公开(公告)号：WO2016094336A2

公开(公告)日：2016-06-16

申请号：PCT/US2015/064358

申请日：2015-12-08

Applicant: CORNING INCORPORATED

Inventor： BACKHAUS-RICOULT, Monika ,  KETCHAM, Thomas Dale

IPC: C03B17/06 ,  C03B5/16 ,  C04B41/91

CPC classification number: C04B35/481 ,  C03B5/163 ,  C03B17/064 ,  C03B17/067 ,  C03C2218/13 ,  C04B2235/85 ,  C25B11/0442 ,  H05B3/03

Abstract: A method of treating a ceramic body in a glass making process includes delivering a molten glass to a heated ceramic body, the ceramic body including a ceramic phase and an intergranular glass phase, the molten glass being in contact with a surface of the ceramic body. The method further includes contacting the ceramic body with a first electrode and contacting the molten glass with a second electrode. The method further includes applying an electric field between the first electrode and the second electrode to create an electric potential difference across the ceramic body between the first and second electrodes, the electric potential difference being less than an electrolysis threshold of the ceramic phase and the intergranular glass phase. The intergranular glass phase demixes under driven diffusion in the applied electric field and mobile cations in the intergranular glass phase enrich proximate one of the first and second electrode.

Abstract translation: 在玻璃制造工艺中处理陶瓷体的方法包括将熔融玻璃输送到加热的陶瓷体，陶瓷体包括陶瓷相和晶间玻璃相，熔融玻璃与陶瓷体的表面接触。 该方法还包括使陶瓷体与第一电极接触并使熔融玻璃与第二电极接触。 该方法还包括在第一电极和第二电极之间施加电场以在第一和第二电极之间跨陶瓷体产生电位差，电位差小于陶瓷相和晶间的电解阈值 玻璃相。 在施加的电场中的驱动扩散下的晶间玻璃相分相，并且晶间玻璃相中的移动阳离子在第一和第二电极之一附近富集。

公开(公告)号：WO2016073680A1

公开(公告)日：2016-05-12

申请号：PCT/US2015/059176

申请日：2015-11-05

Applicant: CORNING INCORPORATED

Inventor： BIGELOW, Donald Orrin ,  BOOTH, Robertson Dewhurst ,  WATKINS, James Joseph

IPC: C03B33/09 ,  C03B33/10 ,  C03B33/023 ,  C03B33/03

CPC classification number: C03B33/091 ,  C03B33/0235 ,  C03B33/03 ,  C03B33/105

Abstract: A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimetres between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

Abstract translation: 提供了一种在玻璃基板中形成起始缺陷以便于将玻璃基板分离成多个基板的方法。 该方法包括提供玻璃基板并使玻璃基板的宽表面与研磨表面接触，从而在玻璃基板的宽表面上形成起始缺陷的场。 起始缺陷领域的最外层起始缺陷之间的宽度至少约为3毫米。 用激光源加热至少一个起始缺陷。 所述至少一个起始缺陷用冷却流体冷却，使得裂纹从所述至少一个起始缺陷开始，所述裂纹延伸穿过所述玻璃基板的厚度并传播穿过所述玻璃基板以将所述玻璃基板分离成所述多个 基板。

公开(公告)号：WO2016073549A1

公开(公告)日：2016-05-12

申请号：PCT/US2015/058938

申请日：2015-11-04

Applicant: CORNING INCORPORATED

Inventor： GROSS, Timothy Michael ,  SHUSTACK, Paul John ,  WEEKS, Wendell Porter

IPC: C03C21/00 ,  B32B17/06 ,  B32B17/10 ,  H01L51/52 ,  C03C15/00 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32

CPC classification number: H01L23/5387 ,  B32B17/064 ,  B32B2457/206 ,  C03C15/00 ,  C03C17/007 ,  C03C17/322 ,  C03C17/326 ,  C03C2217/43 ,  C03C2217/445 ,  C03C2217/478 ,  H01L23/15 ,  H01L29/78603 ,  H01L51/0097 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/303 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549

Abstract: An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 µm to about 100 µm. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 µm greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.

Abstract translation: 电子装置组件包括具有基本上不含碱离子的玻璃组合物，约40GPa至约100GPa的弹性模量和约20μm至约100μm的最终厚度的背板。 背板的主表面的特征在于从比最终厚度大至少20μm的初始厚度将现有材料去除到最终厚度。 组件还包括在背板的第一主表面上的保护层; 以及在背板的第二主表面上的多个电子部件。 此外，背板配置有至少一个弯曲半径在约25mm和约5mm之间的静态弯曲部。 电子器件组件的电子部件可以包括至少一个薄膜晶体管（TFT）元件或有机发光二极管（OLED）元件。

公开(公告)号：WO2016011114A1

公开(公告)日：2016-01-21

申请号：PCT/US2015/040503

申请日：2015-07-15

Applicant: CORNING INCORPORATED

Inventor： ALTMAN, Andrew Stephen ,  BAYNE, John Frederick ,  BRACKLEY, Douglas Edward ,  CHANG, Chester Hann Huei ,  FLEMING, Todd Benson ,  FURSTOSS, Anthony John ,  HORSFALL, Terrence Richard ,  LI, Xinghua ,  LIU, Anping ,  MERZ, Gary Edward ,  MILLER, Eric Lee ,  OTT, Terry Jay ,  TRACY, Ian David ,  TRZECIAK, Thaddeus Francis ,  WASSON, Kevin Lee ,  WATKINS, James Joseph

IPC: C03B33/023 ,  C03B33/03 ,  C03B33/033 ,  C03B33/09 ,  B65G49/06

CPC classification number: C03B33/03 ,  B23K26/0846 ,  B23K26/40 ,  B23K2203/54 ,  B65G49/065 ,  C03B33/0235 ,  C03B33/033 ,  C03B33/091 ,  Y02P40/57

Abstract: A method for cutting a flexible glass substrate is provided. The method includes directing the flexible glass substrate to a flexible glass cutting apparatus including a laser. The flexible glass substrate includes a first broad surface and a second broad surface that extend laterally between a first edge and a second edge of the flexible glass substrate. A laser beam is directed from the laser onto a region of the flexible glass substrate. A crack is formed through the flexible glass substrate using the laser beam. A local mechanical deformation is formed in the flexible glass substrate using a stress-inducing assembly that includes a stress-inducing feature allowing the flexible glass substrate to deform locally. The crack is propagated along the flexible glass substrate using the laser beam and the local mechanical deformation.

Abstract translation: 提供了一种用于切割柔性玻璃基板的方法。 该方法包括将柔性玻璃基板引导到包括激光的柔性玻璃切割装置。 柔性玻璃基板包括在柔性玻璃基板的第一边缘和第二边缘之间横向延伸的第一宽表面和第二宽表面。 将激光束从激光器引导到柔性玻璃基板的区域上。 使用激光束通过柔性玻璃基板形成裂纹。 使用包括使柔性玻璃基板局部变形的应力诱导特征的应力诱导组件在柔性玻璃基板中形成局部机械变形。 使用激光束和局部机械变形沿着柔性玻璃基板传播裂纹。

公开(公告)号：WO2016007695A1

公开(公告)日：2016-01-14

申请号：PCT/US2015/039653

申请日：2015-07-09

Applicant: CORNING INCORPORATED

Inventor： GARNER, Sean, Michael ,  LI, Xinghua

IPC: C03B33/02 ,  C03B33/03 ,  C03B33/09 ,  C03B33/04

CPC classification number: C03B33/091 ,  C03B33/0222 ,  C03B33/03 ,  C03B33/04 ,  C03B33/074 ,  Y02P40/57

Abstract: A method of separating a glass sheet comprises providing a glass sheet including a first major surface opposing a second major surface. A layer of adhesive material bonds the second major surface of the glass sheet to a support surface of a carrier substrate and a thickness between the first and second major surfaces of the glass sheet is equal to or less than about 300 µm. The method comprises providing a first defect in the glass sheet and separating the glass sheet into a plurality of sub-sheets by traversing a beam of electromagnetic radiation over the first major surface along a first predetermined path to (a) transform the first defect into a first full body crack and (b) propagate the first full body crack along the first predetermined path, thereby producing a full body separation of the glass sheet while the glass sheet remains bonded to the support surface.

Abstract translation: 分离玻璃板的方法包括提供包括与第二主表面相对的第一主表面的玻璃板。 一层粘合材料将玻璃板的第二主表面粘合到载体基底的支撑表面上，玻璃板的第一和第二主表面之间的厚度等于或小于约300μm。 该方法包括在玻璃板中提供第一缺陷，并沿着第一预定路径穿过第一主表面上的电磁辐射束将玻璃板分离成多个子片，以（a）将第一缺陷转换成 第一全身裂纹和（b）沿着第一预定路径传播第一全身裂纹，从而在玻璃板保持结合到支撑表面的同时产生玻璃板的全身分离。

公开(公告)号：WO2015153251A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/022615

申请日：2015-03-26

Applicant: CORNING INCORPORATED

Inventor： FORENZ, Dominick John ,  MCKENDRICK, Walter Jay ,  PRICE, Michael William

IPC: C03B33/02 ,  C03B33/10

CPC classification number: C03B33/10 ,  B24B9/10 ,  B24B19/009 ,  B24B19/02 ,  B24B27/0608 ,  B24B27/0633 ,  B24B27/0675 ,  B24D5/06 ,  C03B33/02 ,  C03B33/07 ,  C03B33/076 ,  C03B33/078 ,  C03B33/107

Abstract: A method of shaping a laminated glass structure includes providing the laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer. The flexible glass structure and adhesive layer are ground using a first tool to remove glass material. The non-glass substrate is cut with a second tool different from the first tool through a kerf formed through the flexible glass structure thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.

Abstract translation: 一种夹层玻璃结构的成形方法包括提供层压玻璃结构，该夹层玻璃结构包括通过粘合剂层层合到非玻璃基板上的厚度不大于约0.3mm的柔性玻璃板。 使用第一工具研磨柔性玻璃结构和粘合剂层以除去玻璃材料。 非玻璃基板用不同于第一工具的第二工具通过通过柔性玻璃结构形成的切口切割，从而形成成形的夹层玻璃结构。 成型夹层玻璃结构的切割边缘的玻璃边缘强度为至少约20MPa。

公开(公告)号：WO2015126805A1

公开(公告)日：2015-08-27

申请号：PCT/US2015/016096

申请日：2015-02-17

Applicant: CORNING INCORPORATED

Inventor： ALTMAN, Andrew Stephen ,  COLE, Carlton Wesley ,  FLEMING, Todd Benson ,  LIU, Anping ,  WATKINS, James Joseph

IPC: C03B33/09

CPC classification number: C03B33/091 ,  B23K26/14 ,  B23K26/53 ,  B23K2203/54 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

Abstract: Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Abstract translation: 方法和装置提供：沿着弯曲切割线切割薄玻璃板，其中曲线被分成多个线段; 施加激光束并沿切割线连续移动激光束; 与施加激光束同时施加冷却流体，以沿着切割线传播玻璃板中的断裂; 以及随着所述激光束从所述多个线段之一移动到所述多个线段中的下一个线段而改变一个或多个切割参数，其中所述一个或多个切割参数包括以下中的至少一个：（i） 激光束，（ii）运动速度，（iii）冷却流体的压力，和（iv）冷却流体的流量。

公开(公告)号：WO2015113023A1

公开(公告)日：2015-07-30

申请号：PCT/US2015/013017

申请日：2015-01-27

Applicant: CORNING INCORPORATED

Inventor： BELLMAN, Robert Alan ,  BOOKBINDER, Dana Craig ,  CHANG, Theresa ,  LIU, Shiwen ,  MANLEY, Robert George ,  MAZUMDER, Prantik

IPC: B32B17/06 ,  C03C17/28 ,  C03C27/06 ,  B32B7/06 ,  C23C16/56

CPC classification number: B32B17/064 ,  B05D1/62 ,  B32B7/06 ,  B32B17/06 ,  C03C17/32 ,  C03C27/10 ,  C03C2218/32 ,  C09J5/02 ,  C09J2400/143 ,  C09J2400/146

Abstract: A method of controllably bonding a thin sheet to a carrier, wherein the thin sheet has a thin sheet bonding surface, and the carrier has a carrier bonding surface. Depositing a surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface so as to obtain a first surface energy on the one of the thin sheet bonding surface and the carrier bonding surface. Then, treating the surface modification layer so as to change the first surface energy to a second surface energy, wherein the second surface energy is greater than the first. And bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. Depositing the surface modification layer, and treating it, may be done by plasma polymerization processes.

Abstract translation: 一种将薄片可控地结合到载体上的方法，其中薄片具有薄的片接合表面，并且载体具有载体接合表面。 将表面改性层沉积在薄片接合表面和载体接合表面中的至少一个上，以便在薄片接合表面和载体接合表面之一上获得第一表面能。 然后，处理表面改性层以将第一表面能改变为第二表面能，其中第二表面能大于第一表面能。 并且通过表面改性层将薄片接合表面结合到载体接合表面。 沉积表面改性层并进行处理可以通过等离子体聚合方法进行。

公开(公告)号：WO2015105769A1

公开(公告)日：2015-07-16

申请号：PCT/US2015/010254

申请日：2015-01-06

Applicant: CORNING INCORPORATED

Inventor： ABRAMOV, Anatoli Anatolyevich ,  HOETZEL, Bernd Christoph

IPC: C03B33/03 ,  C03B33/04 ,  C03B33/09

CPC classification number: C03B33/091 ,  B65G2249/04 ,  C03B33/03 ,  C03B33/04 ,  Y02P40/57

Abstract: Methods and apparatus provide for supporting a source glass sheet and defining an at least partially non-straight cutting line that establishes a closed pattern that circumscribes a desired final shape; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along the cutting line to elevate a temperature of the glass sheet at the cutting line to a substantially consistent temperature, where the laser beam is of a circular shape; and applying a cooling fluid simultaneously with the application of the laser beam, such that the cooling fluid at least reduces the temperature of the glass sheet in order to propagate a fracture in the glass sheet along the cutting line.

Abstract translation: 方法和装置提供用于支撑源玻璃板并限定至少部分非直线切割线，其建立围绕期望最终形状的封闭图案; 使用机械刻痕装置在起始线上评分玻璃板; 从起始线开始将激光束施加到玻璃板上，并沿切割线相对于玻璃板连续移动激光束，将切割线处的玻璃板的温度升高至基本一致的温度，其中激光束 是圆形的; 以及在施加激光束的同时施加冷却流体，使得冷却流体至少降低玻璃板的温度，以沿着切割线传播玻璃板中的断裂。

公开(公告)号：WO2015077113A1

公开(公告)日：2015-05-28

申请号：PCT/US2014/065399

申请日：2014-11-13

Applicant: CORNING INCORPORATED

Inventor： BUONO, Joseph Richard ,  POTAPENKO, Sergey Y ,  SUSCH, Nicholas Leon ,  WEBB, Dale Alan

IPC: C03B17/00

CPC classification number: G01B11/24 ,  C03B17/064 ,  G01B11/25 ,  G06K9/4604 ,  G06K9/4661

Abstract: A method for determining a shape of a substantially cylindrical specular reflective surface includes the step of obtaining calibration data and the step of obtaining target data about a target structure. The method further includes the step of defining a target line from the target data, where the target line represents a feature of the target structure and the step of capturing a reflected image of the target structure in the specular reflective surface. The method further includes the step of obtaining reflected data from the reflected image and the step of defining a reflected line from the reflected data, where the reflected line represents a reflection of the feature of the target structure. The method also includes the step of determining a correspondence between the target line and the reflected line and using the correspondence and the calibration data to determine the shape of the specular reflective surface.

Abstract translation: 用于确定基本上圆柱形的镜面反射表面的形状的方法包括获得校准数据的步骤以及获得关于目标结构的目标数据的步骤。 该方法还包括从目标数据定义目标行的步骤，其中目标行表示目标结构的特征，以及在镜面反射表面中捕获目标结构的反射图像的步骤。 该方法还包括从反射图像获得反射数据和从反射数据定义反射线的步骤，其中反射线表示目标结构的特征的反射。 该方法还包括确定目标线和反射线之间的对应关系并使用对应关系和校准数据来确定镜面反射表面的形状的步骤。