Abstract:
The apparatus and method involve using a gas manifold for introducing gas into a deposition chamber. Certain embodiments involve using a binary manifold for uniform distribution of the gas with good response time. During sputtering operations, provision of an anode using the gas manifold enables such anode to be entirely protected from sputtered dielectric material during the deposition process. As such, conduction paths are initially established and maintained between electrons within the chamber and the anode. This results in improved maintenance of stable plasma and consistent coating in the deposition chamber. The conduction paths are enhanced in comparison to conventional systems due to increased collisions between the electrons and gas flowing out of the manifold outlets. Also, ionization of the gas flowing from the manifold outlets is enhanced, resulting in enhanced deposition output from the system. A magnet can also be located within the manifold so as to further increase collisions between the electrons and gas flowing out of the manifold outputs.
Abstract:
A sputtering chamber includes at least two sputtering targets, one of the at least two targets disposed on a first side a substrate conveyor extending within the chamber, and another of the at least two targets disposed on a second side of the conveyor. The at least two targets may be independently operable, and at least one of the targets, if inactivated, may be protected by a shielding apparatus. Both of the at least two targets may be mounted to a first wall of a plurality of walls enclosing the sputtering chamber.
Abstract:
Sputtering targets and sputtering methods for depositing a film that includes tin and niobium. Substrates bearing coatings comprising tin and niobium, for example, low-emissivity coatings including blocker films comprising tin and niobium, or solar control coatings (e.g., conductive oxide coatings) including tin and niobium methods of manufacturing sputtering targets comprising tin and niobium.
Abstract:
Methods and equipment for depositing coatings on glass and other substrates. In some embodiments, methods and equipment are provided for depositing reflective thin film coatings, such as low-emissivity coatings that are particularly reflective of infrared radiation, optionally by a downward coating operation. In some embodiments, such a downward coating operation is coupled with an upward coating operation used to deposit another coating.
Abstract:
A substrate bearing a low-emissivity coating, the coating comprising two infrared-reflective layers separated by a middle coat, the middle coat comprising two zinc tin oxide film regions separated by a tin oxide film region.
Abstract:
Improved sputtering chambers for sputtering thin coatings onto substrates. One sputtering chamber includes spall shields which are disposed inwardly and upwardly toward the chamber interior and toward the sputtering targets, and which can aid in the retention of overcoated sputtering material which may otherwise fall onto substrates to be coated. Another sputtering chamber includes targets having magnets which are turned inwardly relative to vertical and toward each other. The inward rotation of the magnets can serve to deposit more material toward the open bottom center of the chamber, and less toward the side walls of the chamber. Yet another sputtering chamber includes a third target disposed between and upward of the lower two targets so as to shield a portion of the sputtering chamber interior from material sputtered from the first and second targets. Some chambers have the three targets forming a triangle, for example, an isosceles or equilateral triangle, hi one chamber having such a triangular configuration of sputtering targets, the first and second targets form the base of an isosceles triangle and have their magnets oriented inwardly relative to vertical and towards each other. The sputtering chambers provided can either reduce the amount of overcoat sputtering material deposited onto the interior of the chamber and/or aid in retention of overcoat sputtering material which would otherwise fall onto substrates to be coated.
Abstract:
A coater having a substrate cleaning device is disclosed. Also disclosed are methods of processing substrates in a coater equipped with a substrate cleaning device. The substrate cleaning device comprises an ion gun (i.e., an ion source) that is positioned beneath a path of substrate travel (e.g., beneath a substrate support) extending through the coater and that is adapted for treating a bottom major surface of a substrate. Certain embodiments involve an upward coating apparatus that is further along the path of substrate travel than the substrate cleaning device. In some embodiments of this nature, the upward coating apparatus is configured for depositing a photocatalytic coating upwardly onto the bottom major surface of the substrate. Certain embodiments of the invention involve a downward coating apparatus, wherein the substrate cleaning device is further along the path of substrate travel than the downward coating apparatus. Some embodiments of this nature also involve an upward coating apparatus that is further along the path of substrate travel than the substrate cleaning device.
Abstract:
A stackable, folding transport rack (10) generally including a base, (12) a plurality of supports, (14) at least one foldable A-frame (16) hingedly secured to the base (12) and an optional securing assembly (18). The base (12) of the transport rack is supported by a plurality of legs (22) bearing supports which are adapted to support the lower edges of objects, such as glass sheets or other sheet materials to be carried by the transport rack. The supports (14) are configured to be as low as possible to the resting surface of the transport rack (10) so as to provide for a minimal lift height for loading and unloading. The low arrangement of the supports also maximizes the size of glass sheets that can be carried and maintains the lowest possible center of gravity. The top of the sheet supports may be cushioned with appropriate resilient material.
Abstract:
The invention provides thin film coatings that have a transparent base layer. For example, the invention provides low-emissivity coatings with a transparent base layer. In certain embodiments, a silicon dioxide base layer is used. Methods of producing thin film coatings having a transparent base layer are provided as well. In one embodiment, sputter deposition is utilized to produce these coatings.
Abstract:
The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substrate. First and second grinding apparatuses are provided at a mounting portion of the table, opposite one another. As the substrate moves over the table surface, it contacts the first and second grinding apparatuses. The coatings are simultaneously removed from the first major surface with the first grinding apparatus from the second major surface with the second grinding apparatus.