摘要:
An epoxy resin composition including an epoxy functionalized resin, a hardener, and an internal mold release agent, wherein the epoxy functionalized resin has a monohydrolyzed resin content of at least about 0.1 wt %.
摘要:
High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.
摘要:
A compound is provided according to structure 4, wherein n has a value from 0 to 48 and Z is hydroxyl or a benzene ring bearing substituents R11-R15, wherein R1-R15 are each individually selected from the group consisting of H, allyl, alkyl, alkoxy, phenyl, phenoxy, halide, hydroxyl, glycidyl, (meth)acryloyl, 3-(meth)acry!oyl-2-hydroxy-1-propoxy, 2,3-epoxypropyl, maleate, and structure (a) wherein at least one of R1-R5, at least one of R6-R10, and at least one of R11-R15 is hydroxyl or an ether or ester derived from it.
摘要:
Epoxy resin compositions contain (i) a potyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or a mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
摘要:
The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.