WORK POLISHING APPARATUS AND WORK POLISHING METHOD

    公开(公告)号:US20240091898A1

    公开(公告)日:2024-03-21

    申请号:US18457421

    申请日:2023-08-29

    发明人: Yosuke KANAI

    IPC分类号: B24B7/10 B24B51/00

    CPC分类号: B24B7/10 B24B51/00

    摘要: In a work polishing apparatus, a polishing head including a head base portion, in an upper portion, to which a vertically movable and rotatable head shaft is fixed, and a holding member, in a lower portion, having a lower surface on which a work is held, is provided with, on the upper surface side of the holding member, a vertically movable partitioning portion and first and second fluid chambers respectively on the inner and outer circumference sides of the partitioning portion. Pressure in the first fluid chamber and in the second fluid chamber can be independently increased or decreased. The partitioning portion can be lowered at least to a position where the first fluid chamber and the second fluid chamber are partitioned such that a pressure difference can be produced between the interior of the first fluid chamber and the interior of the second fluid chamber.

    DOUBLE-SIDE OR ONE-SIDE MACHINING MACHINE

    公开(公告)号:US20220097205A1

    公开(公告)日:2022-03-31

    申请号:US17486192

    申请日:2021-09-27

    IPC分类号: B24B51/00 B24B7/10

    摘要: A machining machine comprises a first support disk, a first working disk coupled to the first support disk, and a counter bearing element positioned to define a working gap between the first working disk and the counter bearing element. The first working disk and the counter bearing element are configured to rotate relative to each other to machine at least one side of a flat workpiece. A pressure volume is positioned between the first support disk and the first working disk and is configured to hold a pressure fluid, which generates a pressure configured to deform the first working disk. One or more temperature-controlling channels are positioned within the first working disk and configured to hold a temperature-controlling fluid that is configured to control a temperature of the first working disk, wherein the one or more temperature-controlling channels are fluidly separate from the pressure volume.

    GRINDING DISK
    4.
    发明申请
    GRINDING DISK 审中-公开

    公开(公告)号:US20200230772A1

    公开(公告)日:2020-07-23

    申请号:US16744495

    申请日:2020-01-16

    发明人: Claude Tremblay

    IPC分类号: B24B7/10 B24D7/06

    摘要: This invention relates to a grinding wheel comprising a frame including a generally circular shape and adapted to rotate about a rotation axis thereof and a plurality of grinding assemblies radially located on the frame, each of the grinding assembly comprising a depth control element, a cutting element and a chip management element.

    Method and device for removing material from a substrate

    公开(公告)号:US10259094B2

    公开(公告)日:2019-04-16

    申请号:US15425579

    申请日:2017-02-06

    IPC分类号: B24B7/10 B64F5/40

    摘要: A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

    FLUSH GRINDER BIT
    6.
    发明申请
    FLUSH GRINDER BIT 审中-公开
    冲孔磨床

    公开(公告)号:US20160082532A1

    公开(公告)日:2016-03-24

    申请号:US14864359

    申请日:2015-09-24

    申请人: Ali W. Eldessouky

    发明人: Ali W. Eldessouky

    IPC分类号: B23D61/18 B24B7/10 B23B51/10

    CPC分类号: B23D61/18 B24B7/10

    摘要: A flush cut grinder tool bit made of an elongated cylindrical shape with an inwardly facing saw blade within the inner diameter of the elongated cylindrical shape that can be sleeved over a protruding object, such that the cutting saw blade portion of the tool bit is inside the cylindrical tool bit so that when it is sleeved over a protruding object, moving the tool bit back and forth over the protruding object will cut the protruding object off at the surface. The body of the drill bit terminates at its distal end with a flush flange having saw teeth therein, and may include a bit shank suspended in the middle of a drill bit body by spokes or a solid surface radially extending from said bit shank. A method of using such a flush cut grinder tool bit is included.

    摘要翻译: 一种平面切割研磨工具钻头,其由细长的圆柱形形状制成,在细长圆柱形形状的内径内具有向内的锯片,其可以套在突出物体上,使得刀头的切割锯片部分位于 圆柱形工具钻头,使得当它被套在突出的物体上时,使工具钻头在突出物体上来回移动将在表面处切断突出物体。 钻头的主体在其远端处具有其中具有锯齿的齐平凸缘,并且可以包括通过辐条或从所述钻头柄径向延伸的固体表面悬挂在钻头体的中间的钻头柄。 包括使用这种冲切切割研磨工具钻头的方法。

    Hammer union restoration apparatus
    7.
    发明授权
    Hammer union restoration apparatus 有权
    锤联合修复装置

    公开(公告)号:US09174320B1

    公开(公告)日:2015-11-03

    申请号:US14120520

    申请日:2014-05-28

    申请人: Kevin R. Meyer

    发明人: Kevin R. Meyer

    IPC分类号: B24B21/02 B24B7/10

    摘要: The present invention relates to a hammer union restoration apparatus wherein a main sanding unit is mounted to a base. The main sanding unit including a sander for sanding the four side faces of a lug formed on the hammer union. The sander being resiliently movable in a direction away from a side face of the lug. The sander is movable under control of a motor to rotate the sander relative to the lug around the four faces of the lug with the sander floating across the corner edges of the four faces. The present invention further includes a sander for sanding the end face of the lug.

    摘要翻译: 本发明涉及一种锤组合修复装置,其中主砂磨装置安装在底座上。 主打磨单元包括砂磨机,用于打磨在锤结合体上形成的凸耳的四个侧面。 砂光机可以在远离凸耳的侧面的方向上弹性移动。 砂光机可以在电动机的控制下移动,以使磨砂机相对于凸耳四周的凸缘旋转,砂磨机漂浮在四个面的拐角边缘上。 本发明还包括一个砂光机,用于打磨凸耳的端面。

    FABRICATION METHOD OF SEMICONDUCTOR DEVICE AND CHEMICAL MECHANICAL POLISHING APPARATUS
    8.
    发明申请
    FABRICATION METHOD OF SEMICONDUCTOR DEVICE AND CHEMICAL MECHANICAL POLISHING APPARATUS 有权
    半导体器件的制造方法和化学机械抛光装置

    公开(公告)号:US20120302064A1

    公开(公告)日:2012-11-29

    申请号:US13481046

    申请日:2012-05-25

    申请人: Ryota KOJIMA

    发明人: Ryota KOJIMA

    摘要: A method of fabricating a semiconductor device includes dressing a surface of a polishing pad with a conditioning disk held by an arm while rotating a platen that holds the polishing pad in a chemical mechanical polishing apparatus, wherein the dressing is performed by pressing the conditioning disk to the polishing pad, and rotating the arm around a rotational axis of the arm thereby to move the conditioning disk substantially along a radius direction of the platen between a center part and a circumferential part of the platen, and wherein torque N applied to the arm is measured at plural positions of the conditioning disk along the substantial radius direction during the dressing, and it is determined whether maintenance to the arm is necessary in accordance with an average value of the measured torques N and a fluctuation range Y of the measured torques N.

    摘要翻译: 一种制造半导体器件的方法包括:在由化学机械抛光装置旋转将保持抛光垫的压板旋转的同时,用由臂保持的调节盘来修整抛光垫的表面,其中通过将调节盘按压 抛光垫,并且围绕臂的旋转轴线旋转臂,从而基本上沿着压板的中心部分和圆筒部分之间的压板的半径方向移动调节盘,并且其中施加到臂的扭矩N是 在修整期间沿着大致半径方向在调节盘的多个位置处测量,并且根据测量转矩N的平均值N和测量的扭矩N的波动范围Y来确定是否需要对臂的维护 扭矩N.

    GRINDING MACHINE
    9.
    发明申请
    GRINDING MACHINE 失效
    磨床

    公开(公告)号:US20110092139A1

    公开(公告)日:2011-04-21

    申请号:US12906542

    申请日:2010-10-18

    IPC分类号: B24B7/10

    摘要: A first angular grinding wheel and a straight grinding wheel having rotation axes parallel to each other are arranged on a swivel slide that turns about a turning axis. A reference symmetry plane (MA) that is parallel to a grinding wheel rotation axis and that includes the turning axis and a reference perpendicular plane (MB) that is perpendicular to the reference symmetry plane and that includes the turning axis are defined. A grinding reference point (PA1) of the first angular grinding wheel (TA1) and a grinding reference point (PP1) of the straight grinding wheel (TP1) are arranged asymmetrical with respect to the reference symmetry plane. A distance from the grinding reference point of the straight grinding wheel to the reference symmetry plane is equal to a distance from the grinding reference point of the first angular grinding wheel to the turning axis.

    摘要翻译: 具有相互平行的旋转轴线的第一角磨轮和直磨轮布置在围绕转动轴转动的旋转滑块上。 定义了平行于研磨轮旋转轴并且包括转动轴线和垂直于参考对称平面且包括转动轴线的参考垂直平面(MB)的参考对称平面(MA)。 第一角磨轮(TA1)的磨削基准点(PA1)和直磨轮(TP1)的研磨基准点(PP1)相对于参考对称平面不对称地布置。 从直磨砂轮的磨削基准点到参考对称平面的距离等于从第一角磨轮的研磨基准点到转动轴的距离。

    CD repair apparatus
    10.
    发明授权
    CD repair apparatus 失效
    CD修复设备

    公开(公告)号:US07645184B2

    公开(公告)日:2010-01-12

    申请号:US12004317

    申请日:2007-12-19

    申请人: Farzad Saghian

    发明人: Farzad Saghian

    IPC分类号: B24B7/10

    CPC分类号: B24B29/04 G11B23/505

    摘要: An apparatus for the repair and resurfacing of compact discs using a motorized, abrasive surface.

    摘要翻译: 一种用于使用电动的研磨表面修复和重新铺展光盘的装置。