C25C007/00 ,  C25F007/00 ,  B23H007/26 ,  C25B009/00 ,  B23H011/00 ,  C25D017/04 ,  C25D017/06 ,  C25D017/16

CPC分类号： H01L21/68728 ,  H01L21/68785

摘要： A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece. Thereafter, the workpiece is exposed to desired semiconductor processing conditions.

摘要翻译： 用于处理半导体工件的半导体工件保持件包括可操作地安装以将工件支撑在适于处理的工件的工件支撑件。 手指组件可操作地安装在工件支撑件上并且包括指尖。 手指组件可在指尖接合工件的接合位置和指尖从工件移开的脱离位置之间移动。 优选地，至少一个电极形成指状组件的一部分，并且包括用于接触所述工件的表面的电极接触。 至少一个护套覆盖至少一些电极接触。 根据本发明的一个方面，具有护套电极末端的护套电极以与所述护套电极末端接合工件表面的方式抵靠半导体工件表面定位。 围绕电极末端的周边形成密封，并且电极末端与工件接合，对工件进行所需的电接触。 此后，将工件暴露于期望的半导体加工条件。

公开(公告)号：US20040256363A1

公开(公告)日：2004-12-23

申请号：US10854370

申请日：2004-05-27

发明人： Tong-Han Lin

IPC分类号： B23H001/04 ,  B23H007/26

CPC分类号： B23H9/14 ,  B23H7/265

摘要： An EDM drill comprised of an automated electrode tube replacing means to allow fully automated and continuous working on holes; and further comprised of an electrode tube guide selection device to allow fully automated and continuous working on holes of various diameters.

摘要翻译： 一种EDM钻头，包括一个自动电极管更换装置，可以完全自动化和连续地加工在孔上; 并且还包括电极管引导件选择装置，以允许对各种直径的孔进行全自动和连续的加工。

公开(公告)号：US20040169016A1

公开(公告)日：2004-09-02

申请号：US10793230

申请日：2004-03-05

申请人： TOSHIBA KIKAI KABUSHIKI KAISHA

发明人： Sakashi Adachi ,  Koji Katsumata

IPC分类号： B23H007/26

CPC分类号： B23Q5/10 ,  B23Q5/043 ,  B23Q5/045 ,  Y10T408/65 ,  Y10T409/30448 ,  Y10T409/309296 ,  Y10T409/309352 ,  Y10T409/30952 ,  Y10T483/1736

摘要： A tool attachable to a spindle of a machine tool by an automatic tool changer in the same way as an ordinary tool, capable of being driven without connecting with an external power supply etc., and able to rotate at a rotational speed different from than that of the spindle of the machine tool without supply of electric power from the outside, provided with a machining tool for machining a workpiece, a motor connected with the machining tool and rotating the machining tool, and a generator to which rotary force is transmitted from the spindle of the machine tool and generating electric power to drive the motor, the shaft of the motor being arranged in an orientation different from the axial center of the spindle.

摘要翻译： 一种通过自动换刀装置与机床主轴连接的工具，与普通工具相同，能够不与外部电源等连接而被驱动，能够以不同于外部电源的转速旋转。 的机床的主轴而不从外部供给电力，设置有用于加工工件的加工工具，与该加工工具连接的马达和使该加工工具旋转的发电机以及从该转子传递旋转力的发电机 机床的主轴并产生电力来驱动电动机，电机的轴以不同于主轴的轴心的方向布置。

公开(公告)号：US20040035835A1

公开(公告)日：2004-02-26

申请号：US10064803

申请日：2002-08-19

发明人： Balasubramanian Srikantiah Kowdley ,  Frank Ortega ,  James Edward Kasik ,  Terry Lynn Chapman

IPC分类号： B23H007/26 ,  B23H009/00

CPC分类号： B23H9/00 ,  B23H1/10 ,  G21C17/01 ,  G21C17/017 ,  G21Y2002/303 ,  G21Y2002/304 ,  G21Y2004/40 ,  G21Y2004/501 ,  G21Y2004/504

摘要： An electric discharge machining sampling apparatus for obtaining samples from a surface of metal components provided. In an exemplary embodiment, the sampling apparatus is operable underwater and includes a base plate and an electrode assembly movably coupled to the base plate. The electrode assembly includes an electric discharge electrode and an electrode holder with the electrode including at least one bore extending therethrough. The sampling apparatus also includes a particle collection assembly operatively coupled to the electrode. Each electrode bore is in flow communication with the particle collection assembly.

摘要翻译： 一种用于从提供的金属部件的表面获得样品的放电加工取样装置。 在示例性实施例中，采样设备在水下可操作并且包括基板和可移动地联接到基板的电极组件。 电极组件包括放电电极和电极保持器，其中电极包括延伸穿过其中的至少一个孔。 采样设备还包括可操作地耦合到电极的颗粒收集组件。 每个电极孔与颗粒收集组件流动连通。

公开(公告)号：US20030019744A1

公开(公告)日：2003-01-30

申请号：US10169058

申请日：2002-07-17

发明人： Joachim Pokorny

IPC分类号： C25C007/00 ,  C25F007/00 ,  B23H007/26

CPC分类号： H01L21/68721 ,  H01L21/68785

摘要： The invention relates to a substrate holder (1) for holding substrates (5), especially semiconductor wafers. The inventive holder comprises first and second components (3, 4). The substrate (5) can be received between said components. The invention is characterized in that the first component (3) is provided with a base body (7) and at least one support element (70) which can be moved in relation to said body and is elastically pre-stressed in the direction of the second component (4).

摘要翻译： 本发明涉及用于保持基板（5），特别是半导体晶片的基板支架（1）。 本发明的保持器包括第一和第二部件（3,4）。 基板（5）可以被接收在所述部件之间。 本发明的特征在于，第一部件（3）设置有基体（7）和至少一个支撑元件（70），该支撑元件可以相对于所述主体移动并且沿着该方向弹性预应力 第二组分（4）。