MAGNETRON NEGATIVE ION SPUTTER SOURCE
    2.
    发明申请
    MAGNETRON NEGATIVE ION SPUTTER SOURCE 审中-公开
    MAGNETRON负离子喷雾源

    公开(公告)号:WO0068451A3

    公开(公告)日:2007-06-21

    申请号:PCT/US0013054

    申请日:2000-05-12

    Applicant: SKION CORP

    Abstract: A negative ion source (125) includes an electrode (25), a target (55) having a plurality of openings (130) and a more negative electrical potential than the electrode (25), an electrical energy supply (135) for generating a discharge between the electrode (25) and the target (55), at least one magnet (40) positioned in close to a first surface of the target (55) to confine electrons, a delivery system (80) for delivering cesium to a second surface of the target (55), and a distribution chamber (120) interposed between the delivery system (80) and the target (55).

    Abstract translation: 负离子源(125)包括电极(25),具有多个开口(130)的靶(55)和比电极(25)更负的电位的电极(55),用于产生 在电极(25)和靶(55)之间的放电,至少一个位于靶(55)的第一表面附近以限制电子的磁体(40),用于将铯输送到第二个的输送系统(80) 目标(55)的表面和介于输送系统(80)和目标(55)之间的分配室(120)。

    SYSTEM AND METHOD RELATING TO VAPOR DEPOSITION
    4.
    发明申请
    SYSTEM AND METHOD RELATING TO VAPOR DEPOSITION 审中-公开
    与真空蒸发沉积有关的系统和方法

    公开(公告)号:WO01040535A2

    公开(公告)日:2001-06-07

    申请号:PCT/US2000/042520

    申请日:2000-12-01

    Abstract: A method and system for producing a film (preferably a thin film with highly uniform or highly accurate custom graded thickness) on a flat or graded substrate (such as concave or convex optics), by sweeping the substrate across a vapor deposition source operated with time-varying flux distribution. In preferred embodiments, the source is operated with time-varying power applied thereto during each sweep of the substrate to achieve the time-varying flux distribution as a function of time. A user selects a source flux modulation recipe for achieving a predetermined desired thickness profile of the deposited film. The method relies on precise modulation of the deposition flux to which a substrate is exposed to provide a desired coating thickness distribution.

    Abstract translation: 本发明涉及一种制造薄膜(优选具有非常均匀厚度并且非常精确地根据需要校准的薄膜)在平坦或成型基底(例如 凹面或凸面光学元件)。 该方法包括提供真空蒸发沉积源,其以时变流量分布清除衬底。 在优选实施例中,源以在衬底的每次通过期间施加的随时间变化的功率来实现,从而随时间产生可变通量分布。 用户为了获得用于沉积成形膜的预设期望厚度曲线的目的而选择调制源流的方法。 该方法基于对衬底暴露的焊剂的精确调制,以产生期望的涂层厚度分布。

    MAGNETRON NEGATIVE ION SPUTTER SOURCE
    5.
    发明申请
    MAGNETRON NEGATIVE ION SPUTTER SOURCE 审中-公开
    MAGNETRON负离子喷雾源

    公开(公告)号:WO00068451A2

    公开(公告)日:2000-11-16

    申请号:PCT/US2000/013054

    申请日:2000-05-12

    Abstract: A negative ion source is disclosed which includes an electrode, a target having a more negative electrical potential than the electrode, a supply of electrical energy for generating a discharge between the electrode and the target, and at least one magnet positioned so as to confine electrons, generated as a result of said discharge, in close proximity to a first surface of the target. The negative ion source further includes a delivery system for delivering cesium to a second surface of the target, and a distribution chamber interposed between the delivery system and the target for uniformly distributing cesium on the second surface of said target. The cesium diffuses through openings in the target from the first surface to the second surface. The negative ion source may comprise a conventional magnetron sputter source that has been retroffitted to include a cesium distribution system.

    Abstract translation: 公开了一种负离子源,其包括电极,具有比电极更负的电位的靶,用于在电极和靶之间产生放电的电能供应,以及定位成限制电子的至少一个磁体 作为所述放电的结果产生,紧邻靶的第一表面。 负离子源还包括用于将铯输送到靶的第二表面的输送系统,以及插入在输送系统和靶之间的分配室,用于在所述靶的第二表面上均匀分布铯。 铯通过靶中的开口从第一表面扩散到第二表面。 负离子源可以包括已经被逆流以包括铯分配系统的常规磁控溅射源。

    マグネトロンスパッタリング用磁場発生装置
    6.
    发明申请
    マグネトロンスパッタリング用磁場発生装置 审中-公开
    用于MAGNETRON SPUTTERING的磁场发生器

    公开(公告)号:WO2016148058A1

    公开(公告)日:2016-09-22

    申请号:PCT/JP2016/057752

    申请日:2016-03-11

    Inventor: 栗山 義彦

    CPC classification number: C23C14/35 C23C14/3457 H01J37/3408 H01J37/3452

    Abstract:  ターゲット表面に磁場を発生させるためのレーストラック形状のマグネトロンスパッタリング用磁場発生装置であって、磁性体からなるベース上に、(a)直線状に配置された中央部永久磁石(垂直方向に磁化)と、(b)中央部永久磁石を取り囲むように配置された外周部永久磁石(垂直方向に磁化)と、(c)中央部永久磁石の両側に配置された第一の中間部永久磁石(垂直方向に磁化)、第二の中間部永久磁石(水平方向に磁化)及び第三の中間部永久磁石(垂直方向に磁化)と、(d)中央部永久磁石の長手方向両端部から離間して配置された第四の中間部永久磁石(垂直方向に磁化)とを有し、第二の中間部永久磁石は一方の磁極が第一の中間部永久磁石のターゲット寄り側面と対向するように配置されることを特徴とする。

    Abstract translation: 用于磁控溅射的磁场发生器成形为类似跑道的轨迹,用于在目标表面上产生磁场,其特征在于,在由磁体形成的基座上包括:(a)中心部分永磁体 (沿垂直方向磁化)线性布置; (b)围绕中心部永磁体而配置的外周部永久磁铁(沿上下方向磁化) (c)第一中间部分永磁体(沿垂直方向磁化),第二中间部分永磁体(沿水平方向磁化)和第三中间部分永磁体(沿垂直方向磁化),它们布置在 中段永磁体两侧; 和(d)在长边方向上与中心部永磁体的两端分开配置的第四中间部永久磁铁(沿上下方向磁化),其特征在于,所述第二中间部永久磁铁 一个磁极面对每个第一中间部分永磁体的目标侧侧表面。

    DEPOSITION OF SOLID STATE ELECTROLYTE ON ELECTRODE LAYERS IN ELECTROCHEMICAL DEVICES
    8.
    发明申请
    DEPOSITION OF SOLID STATE ELECTROLYTE ON ELECTRODE LAYERS IN ELECTROCHEMICAL DEVICES 审中-公开
    固体电解质在电化学器件中电极层的沉积

    公开(公告)号:WO2015112986A1

    公开(公告)日:2015-07-30

    申请号:PCT/US2015/012928

    申请日:2015-01-26

    Abstract: Methods and apparatus are described for improving the fabrication of thin film electrochemical devices such as thin film batteries and electrochromic devices, with respect to deposition of LiPON, or other lithium ion conducting electrolyte, thin films on electrodes such as Li metal, LiCoO 2 , WO 3 , NiO, etc. A method of fabricating an electrochemical device in a deposition system may comprise: configuring an electrically conductive layer substantially peripherally to a portion of the surface of an electrode layer of the electrochemical device; electrically connecting the electrically conductive layer to an electrically conductive, but electrically floating, surface; and depositing a lithium ion conducting solid state electrolyte layer on the portion of the surface of the electrode layer of the electrochemical device within the deposition chamber, wherein the depositing comprises forming a plasma within the deposition chamber; wherein during the depositing, the electrically conductive, but electrically floating, surface is within the deposition chamber.

    Abstract translation: 描述了关于LiPON或其它锂离子导电电解质沉积的薄膜电化学装置如薄膜电池和电致变色装置的制造的方法和装置,诸如Li金属,LiCoO 2,WO 3等电极上的薄膜, NiO等。在沉积系统中制造电化学装置的方法可以包括:在电化学装置的电极层的表面的一部分基本上周边配置导电层; 将导电层电连接到导电但电浮动的表面; 以及在所述沉积室内的所述电化学装置的电极层的表面的部分上沉积锂离子传导固态电解质层,其中所述沉积包括在所述沉积室内形成等离子体; 其中在沉积期间,导电但电浮动的表面在沉积室内。

    METHOD FOR COATING A SUBSTRATE, EQUIPMENT FOR IMPLEMENTING SAID METHOD AND METAL SUPPLY DEVICE FOR SUCH EQUIPMENT
    10.
    发明申请
    METHOD FOR COATING A SUBSTRATE, EQUIPMENT FOR IMPLEMENTING SAID METHOD AND METAL SUPPLY DEVICE FOR SUCH EQUIPMENT 审中-公开
    用于涂覆基板的方法,用于实施该方法的设备和用于该设备的金属供应装置

    公开(公告)号:WO2008107538A3

    公开(公告)日:2008-10-30

    申请号:PCT/FR2008000046

    申请日:2008-01-16

    Abstract: The invention relates to a method for coating at least one surface of a running substrate by the vacuum evaporation of a metal or metal alloy layer that can be sublimated, wherein the metal or metal alloy is provided opposite the surface of the substrate in the form of at least two ingots in contact with each other, the surface of the ingots oriented towards the substrate surface being held parallel to the substrate at a constant distance therefrom during the coating process; the invention also relates to a coating equipment for implementing said method and to a metal supply device (1) for such an equipment.

    Abstract translation: 本发明涉及一种用于通过真空蒸发可升华的金属或金属合金层来涂覆运行基板的至少一个表面的方法,其中金属或金属合金以基板表面相对的方式设置, 至少两个彼此接触的锭,在涂覆过程中,朝向衬底表面的锭的表面在与其恒定的距离处平行于基底保持; 本发明还涉及用于实现所述方法的涂覆设备和用于这种设备的金属供给装置(1)。

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