Abstract:
The present invention provides a high molecular weight epoxy resin containing highly pure bisphenol S without bromine, a resinous composition comprising the high molecular weight epoxy resin, and a resinous composition for a printed circuit board comprising the resinous composition. [Solving Means] A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100 % by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.
Abstract:
The preparation of epoxy resins with high epoxy functionality that possess a lower melt viscosity and a higher glass transition temperature relative to previous epoxidized poly-p-hydroxystyrenes or epoxy novolaks is accomplished by the reaction of poly-p-hydroxystyrene polymers with epichlorohydrin and optionally a dihydric phenol in the presence of an alkaline agent which are useful in the formulation of coatings.
Abstract:
The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or more carboxylic acid precursor(s). The present invention further provides phenol-dicarbonyl condensates, epoxy resins, epoxy resin systems and laminates prepared using these phenol-dicarbonyl condensates.
Abstract:
An epoxy composition effective for forming a thermally curable structural adhesive, and in particular, a one-part or two-part epoxy composition that when cured can obtain preferred and improved physical and chemical characteristics useful in structural assembly applications.
Abstract:
A heat-curable can-coating lacquer, which comprises an advanced epoxy resin which is the reaction product of one or several bisphenol diglycidyl ether(s), one or several bisphenol(s) and of an adduct of epoxidised soybean oil with a monocarboxylic acid, which has an epoxy equivalent weight of 350 to 600, and a crosslinking agent for epoxy resins.
Abstract:
The present invention is a composition comprising either: a) a high internal phase ratio emulsion having water as a continuous phase and a thermoplastic hydroxy-functional polyether as a disperse phase; or b) a stable aqueous dispersion of the thermoplastic hydroxy-functional polyether. The composition of the present invention addresses a need in the art by providing a thermoplastic coating that exhibits an excellent barrier to oxygen and carbon dioxide, but which barrier properties are not adversely affected by contact with water. The composition is particularly useful in the paper packaging industry where biodegradability and resistance to spoilage of food is desirable.
Abstract:
The invention relates to a process for the preparation of an advanced resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more than one nucleophile bearing active hydrogen such as aromatic hydroxyl group, carboxyl group or amino group, per molecule, in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the aromatic hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture, as a feedstream to a surface which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.
Abstract:
This invention pertains to improved polyester polyol compositions comprising 1,3-cyclohexanedimethanoi (1,3-CHDM). Coating compositions based on such polyester polyols are capable of providing a good balance of the desirable coating properties, such as solvent resistance, acid resistance, retort resistance, microcracking resistance, and bending ability, for metal packaging applications.