Abstract:
An LED lamp or bulb (50, 210, 240, 270) is disclosed that comprises a light source (58, 218, 248, 272), a heat sink structure (52, 212, 242, 274) and a remote planar phosphor carrier (62, 220, 250, 280) having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphor arranged according to the present invention can operate at lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor.
Abstract:
Light engine modules comprise a support member and a solid state light emitter, in which (1) the emitter is mounted on the support member, (2) a region of the support member has a surface with a curved cross-section, (3) the emitter and a compensation circuit are mounted on the support member, (4) an electrical contact element extends to at least two surfaces of the support member, and/or (5) a substantial entirety of the module is located on one side of a plane and the emitter emits light into another side of the plane. Also, a module comprising means for supporting a light emitter and a light emitter. Also, a lighting device comprising a housing member and a light emitter mounted on a removable support member. Also, a lighting device comprising a module mounted in a lighting device element. Also, a method comprising mounting a module to a lighting device element.
Abstract:
The invention relates to a cooling device for a heat source, especially LED modules fitted with many components, said device comprising a base body (2) that is in thermal and mechanical contact with the body of the heat source (12), at least one thermoconducting tube (4, 5, 6) having an end section that is inserted into the base body (2) in a form-fitting and thermoconducting manner, and at least one cooling body (3) comprising cooling body lamellae (20) on the other end section of the thermoconducting tube. The invention is characterised in that the thermoconducting tubes (4, 5, 6) extend over the entire length of the base body (2) such that a hot zone (16, 34) of the heat source (12) lies on a contact surface (21) of the base body (2), the thermoconducting tubes extend parallel to each other and parallel to the contact surface of the heat source with the hottest zone (16, 34), and the base body (2) is fixed to the body of the heat source (12), base body lamellae (10) being provided on the outer side of the base body (2), formed as a single component thereon or connected thereto.
Abstract:
본 발명은 발광다이오드 램프에 관한 것이다. 본 발명의 일 실시예에 따른 발광다이오드 램프는, 커버(20)와 이격되게 배치되고 외측에 소켓(44)이 구비된 소켓 커버(40), 커버(20)와 소켓 커버(40)의 사이에 설치되어 커버(20)와 소켓 커버(40)를 지지하는 복수 개의 프레임(30), 프레임(30)에 삽입되고 커버(20)와 소켓 커버(40)의 사이에 배치되는 복수 개의 방열 핀(60), 복수 개의 방열 핀(50)의 외측에 제1 선형부(52)가 위치하며 복수 개의 방열핀(50)에 관통되어 접하도록 제2 선형부(56)가 형성된 히트 파이프(50), 제1 선형부(52)에 끼워지며 일측은복수 개의 방열 핀(60)과 접하는 히트 싱크(80), 히트 싱크(80)의 외측에 배치되고 겉 표면에 LED소자(98)가 복열로 배치되는 메탈PCB(90) 및 메탈PCB(90)의 외측에 배치되고 히트 싱크(80)에 결속되어 LED소자(98)에서 발광하는 빛을 외부로 투영되도록 하는 투광커버(100)를 포함한다.
Abstract:
A lamp assembly, comprising a lens, a lamp housing in the form of an integral metal part, the lamp housing cooperating with the lens to at least partially define a lamp chamber that is generally fluidly isolated from an ambient atmosphere outside the lamp chamber, and at least one lamp provided in the lamp chamber and carried by the lamp housing. The lamp housing itself defines a heat sink exposed to the ambient atmosphere outside the lamp chamber such that heat from the at least one lamp is transmitted to the ambient atmosphere.
Abstract:
A heat pipe configured to transfer heat from a central portion of a lighting device to an edge portion of the lighting device, the heat pipe comprising one region which extends along a portion of a diameter of a substantially circular, substantially annular shape and another region that extends along a diameter of the shape. Also, a lighting device comprising a housing, a reflector, a light emitter and a heat pipe as described above. Also, a self ballasted lamp comprising a solid state light source, an electrical connector, an AC power supply, a reflector configured to receive light from the source and emit reflected light from an aperture, and a thermal management system. Also, a lighting device, comprising a housing, a reflector, a light emitter comprising an array of solid state light emitters, a heat pipe and a sensor.
Abstract:
Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.
Abstract:
LED module assemblies and luminaires that reduce thermal issues associated with LED lamp energy dissipation are disclosed. In one embodiment, an optimized conduction path from the LED to the exterior of the luminaire is created through the use of heat pipes integrated into the LED module assembly and luminaire. In this embodiment, a significant reduction in thermal transfer to the interior of the enclosure may be implemented, while allowing maximum energy dissipation from the LEDs.
Abstract:
A device has an electrical connector, a radiation generator (93), and a flexible carrier (148) with circuitry that is operatively coupled between the connector and the radiation generator. In response to electrical power received through the connector, the circuitry energizes the radiation generator, and the radiation generator emits radiation. In a different embodiment, a device has an electrical connector, a radiation generator, and a member (331) with circuitry embedded therein. The circuitry is operatively coupled between the connector and the radiation generator. In response to electrical power received through the connector, the circuitry energizes the radiation generator, and the radiation generator emits radiation.
Abstract:
A device has a plurality of light emitting diodes (LEDs), heat conducting structure that includes a heat pipe and that carries heat from the region of the LEDs to a further location spaced therefrom, and heat dissipating structure that accepts heat from the heat conducting structure at the further location and that discharges the heat externally of the device. In a different embodiment, a device has a radiation generator, a thermal spreader that receives heat emitted by the radiation generator, heat conducting structure that carries heat from the thermal spreader to a location spaced therefrom, and heat dissipating structure that accepts heat at the location from the heat conducting structure and that discharges the heat externally of the device.