Abstract:
A method for the welding together of workpieces. The work- pieces (A, B) that are to be welded together are held by robots (1, 2) that place the workpieces (A, B) relative to each other for joining by welding and maintain the workpieces in these positions while the welding (9) is carried out. A measurement system (3, 4) measures the positions of the workpieces in order to make it possible to adjust the positions of the workpieces before welding (9) takes place.
Abstract:
A method and a relevant apparatus for controlling the machining of a piece (18,38) rotating in a numerical control machine tool (33) includes the steps of detecting instantaneous values (V(i)) indicative of the dimensions of the piece during the machining, performing dynamic processing of the detected instantaneous values and controlling at least one machining phase on the basis of the processing. The method includes dynamic calculation of average values (M(j)) of sequences of the detected values, acquisition of a variation index (P) indicative of the average values trend during the machining and of a correction coefficient (K) that allows for the delay of the calculated average values with respect to the actual dimensions of the piece, and processing of an instantaneous dimension (RI) of the piece that is transmitted to the numerical control of the machine tool for controlling the machining.
Abstract:
An apparatus for use with a chemical mechanical planarization (CMP) system includes a light source that generates an interrogation signal and directs the interrogation signal toward a polishing pad configured to process a workpiece during the CMP procedure. A reflected signal produced in response to the interrogation signal is received by a detector, and the optical characteristics of the reflected signal are processed and analyzed to determine whether extraneous material is present within an area of the polishing pad. The apparatus may employ alternative light sources and processing techniques to advantageously operate in conjunction with a variety of polishing pads having different physical characteristics.