Monolithic metal-insulator transition device and method for manufacturing the same

    公开(公告)号:US11908931B2

    公开(公告)日:2024-02-20

    申请号:US17499736

    申请日:2021-10-12

    IPC分类号: H01L29/78 H10N99/00

    CPC分类号: H01L29/7817 H10N99/03

    摘要: Provided is a monolithic metal-insulator transition device. The monolithic metal-insulator transition device includes a substrate including a driving region and a switching region, first and second source/drain regions on the driving region, a gate electrode between the first and second source/drain regions, an inlet well region formed adjacent to an upper surface of the substrate on the switching region, a control well region having a different conductivity type from the inlet well region between the inlet well region and a lower surface of the substrate, a first wiring electrically connecting the first source/drain region and the control well region, and a second wiring electrically connecting the second source/drain region and the inlet well region.

    COUPLED QUANTUM DOTS WITH SELF-ALIGNED GATES

    公开(公告)号:US20240196767A1

    公开(公告)日:2024-06-13

    申请号:US18063969

    申请日:2022-12-09

    IPC分类号: H10N99/00

    CPC分类号: H10N99/05

    摘要: A method for forming a semiconductor structure comprising quantum dots with self-aligned gate structures is disclosed. The method comprises structuring a doped silicon-on-isolator to build a source area, a linear structure extending from the source area having at least two distinct broadened areas, a first and a second gate structure simultaneously by a single lithography process; covering the structures with a blanket oxide layer, forming an opening in the blanket oxide layer at a lateral end of the linear structure, etching back the linear structure and the at least two distinct broadened areas below the blanket oxide until the source area is reached, and filling the hollow template with a semiconductor material different to the silicon such that the at least two broadened areas build quantum dot areas.

    Individually tunable quantum dots in all-van der waals heterostructures

    公开(公告)号:US11839167B2

    公开(公告)日:2023-12-05

    申请号:US17134953

    申请日:2020-12-28

    IPC分类号: H01L49/00 G06N10/00 H10N99/00

    CPC分类号: H10N99/05 G06N10/00 H10N99/03

    摘要: Apparatus, methods, and systems are disclosed for robust scalable topological quantum computing. Quantum dots are fabricated as van der Waals heterostructures, supporting localized topological phases and non-Abelian anyons (quasiparticles). Large bandgaps provide noise immunity. Three-dot structures include an intermediate quantum dot between two computational quantum dots. With the intermediate quantum dot in an OFF state, quasiparticles at the computational quantum dots can be isolated, with long lifetimes. Alternatively, the intermediate quantum dot can be controlled to decrease the quasiparticle tunneling barrier, enabling fast computing operations. A computationally universal suite of operations includes quasiparticle initialization, braiding, fusion, and readout of fused quasiparticle states, with, optionally, transport or tunable interactions—all topologically protected. Robust qubits can be operated without error correction. Quasilinear arrays of quantum dots or qubits can be scaled arbitrarily, up to resource limits, and large-scale topological quantum computers can be realized. Extensive two-dimensional arrays can also be used.

    PIEZORESISTIVE TRANSISTOR DEVICE AND POWER ELECTRONIC MODULE INCLUDING A PIEZORESISTIVE TRANSISTOR DEVICE

    公开(公告)号:US20240090355A1

    公开(公告)日:2024-03-14

    申请号:US18454852

    申请日:2023-08-24

    IPC分类号: H10N99/00

    CPC分类号: H10N99/03

    摘要: A piezoresistive transistor device includes a first transistor cell having a first piezoelectric material body and a first piezoresistive material body arranged in a stacked configuration. A first electrical resistance of the first piezoresistive material body is dependent upon a voltage applied across the first piezoelectric material body by way of a pressure applied by the first piezoelectric material body to the first piezoresistive material body. A second transistor cell includes a second piezoelectric material body and a second piezoresistive material body arranged in a stacked configuration. A second electrical resistance of the second piezoresistive material body is dependent upon a voltage applied across the second piezoelectric material body by way of a pressure applied by the second piezoelectric material body to the second piezoresistive material body. An internal electrical interconnect is configured to electrically connect the first electrical resistance and the second electrical resistance in series or in parallel.