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公开(公告)号:US11386545B2
公开(公告)日:2022-07-12
申请号:US16836596
申请日:2020-03-31
申请人: The Boeing Company
IPC分类号: G06T7/00 , G01N25/72 , G01J5/59 , G06V10/60 , G06V10/145 , G01J5/00 , G02B5/30 , G06V10/147
摘要: A method of thermographic inspection is disclosed, including applying a thermal pulse to a surface and capturing an image of a thermal response of the surface. The image is captured with an infrared camera through a polarizer having a first orientation. The method further includes determining, by analysis of the image, whether the thermal response is indicative of a crack on the surface.
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公开(公告)号:US11573128B2
公开(公告)日:2023-02-07
申请号:US16467651
申请日:2017-12-04
发明人: Hiroyuki Sasaki , Masaru Sugiyama
摘要: An object of the present invention is to provide a radiation temperature measuring device capable of preventing reduction in the accuracy of temperature measurement due to an electromagnetic wave reflected by a measurement target. A radiation temperature measuring device includes a reflective polarizing plate configured to reflect a polarized wave of one direction in an electromagnetic wave radiated from an object to be measured and transmit or absorb a polarized wave of a direction perpendicular to the one direction and an infrared sensor configured to detect the polarized electromagnetic wave of the one direction reflected by the reflective polarizing plate.
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公开(公告)号:US11454543B2
公开(公告)日:2022-09-27
申请号:US16769391
申请日:2018-12-03
发明人: Sylvain Perrot
IPC分类号: G01J5/00 , G01J5/0806 , G01J5/0821 , G01J5/08 , G01J5/59 , G01J5/0802 , G01J5/0808
摘要: An apparatus for measuring surface temperature of a substrate being illuminated by a pulsed light beam configured to heat the substrate and by a beam of probing light, wherein the heated substrate emits a radiated beam of thermal radiation, wherein the apparatus includes an optical system configured to collect the radiated beam and a reflected beam of probing light propagating in substantially close directions, wherein the collected radiated beam and the collected reflected beam are separately routed to a respective detector via a respective routing element, the respective detectors being configured to measure the intensity of the collected radiated beam and collected reflected beam simultaneously and at the same wavelength, wherein the surface temperature is calculated based on the collected radiated beam and on the collected reflected beam.
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公开(公告)号:US20230094677A1
公开(公告)日:2023-03-30
申请号:US17754930
申请日:2019-10-16
申请人: Waymo LLC
发明人: Benjamin Frevert , Zachary Morriss
摘要: The present disclosure relates to systems, vehicles, and methods relating to imaging and object detection using polarization-based detection of infrared light. An example system includes at least one infrared detector configured to detect infrared light corresponding to a target object within a field of view. The infrared light includes at least one of a first polarization or a second polarization. The system also includes a controller configured to carry out operations. The operations include receiving, from the at least one infrared detector, information indicative of infrared light corresponding to the target object. The operations also include determining, based on the received information, a polarization ratio corresponding to the target object. The polarization ratio comprises a first polarization intensity divided by a second polarization intensity. The operations also include determining, based on the polarization ratio, that the infrared light corresponding to the target object comprises direct light or reflected light.
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公开(公告)号:US11371888B2
公开(公告)日:2022-06-28
申请号:US16570636
申请日:2019-09-13
发明人: Stanley Pau
IPC分类号: H04N5/33 , G01J5/0802 , G02B5/20 , G01J5/08 , G01J5/0821 , G02B27/28 , G01J5/10 , H04N9/07 , G01J5/59 , G02B6/08 , G01J5/00
摘要: A polarization and color sensitive pixel device and a focal plane array made therefrom. Each incorporates a thick color/polarization filter stack and microlens array for visible (0.4-0.75 micron), near infrared (0.75-3 micron), mid infrared (3-8 micron) and long wave infrared (8-15 micron) imaging. A thick pixel filter has a thickness of between about one to 10× the operational wavelength, while a thick focal plane array filter is on the order of or larger than the size or up to 10× the pitch of the pixels in the focal plane array. The optical filters can be precisely fabricated on a wafer. A filter array can be mounted directly on top of an image sensor to create a polarization camera. Alternatively, the optical filters can be fabricated directly on the image sensor.
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