公开(公告)号：WO01078456A1

公开(公告)日：2001-10-18

申请号：PCT/JP2001/003025

申请日：2001-04-09

IPC: H01L21/00 ,  H05B3/14 ,  H05B3/26 ,  H05B3/20 ,  H01L21/027 ,  H01L21/66 ,  H01L21/68

CPC classification number: H01L21/67103 ,  H05B3/143 ,  H05B3/265

Abstract: A ceramic heater for evenly heating a semiconductor wafer while preventing a short-circuit of a resistance heater, characterized in that an insulating layer having a volume resistivity higher than that of a ceramic substrate of the ceramic heater is formed on at least part of the surface of the ceramic substrate and a resistance heater is formed on the insulating layer.

Abstract translation: 一种用于均匀加热半导体晶片同时防止电阻加热器短路的陶瓷加热器，其特征在于，在表面的至少一部分上形成体积电阻率高于陶瓷加热器的陶瓷基片的体积电阻率的绝缘层 的陶瓷基板和电阻加热器形成在绝缘层上。

公开(公告)号：WO01063972A1

公开(公告)日：2001-08-30

申请号：PCT/JP2000/003080

申请日：2000-05-15

IPC: B23Q3/15 ,  H01L21/00 ,  H01L21/66 ,  H01L21/683 ,  H05B3/12 ,  H05B3/14 ,  H05B3/18 ,  H05B3/20 ,  H05B3/26 ,  H05B3/74 ,  B28B11/00 ,  H01L21/68 ,  H05B3/10 ,  H05B3/68

CPC classification number: H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H05B3/143 ,  H05B3/265 ,  H05B3/74

Abstract: A ceramic substrate including therein a conductor layer, having an excellent even temperature distribution and an excellent heat-impact resistance and chucked by a strong chucking force when electrostatic chuck is used, characterized in that the cross section of the edge of the conductor layer has a shape of a pointed head.

Abstract translation: 一种陶瓷基板，包括导体层，具有优异的均匀温度分布和优异的耐热冲击性，并且当使用静电卡盘时通过强力的夹持力卡住，其特征在于，导体层的边缘的横截面具有 尖头的形状。

公开(公告)号：WO01059833A1

公开(公告)日：2001-08-16

申请号：PCT/JP2001/000889

申请日：2001-02-08

IPC: H01L21/00 ,  H01L21/68 ,  H05B3/14 ,  H05B3/26 ,  H05B3/28 ,  C04B35/00 ,  H01L21/66 ,  H05B3/10 ,  H05B3/16 ,  H05B3/18 ,  H05B3/68

CPC classification number: H01L21/6835 ,  H01L21/67103 ,  H01L2924/19041 ,  H05B3/143 ,  H05B3/26 ,  H05B3/283 ,  H05B2203/002 ,  H05B2203/014 ,  H05B2203/017 ,  H05B2203/032 ,  Y10T428/21 ,  Y10T428/218

Abstract: A ceramic board so designed that a practically uniform temperature distribution can be imparted to its surface for processing a semiconductor wafer on the ceramic board. The ceramic board for semiconductor production and inspection devices is a ceramic board having a conductor on the surface or in the interior of the ceramic board, characterized in that the ceramic board contains oxygen and is in the form of a disk whose diameter exceeds 250 mm and whose thickness is 25 mm or less.

Abstract translation: 这样一种陶瓷板被设计成可以赋予其表面几乎均匀的温度分布来加工陶瓷板上的半导体晶片。 用于半导体生产和检查装置的陶瓷板是在陶瓷板的表面或内部具有导体的陶瓷板，其特征在于，所述陶瓷板包含氧并且其直径超过250mm的盘的形式， 其厚度为25mm以下。

公开(公告)号：WO01059816A1

公开(公告)日：2001-08-16

申请号：PCT/JP2000/008988

申请日：2000-12-19

IPC: H01L21/00 ,  H05B3/14 ,  H05B3/26 ,  H05B3/68 ,  H05B3/74 ,  H01L21/027

CPC classification number: H01L21/67109 ,  H01L21/67103 ,  H05B3/143 ,  H05B3/26 ,  H05B3/68 ,  H05B3/74 ,  H05B2203/002 ,  H05B2203/013 ,  H05B2203/016 ,  H05B2203/017

Abstract: A hot plate unit (1) capable of being cooled in short time without complicating a structure and increasing a size, comprising a hot plate (3) disposed at an opening part (4) of a casing (2A) and having resistance bodies (10), wherein a space (S1) allowing air to be passed there through is formed of the casing (2A) and the hot plate (3), and an inner bottom plate (41) is provided inside the casing (2A).

Abstract translation: 一种热板单元（1），其能够在短时间内冷却而不会使结构复杂化并增加尺寸，包括设置在壳体（2A）的开口部分（4）处并具有阻力体（10）的热板（3） ），其中通过壳体（2A）和热板（3）形成允许空气通过的空间（S1），并且在壳体（2A）内部设置有内底板（41）。

公开(公告)号：WO01031978A1

公开(公告)日：2001-05-03

申请号：PCT/JP2000/005462

申请日：2000-08-14

IPC: H01L21/00 ,  H05B3/14 ,  H05B3/26 ,  H05B3/20 ,  H05B3/10

CPC classification number: H01L21/67109 ,  H01L21/67103 ,  H05B3/143 ,  H05B3/265

Abstract: The invention provides a ceramic heater superior in the uniformity of temperature using a heater substrate made of high-heat-conductivity ceramic. A discoid ceramic heater (100) has circular heater patterns (2) of substantially equal width formed on or in the surface of a ceramic substrate (1).

Abstract translation: 本发明提供一种使用由高导热性陶瓷制成的加热器基板的温度均匀性优异的陶瓷加热器。 盘状陶瓷加热器（100）具有形成在陶瓷基板（1）的表面上或表面上的基本相等宽度的圆形加热器图案（2）。

公开(公告)号：WO00069220A1

公开(公告)日：2000-11-16

申请号：PCT/JP2000/002873

申请日：2000-05-01

IPC: H05B3/20 ,  H01B1/16 ,  H01B1/22 ,  H01C7/00 ,  H01L21/027 ,  H05B3/10 ,  H05B3/12 ,  H05B3/14 ,  H05B3/16 ,  H05B3/26 ,  H05B3/74

CPC classification number: H05B3/265 ,  H01B1/16 ,  H05B3/12 ,  H05B3/143 ,  H05B3/74

Abstract: A hot plate comprising a conductive pattern layer having little blisters and excellent adhesion. The hot plate (3) includes conductive pattern layers (10, 10a) provided on a nitride ceramic substrate (9) and made of bismuth, a bismuth oxide, glass frit, and noble metal particles.

Abstract translation: 一种包含导电图案层的热板，具有很小的起泡和优异的粘合性。 热板（3）包括设置在氮化物陶瓷基板（9）上并由铋，氧化铋，玻璃料和贵金属颗粒制成的导电图案层（10,10a）。

公开(公告)号：WO00069219A1

公开(公告)日：2000-11-16

申请号：PCT/JP2000/002749

申请日：2000-04-27

IPC: H01L21/00 ,  H05B3/12 ,  H05B3/14 ,  H05B3/26 ,  H05B3/68 ,  H05B3/74 ,  H05B3/16 ,  H05B3/20

CPC classification number: H01L21/67103 ,  H05B3/12 ,  H05B3/143 ,  H05B3/265 ,  H05B3/68 ,  H05B3/74

Abstract: A hot plate capable of uniformly heating objects, characterized in that a resistor having a thickness variation of +/- 3 mu m is formed on an insulator board.

Abstract translation: 一种能够均匀地加热物体的热板，其特征在于，在绝缘体板上形成厚度变化为+/-3μm的电阻器。

公开(公告)号：WO00069218A1

公开(公告)日：2000-11-16

申请号：PCT/JP2000/002874

申请日：2000-05-01

IPC: H05B3/20 ,  H01B1/22 ,  H01C7/00 ,  H01L21/027 ,  H05B3/10 ,  H05B3/12 ,  H05B3/14 ,  H05B3/16 ,  H05B3/26 ,  H05B3/74 ,  H05B3/68

CPC classification number: H05B3/141 ,  H05B3/12 ,  H05B3/143 ,  H05B3/265 ,  H05B3/74

Abstract: A hot plate having a conductor pattern layer in which few blister is formed and which has a good adhesion and a large resistivity. The hot plate (3) comprises a nitride ceramic base (9) having thereon conductor pattern layers (10, 10a). The conductor pattern layers (10, 10a) are made of ruthenium oxide, bismuth or its oxide, glass frit, and particles of noble metal.

Abstract translation: 具有导体图案层的热板，其中形成很少的泡罩，并且具有良好的粘附性和大的电阻率。 热板（3）包括其上具有导体图案层（10,10a）的氮化物陶瓷基体（9）。 导体图案层（10,10a）由氧化钌，铋或其氧化物，玻璃料和贵金属颗粒制成。