Abstract:
The present invention relates to a method of preparing a thin film element which is a dielectric exhibiting piezoelectric properties comprising a bismuth-based solid solution ceramic material as well as uses thereof. In one aspect, the present inventions provides a method for fabricating a lead-free piezoelectric thin film element comprising a substrate and a piezoelectric thin film formed thereon, wherein said piezoelectric thin film is a solid solution ceramic material having a major proportion of a perovskite phase and having the formula (I) below : (I): xA-yB-z 1 C 1 -z 2 C 2 wherein A is a first bismuth based perovskite component; B is a second bismuth based perovskite component; C 1 and C 2 are dopant perovskite components; and wherein: x+y+z 1 +z 2 = 1; x, y≠ 0; (z 1 + z 2 ) ≥ 0; said method comprising: performing steps i) and ii) below one or more times: i) depositing a precursor solution for the ceramic material of formula (I) on to the substrate by chemical solution deposition to form a deposited precursor solution on the substrate; ii) drying and pyrolysing the deposited precursor solution to form a coating; followed by performing step iii) below: iii) crystallising the coating by rapid thermal processing to form a film of the solid solution ceramic material of formula (I); wherein crystallising in step iii) involves heating the coating to a crystallisation temperature of from 600 °C to 800 °C; and wherein the temperature is increased at a ramp rate of from 70 to 150 °C/s up to the crystallisation temperature.
Abstract:
The invention relates to method for obtaining an elastically-flexible piezoelectric structure (150), characterized in that it comprises steps of: depositing a piezoelectric thin layer (110) on a chemical etching sensitive metallic sacrificial substrate (100); depositing an elastically-flexible polymeric support layer (130) on the piezoelectric thin layer, selectively and chemically etching said metallic sacrificial substrate to obtain an elastically-flexible piezoelectric structure comprising the piezoelectric thin layer and the elastically-flexible polymeric support layer used as permanent substrate (140) of said structure.
Abstract:
A method for preparing a ceramic film, which comprises a step of forming a ceramic film (30) through crystallizing a raw material (20), wherein the raw material (20) contains different types of materials in a mixed state, which are different from each other with respect to at least one of the condition for crystal growth and the mechanism of crystal growth. The method can be used for improving the morphology of the surface of a ceramic film.