Abstract:
The present invention relates to an applicator arrangement comprising base support arrangement, a supply unit for supply of coating liquid/slurry, an applicator device, and a metering device, wherein said supply unit comprises a distribution pipe which is supported on said support body by means of a bearing arrangement arranged to enable axial expansion and contraction of said distribution pipe.
Abstract:
Methods for adjusting the topography of a surface, such as for making a support surface substantially flat, e.g. for mitigating variations in a print gap, are described. The topography of the surface is first measured, and then a shim layer is printed to approximate the topography to a reference topography, the thickness of the layer being calculated using the measurements. For example the print gap comprising the distance between the surface of a printer table and printing means, such as a printhead. The print gap is first measured before at least one layer of ink is printed, using the printing means, at a selected position based on the measured print gap. The thickness of the layer of ink is selected to mitigate the variations in the print gap. In some embodiments, a substrate support surface may then be arranged over the printer table, so that the printed layer is disposed between the printer table and the substrate support surface. The apparatus can compensate for variations in the print gap due both to irregularities in the printer table surface and misalignment in mounting of the printing means. Also described is a printer table produced according to the methods described.
Abstract:
Methods for adjusting the topography of a surface, such as for making a support surface substantially flat, e.g. for mitigating variations in a print gap, are described. The topography of the surface is first measured, and then a shim layer is printed to approximate the topography to a reference topography, the thickness of the layer being calculated using the measurements. For example the print gap comprising the distance between the surface of a printer table and printing means, such as a printhead. The print gap is first measured before at least one layer of ink is printed, using the printing means, at a selected position based on the measured print gap. The thickness of the layer of ink is selected to mitigate the variations in the print gap. In some embodiments, a substrate support surface may then be arranged over the printer table, so that the printed layer is disposed between the printer table and the substrate support surface. The apparatus can compensate for variations in the print gap due both to irregularities in the printer table surface and misalignment in mounting of the printing means. Also described is a printer table produced according to the methods described.
Abstract:
Die Erfindung betrifft eine Vorrichtung zum flächigen Auftragen eines fließfähigen Mediums (21) auf eine Materialbahn (24), welche eine in Längsrichtung der Materialbahn (24) sich auf einer Bahnseite zumindest abschnittsweise erstreckende Erhöhungen (29) aufweist, mit einer Auftragsvorrichtung (12), welche ein Dosierrakel (14) aufweist, wobei das Dosierrakel (14) zylinderförmig ausgebildet ist und quer zur Längsrichtung der Materialbahn (24) sich erstreckt und an dessen Außenumfang rechtwinklig zur Längsachse ausgerichtete Vertiefungen (31) aufweist, deren Kontur im Wesentlichen komplementär zu den durchzuführenden Erhöhungen (29) der Materialbahn (24) ausgebildet ist.
Abstract:
Vorrichtung zur Konservierung von Bauteilen mit einem Konservierungsmittel (51), insbesondere zur Hohlraumkonservierung von Kraftfahrzeugkarosseriebauteilen, wobei die Vorrichtung zusätzlich zu dem Konservierungsmittel (51) einen Härter (53) appliziert, der mit dem Konservierungsmittel (51) reagiert, was das Konservierungsmittel (51) aushärten lässt.
Abstract:
The method for coating a substrate (12) with a relatively thin, uniform film of a fluid (20) with a minimum of waste. A volume of fluid is produced and the size and velocity of the volume of fluid are selected such that the volumes of the fluid break upon impact (24) with the substrate without splashing or rippling. The apparatus and method are ideal for coating semiconductor wafers with a photoresist solution. The kenetic energy of the volume of fluid is adjusted to overcome the free energy associated with the surface tension on impact. The collision of the fluid thus results in a uniform, thin coating of photoresist or other coating solution which may then be further processed by conventional techniques.