公开(公告)号：WO2016002548A1

公开(公告)日：2016-01-07

申请号：PCT/JP2015/067809

申请日：2015-06-15

Applicant: HENKEL JAPAN LTD.

Inventor： TAKAMORI Ai

IPC: C09J123/00 ,  B32B27/00 ,  B32B27/10 ,  B32B27/30 ,  B32B27/32 ,  C09J11/06 ,  C09J11/08 ,  C09J123/08 ,  C09J129/04

CPC classification number: C09J129/14 ,  B31F1/225 ,  B31F1/2818 ,  C08L23/0815 ,  C08L23/0869 ,  C08L91/06 ,  C09J123/08

Abstract: The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing, and has excellent thermal stability and adhesion, in particular adhesion to a paper material. The present invention relates to a hot melt adhesive comprising: (A) an olefin-based polymer, (B) a butyral resin, (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, and (D) a tackifier resin.

Abstract translation: 本发明的目的是提供一种不太可能引起拉丝的热熔粘合剂，并且具有优异的热稳定性和粘附性，特别是对纸材的粘附性。 本发明涉及一种热熔粘合剂，其包含：（A）烯烃类聚合物，（B）丁缩醛树脂，（C）选自脂肪酸及其衍生物中的至少一种，（D ）增粘树脂。

公开(公告)号：WO2013162059A1

公开(公告)日：2013-10-31

申请号：PCT/JP2013/062800

申请日：2013-04-25

Applicant: HENKEL JAPAN LTD.

Inventor： TAKENAKA Makoto

IPC: C09J167/00 ,  C09J11/06 ,  C09J109/00 ,  C09J123/26 ,  C09J201/00

CPC classification number: C09J167/04 ,  C08L53/02 ,  C08L53/025 ,  C08L67/04 ,  C09J123/26 ,  C09J157/02 ,  C09J167/02 ,  C09J2409/00 ,  C09J2453/00 ,  C09J2467/00

Abstract: The present invention provides a hot melt adhesive being highly environmentally-friendly, and as well having sufficient pressure-sensitive adhesiveness, adhesion, thermal stability and the like. The present invention relates to a hot melt adhesive comprising (A) a polar functional group -modified polymer, (B) an aliphatic polyester-based resin, (C) a tackifier resin and (D) a thermoplastic elastomer.

Abstract translation: 本发明提供一种高度环保的热熔粘合剂，并具有足够的压敏粘合性，粘合性，热稳定性等。 本发明涉及包含（A）极性官能团改性聚合物，（B）脂肪族聚酯类树脂，（C）增粘树脂和（D）热塑性弹性体）的热熔性粘合剂。

公开(公告)号：WO2013077457A3

公开(公告)日：2013-08-15

申请号：PCT/JP2012080799

申请日：2012-11-21

Applicant: HENKEL JAPAN LTD

Inventor： ITO SHOKO

IPC: C08G18/62 ,  C09J175/04 ,  H01L31/048

CPC classification number: C09J175/14 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/6262 ,  C09J175/04 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50

Abstract: An object of the present invention is to provide a urethane adhesive for solar battery back sheets, which has satisfactory initial adhesion to a film in the production of a solar battery back sheet, satisfactory initial adhesive property after curing and high adhesive property at high temperature, and also has a sufficient hydrolysis resistance over the long term and is excellent in overall balance; a solar battery back sheet which is obtainable by using the adhesive; and a solar battery module. Disclosed is an adhesive for solar battery back sheets, including a urethane resin obtainable by the reaction of an acrylic polyol with an isocyanate compound, wherein the acrylic polyol is obtainable by polymerizing polymerizable monomers, the polymerizable monomers include a monomer having a hydroxyl group and other monomers, the monomer having a hydroxyl group includes a hydroxyalkyl (meth)acrylate, and the other monomers include acrylonitrile and (meth)acrylic ester(s).

Abstract translation: 本发明的目的是提供一种用于太阳能电池背板的太阳能电池背板的聚氨酯粘合剂，其具有令人满意的初始粘合性，在太阳能电池背板的制造中具有令人满意的初始粘合性和高温下的高粘合性， 并且长期具有足够的耐水解性，总体平衡优异; 可通过使用粘合剂获得的太阳能电池背板; 和太阳能电池模块。 公开了一种用于太阳能电池背板的粘合剂，其包括通过丙烯酸多元醇与异氰酸酯化合物反应获得的聚氨酯树脂，其中丙烯酸多元醇可通过聚合可聚合单体获得，可聚合单体包括具有羟基的单体和其它 单体，具有羟基的单体包括（甲基）丙烯酸羟烷基酯，其它单体包括丙烯腈和（甲基）丙烯酸酯。

公开(公告)号：WO2007103697A1

公开(公告)日：2007-09-13

申请号：PCT/US2007/063018

申请日：2007-03-01

Applicant: HENKEL JAPAN LTD. ,  CEMEDINE HENKEL CO., LTD. ,  KANIE, Hideki ,  ISHIKAWA, Yoichi

Inventor： KANIE, Hideki ,  ISHIKAWA, Yoichi

IPC: B62D25/00 ,  B62D24/00

CPC classification number: B62D29/002

Abstract: A fastenable member for use in a cavity of a structural member is disclosed. According to one embodiment of the invention, the fastenable member includes a carrier, an expandable material operably coupled with and supported by at least a portion of the carrier, an attachment member for securing the fastenable member to the structural member, and a connection member operably coupled with the carrier and the attachment member. The connection member is configured to allow the carrier to move at least horizontally and vertically with respect to the attachment member. The fastenable member is useful for sealing, baffling and/or structurally reinforcing hollow portions of vehicles and the like.

Abstract translation: 公开了一种用于结构构件的空腔中的可固定构件。 根据本发明的一个实施例，可固定构件包括载体，可操作地与载体的至少一部分耦合并由其支撑的可膨胀材料，用于将可固定构件固定到结构构件的附接构件和可操作地连接构件 与载体和附接构件联接。 连接构件被构造成允许载体相对于附接构件至少水平和垂直地移动。 可紧固构件可用于车辆等的密封，挡板和/或结构上加强中空部分。

公开(公告)号：WO2018221117A1

公开(公告)日：2018-12-06

申请号：PCT/JP2018/017522

申请日：2018-05-02

Applicant: HENKEL JAPAN LTD.

Inventor： TAMOGAMI, Tsuyoshi ,  YOSHIDA, Yoshio ,  HAYAKAWA, Tadashi

IPC: C04B26/28 ,  C04B14/42 ,  C09J105/00

Abstract: Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.

公开(公告)号：WO2016145652A1

公开(公告)日：2016-09-22

申请号：PCT/CN2015/074578

申请日：2015-03-19

Applicant: ABLESTIK (SHANGHAI) LTD. ,  HENKEL ELECTRONICS MATERIALS LLC ,  HENKEL HUAWEI ELECTRONICS CO.LTD. ,  HENKEL JAPAN LTD.

Inventor： YANG, Qingxu ,  WU, Qili ,  AYA, Hikita ,  WANG, Yuting ,  HE, George ,  SONG, Jin ,  WEI, Yao ,  QIN, Justin ,  JIA, Lufang ,  BIN, Guanghui ,  DU, Ning ,  XIE, Guangchao

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/56 ,  C08L63/00

CPC classification number: H01L33/60 ,  C08G59/24 ,  C08G59/4215 ,  C08G59/686 ,  C08K3/36 ,  C08K5/5403 ,  C08K2003/2241 ,  C08L63/00 ,  H01L2933/0058

Abstract: It is provided that a method for manufacturing an optical semiconductor device, particularly an LED device, a thermosetting resin composition suitable for using in the method, and an optical semiconductor device, particularly an LED device, manufactured by the method or from the thermosetting resin composition.

Abstract translation: 本发明提供一种制造光半导体装置，特别是LED装置的方法，适用于该方法的热固性树脂组合物，以及通过该方法制造的光学半导体装置，特别是LED装置，或者由热固性树脂组合物 。

公开(公告)号：WO2016103528A1

公开(公告)日：2016-06-30

申请号：PCT/JP2014/084765

申请日：2014-12-26

Applicant: HENKEL JAPAN LTD. ,  HENKEL CORPORATION

Inventor： INOUE, Hajime ,  TAKANO, Tadashi

IPC: H01L21/52 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01L24/83 ,  B22F1/0055 ,  B22F1/0059 ,  B22F1/0074 ,  B22F3/22 ,  B22F7/04 ,  B22F7/064 ,  B22F7/08 ,  B22F2007/047 ,  B23K35/0244 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83222 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/8384 ,  H05K3/32 ,  H05K2203/1131 ,  H01L2924/00014

Abstract: An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200°C or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

Abstract translation: 本发明的目的是提供一种能够提供具有长期可靠性的粘结制品的可烧结接合材料。 本发明涉及包含银填料和树脂颗粒的可烧结接合材料，其中银填料包括具有10nm或更小的算术平均粗糙度（Ra）的片状填料; 树脂粒子的弹性模量（E）为10GPa以下，热分解温度为200℃以上。 本发明的烧结性接合材料的烧结体的接合强度和散热特性优异，应力松弛能力提高。

公开(公告)号：WO2014003208A8

公开(公告)日：2014-04-24

申请号：PCT/JP2013068317

申请日：2013-06-27

Applicant: HENKEL JAPAN LTD

Inventor： ITOH KENJI ,  YOSHIDA YOSHIO

IPC: C08G59/20 ,  C08L63/00 ,  C09D5/02 ,  C09D163/00

CPC classification number: C08L63/00 ,  C08G59/504 ,  C09D5/022 ,  C09D7/45 ,  C09D7/63 ,  C09D163/00

Abstract: An object of the present invention is to provide a water-based epoxy resin emulsion being environmentally-friendly, and having an excellent storage stability and an excellent rust-proof property; and to provide a water-based paint comprising the water-based resin emulsion. The present invention relates to a water-based epoxy resin emulsion in which an epoxy resin (B) is emulsified and dispersed in an aqueous medium (C) in the presence of a reactive emulsifier (A), wherein an average particle diameter of the water- based epoxy resin emulsion is 500 nm or less.

Abstract translation: 本发明的目的是提供一种环保的水性环氧树脂乳液，具有优异的储存稳定性和优良的防锈性; 并提供包含水基树脂乳液的水性涂料。 本发明涉及在反应性乳化剂（A）的存在下将环氧树脂（B）乳化分散在水性介质（C）中的水性环氧树脂乳液，其中水的平均粒径 基于环氧树脂的乳液为500nm以下。

公开(公告)号：WO2014003204A1

公开(公告)日：2014-01-03

申请号：PCT/JP2013/068312

申请日：2013-06-27

Applicant: HENKEL JAPAN LTD.

Inventor： TAKAMORI, Ai

IPC: C09J123/08

CPC classification number: C09J123/20 ,  C08K5/01 ,  C08L67/02 ,  C08L91/06 ,  C09J123/0815 ,  C09J123/0846 ,  C09J123/0853

Abstract: Disclosed is a hot melt adhesive comprising: (A) an ethylene-based copolymer; (B) a polyester polyol; and (C) a wax, wherein the wax (C) includes both (C1) a Fischer-Tropsch wax and (C2) a petroleum wax. The hot melt adhesive can be applied at a low temperature, and also has a suitably long open time and is excellent in adhesion to a paper. The hot melt adhesive can be used preferably for producing a paper product. A paper product obtainable by using the hot melt adhesive is also provided.

Abstract translation: 公开了一种热熔性粘合剂，其包含：（A）乙烯类共聚物; （B）聚酯多元醇; 和（C）蜡，其中蜡（C）包括（C1）费 - 托蜡和（C2）石油蜡。 热熔粘合剂可以在低温下使用，并且也具有合适的长的开放时间，并且对纸的粘合性优异。 热熔粘合剂优选用于制造纸制品。 还提供了通过使用热熔粘合剂可获得的纸制品。

公开(公告)号：WO2013077457A2

公开(公告)日：2013-05-30

申请号：PCT/JP2012/080799

申请日：2012-11-21

Applicant: HENKEL JAPAN LTD.

Inventor： ITO, Shoko

IPC: C08G18/63

CPC classification number: C09J175/14 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/6262 ,  C09J175/04 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50

Abstract: An object of the present invention is to provide a urethane adhesive for solar battery back sheets, which has satisfactory initial adhesion to a film in the production of a solar battery back sheet, satisfactory initial adhesive property after curing and high adhesive property at high temperature, and also has a sufficient hydrolysis resistance over the long term and is excellent in overall balance; a solar battery back sheet which is obtainable by using the adhesive; and a solar battery module. Disclosed is an adhesive for solar battery back sheets, including a urethane resin obtainable by the reaction of an acrylic polyol with an isocyanate compound, wherein the acrylic polyol is obtainable by polymerizing polymerizable monomers, the polymerizable monomers include a monomer having a hydroxyl group and other monomers, the monomer having a hydroxyl group includes a hydroxyalkyl (meth)acrylate, and the other monomers include acrylonitrile and (meth)acrylic ester(s).

Abstract translation: 本发明的目的是提供一种用于太阳能电池背板的聚氨酯粘合剂，其在太阳能电池背板的制造中对膜具有令人满意的初始粘合性，固化后的初始粘合性令人满意 并且在高温下具有高粘合性，并且长期具有足够的耐水解性，并且总体平衡优异; 太阳能电池背板，其可通过使用粘合剂获得; 和太阳能电池模块。 本发明公开了一种太阳能电池背板用粘合剂，其包含通过丙烯酸类多元醇与异氰酸酯化合物的反应获得的聚氨酯树脂，其中丙烯酸类多元醇可通过聚合可聚合单体获得，所述可聚合单体包括具有羟基的单体和其它 单体时，具有羟基的单体包括（甲基）丙烯酸羟烷基酯，其他单体包括丙烯腈和（甲基）丙烯酸酯。