THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION
    2.
    发明申请
    THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION 审中-公开
    用于光刻应用的热固化底层

    公开(公告)号:WO02073307A3

    公开(公告)日:2002-11-21

    申请号:PCT/US0207136

    申请日:2002-03-07

    CPC classification number: G03F7/094 G03F7/091

    Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the formula (I) wherein R is H or methyl; R is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, Cl-4 alkyl or C1-4 alkoxy; R is a hydroxyl functionalized Cl-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [-R O-]p ; R is a Cl-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-Cl4 aryl, or substituted or unsubstituted C7-Cl5 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

    Abstract translation: 用于平版印刷的热固化的底涂层,所述热固化的组合物包含含羟基的聚合物,氨基交联剂和热酸产生剂,其中所述含羟基的聚合物是包含式(m)的单元m,n和o的聚合物 I)其中R 1是H或甲基; R 2是取代或未取代的C 6 -C 14芳基丙烯酸酯或C 6 -C 14芳基甲基丙烯酸酯基团,其中取代基团可以是苯基,C 1-4烷基或C 1-4烷氧基; R 3是羟基官能化的C 1 -C 8烷基丙烯酸酯,甲基丙烯酸酯或C 6 -C 14芳基,R 4是C 1 -C 10直链或支链亚烷基; p为1至5的整数,条件是[-R 4 O-] p中不超过30个碳原子; R 5为C 1 -C 10直链,支链或环状烷基,取代或未取代的C 6 -C 14芳基或取代或未取代的C 7 -C 15脂环烃; m约为40-70,n约为15-35,o约为15-25。

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