摘要:
A quantum well infrared focal plane array achieves hyper-spectral measurements of incident infrared radiation using a voltage dividing network that applies different and adjustable biasing voltages to each line of the line by column array. The peak wavelengths of each quantum well layer of each detector structure in the array is set to a specified nominal value by appropriate fabrication of the depths of the quantum wells of the layers. The nominal peak wavelength value of each quantum well layer can further be varied by modulating the bias voltage applied to the gate of the direct injection transistor associated with each detector structure of the array. A read out integrated circuit (ROIC) containing the direct injection transistor processes the photo-current from each quantum well layer of each detector structure. Using an n by n array of vertically stacked detector structures, along with the associated ROIC, a focal plane array can be fabricated where each row of detector elements in the array is responsive to different peak wavelengths.
摘要:
A differential response light-receiving device comprising: a semiconductor electrode comprising an electrically conductive layer and a photosensitive layer containing a semiconductor sensitized by a dye; an ion-conductive electrolyte layer; and a counter electrode, the differential response light-receiving device making time-differential response to quantity of light to output a photoelectric current. A composite light-receiving device comprising the differential response light-receiving device and a stationary response light-receiving device, and an image sensor using the differential response light-receiving device or the composite light-receiving device are also provided.
摘要:
Microstructure for bolometer for high infrared sensitivity and detectivity having a corrugated air bridge microstructure which provides a large area, low infrared reflection and large infrared absorption so as to increase the sensitivity and detectivity.
摘要:
At a face of a silicon semiconductor substrate tilted about one degree from a [100] orientation, a readout integrated circuit (ROIC) is implemented, specially designed and fabricated for direct epitaxial growth. Layers of II-VI semiconductor material, preferably including layers of HgCdTe of different bandgaps, are successively and monolithically grown on the face by molecular beam epitaxy (MBE) within a window masking the face and then patterned and wet-etched to create mesas of two-color detector elements in an array. Preferably a beginning buffer layer of CdTe is grown to minimize crystalline mismatch between the Si and the HgCdTe. Sloped sidewalls of the mesas ensure good step coverage of the conductive interconnects from the detector elements to the ROIC.
摘要:
A two-color photodetector for detecting two different bands of infrared radiation is described. The photodetector includes either a diffractive resonant optical cavity that resonates at the two colors of interest, or a diffractive resonant optical cavity that resonates at the first color and a vertical resonant optical cavity that resonates at the second color. By placing materials that absorb only one of the two colors at the appropriate locations within the resonate structure, the resultant signals include little cross-talk due to the opposite color. The two-color photodetector finds use in applications covering a wide portion of the infrared spectrum.
摘要:
A method of fabricating an infrared detector, a method of controlling the stress in a polycrystalline SiGE layer and an infrared detector device is disclosed. The method of fabricating includes the steps of forming a sacrificial layer on a substrate; patterning said sacrificial layer; establishing a layer consisting essentially of polycrystalline SiGe on said sacrificial layer; depositing an infrared absorber on said polycrystalline SiGe layer; and thereafter removing the sacrificial layer. The method of controlling the stress in a polycrystalline SiGe layer deposited on a substrate is based on varying the deposition pressure. The infrared detector device comprises an active area and an infrared absorber, wherein the active area comprises a polycrystalline SiGe layer, and is suspended above a substrate.
摘要:
A thermal-type infrared imaging device includes a first thermo-electric converting element (101) for generating an electric signal which corresponds to temperature determined according to heat generated by absorbing an incident infrared ray, a first bipolar transistor (102) having its emitted connected to the first thermo-electric converting element (101), and a second bipolar transistor (104) having its collector connected to the collector of the first bipolar transistor (102). The thermal-type infrared imaging device further includes a resistor (103) connected at one end thereof to a power supply and at the other end to the emitter of the second bipolar transistor (104), and an integration capacitor (105) connected to a connecting point of the respective collectors of the first and second bipolar transistor (102 and 104).
摘要:
An array of infrared sensitive bolometric detectors. The bolometers are connected across row and column readout lines. Integrated on the array are column signal processors that measure the resistance of each bolometer. Each column signal processor stores the output of a bolometer on an integrator. The array is temperature stabilized to a predetermined temperature to keep bolometer response within a predetermined bandwith.
摘要:
A bolometric heat detector having an active part composed of at least two coplanar electrodes (8, 10) placed in electrical contact with a first thin semiconducting layer (6), doped by a first doping agent with a first type of conductivity. There is a second thin semiconducting layer (4) doped like the first layer or undoped, and a third thin semiconducting layer (2) doped by a second doping agent with a second type of conductivity opposed to the first. The second layer (4) is placed between the first (6) and the third (2) layers.
摘要:
A three-level infra-red bolometer includes an active matrix level, a support level, a pair of posts and an absorption level. The active matrix level includes a substrate having an integrated circuit, a pair of connecting terminals and a protective layer covering the substrate. The support level includes a pair of bridges, each of the bridges being provided with a conduction line formed on top thereof, wherein one end of the conduction line is electrically connected to the respective connecting terminal. The absorption level includes a serpentine bolometer element surrounded by an absorber made of silicon oxide (SiO2) or silicon oxy-nitride (SiOxNy). Each of the posts includes an electrical conduit surrounded by an insulating material and is placed between the absorption level and the bridge, in such a way that the serpentine bolometer element is electrically connected to the integrated circuit through the electrical conduit, the conduction line and the connecting terminal.
摘要翻译:三级红外辐射热分析仪包括有源矩阵水平,支持水平,一对柱和吸收水平。 有源矩阵电平包括具有集成电路的基板,一对连接端子和覆盖该基板的保护层。 支撑级包括一对桥,每个桥设置有形成在其顶部的导线,其中导线的一端电连接到相应的连接端子。 吸收水平包括由氧化硅(SiO 2)或氮氧化硅(SiO x N y)制成的吸收体包围的蛇形测辐射热计元件。 每个柱包括由绝缘材料包围并且被放置在吸收水平和桥之间的电导管,使得蛇形测辐射热计元件通过电导线,导线和 连接端子。