公开(公告)号：WO2010068825A2

公开(公告)日：2010-06-17

申请号：PCT/US2009/067595

申请日：2009-12-10

Applicant: SENECA MERGER SUB, INC. ,  NAYAK, Uday ,  YALEI, Sun ,  CASLER, JR., Richard J. ,  ROHRS, Thomas

Inventor： NAYAK, Uday ,  YALEI, Sun ,  CASLER, JR., Richard J. ,  ROHRS, Thomas

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/66

CPC classification number: G05B19/19 ,  G05B19/416 ,  G05B2219/50228

Abstract: Methods and systems for, in one embodiment, accelerating a stage through a clearance height in a first direction and decelerating the stage in the first direction while accelerating in a second direction are shown. The stage is moved in a third direction and a determination is made whether the stage movement in the second direction is below a threshold value before continuing to move the stage further in the third direction. The first direction is perpendicular to the second direction and is parallel and opposite to the third direction.

Abstract translation: 在一个实施例中，示出了用于在第一方向上通过间隙高度加速台阶并且在沿第二方向加速的同时使第一方向减速的方法和系统。 阶段在第三方向上移动，并且确定在第二方向上的阶段移动是否在继续在第三方向上移动阶段之前低于阈值。 第一方向垂直于第二方向并且与第三方向平行且相反。

公开(公告)号：WO2008089430A2

公开(公告)日：2008-07-24

申请号：PCT/US2008/051473

申请日：2008-01-18

Applicant: FORMFACTOR, INC. ,  MILLER, Charles, A.

Inventor： MILLER, Charles, A.

IPC: G01R1/073 ,  G01R31/26 ,  H01S4/00

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  Y10T29/49002

Abstract: A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from the support member, and a plurality of conductive members can be disposed on the beams. The conductive members can extend along a length of the beam. A plurality of conductive contact elements can be disposed on the beam and electrically connected to one of the conductive members.

Abstract translation: 微电子弹性结构可以包括支撑构件和附接到支撑构件的平台。 平台可以包括远离支撑构件延伸的非导电弹性梁，并且可以在梁上设置多个导电构件。 导电构件可以沿着梁的长度延伸。 多个导电接触元件可以设置在梁上并电连接到导电构件之一。

公开(公告)号：WO2008082847A2

公开(公告)日：2008-07-10

申请号：PCT/US2007/086667

申请日：2007-12-06

Applicant: FORMFACTOR, INC. ,  HOBBS, Eric, D.

Inventor： HOBBS, Eric, D.

IPC: H01L23/58 ,  G01R31/02 ,  H05K3/20

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  Y10T29/49128

Abstract: Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.

Abstract translation: 这里提供了旋转接触元件和制造方法。 在一个实施例中，旋转接触元件包括尖端，尖端具有被构造为接触待测试装置的第一侧和相对的第二侧; 以及从尖端的第二侧延伸并围绕其中心轴线布置的多个变形构件，其中尖端在多个变形构件的压缩时基本围绕中心轴线旋转。

公开(公告)号：WO2008076590A3

公开(公告)日：2008-06-26

申请号：PCT/US2007/085480

申请日：2007-11-25

Applicant: FORMFACTOR, INC. ,  BREINLINGER, Keith J.

Inventor： BREINLINGER, Keith J.

IPC: G01R31/02

Abstract: A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating material and at least a portion of electrical guard conductors disposed on the component of the probe card assembly. Each signal conductor can be disposed between a pair of the guard conductors. The probe card assembly can include a plurality of probes disposed to contact an electronic device to be tested. The signal conductors can be part of electrical paths within the probe card assembly to the probes.

公开(公告)号：WO2008082815A2

公开(公告)日：2008-07-10

申请号：PCT/US2007/085481

申请日：2007-11-25

Applicant: FORMFACTOR, INC. ,  GRITTERS, John K. ,  ELDRIDGE, Benjamin, N. ,  BREINLINGER, Keith J.

Inventor： GRITTERS, John K. ,  ELDRIDGE, Benjamin, N. ,  BREINLINGER, Keith J.

IPC: G01R1/067 ,  G01R31/26

CPC classification number: H01R31/02 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00

Abstract: Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.

Abstract translation: 弹性接触元件的实施例及其制造方法在本文中提供。 在一个实施例中，用于探针卡的弹性接触元件包括光刻形成的弹性梁，其具有第一端和相对的第二端; 以及设置在所述梁的第一端附近并且被构造成突破待测试装置的表面的氧化物层以与其建立可靠的电连接的尖端; 其中所述梁的至少中心部分具有连续的倾斜轮廓，所述连续倾斜轮廓在松弛状态下限定在所述梁与表示待测试装置的上表面的平面之间测量的高度，其在所述梁的第二端附近较大 比梁的第一端附近。

公开(公告)号：WO2008048938A2

公开(公告)日：2008-04-24

申请号：PCT/US2007/081423

申请日：2007-10-15

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin N. ,  GRITTERS, John K. ,  MARTENS, Rodney I. ,  SLOCUM, Alexander H. ,  YAGLIOGLU, Onnik

Inventor： ELDRIDGE, Benjamin N. ,  GRITTERS, John K. ,  MARTENS, Rodney I. ,  SLOCUM, Alexander H. ,  YAGLIOGLU, Onnik

IPC: H01J61/04

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/06755 ,  G01R3/00 ,  H01L2924/0002 ,  Y10T29/49004 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.

Abstract translation: 包含多个垂直排列的碳纳米管的柱可以被配置为机电接触结构或探针。 柱子可以在牺牲基底上生长并转移到产品基底上，或者柱子可以在产品基底上生长。 可以对柱进行处理以增强机械性能，例如刚度，电性能（例如电导率）和/或物理接触特性。 可以机械地调整柱子以具有预定的弹簧特性。 这些色谱柱可以用作机电探头，例如用于接触和测试电子设备，例如半导体裸片，并且色谱柱可以在电子设备的端子上制作独特的标记。

公开(公告)号：WO2008036786A2

公开(公告)日：2008-03-27

申请号：PCT/US2007/078964

申请日：2007-09-20

Applicant: FORMFACTOR, INC. ,  KIM, Tae, Ma

Inventor： KIM, Tae, Ma

IPC: B29C73/02 ,  B32B43/00 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49149 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/53174 ,  Y10T428/20

Abstract: An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material.

Abstract translation: 电气元件可以通过导电粘合剂材料附接和电连接到基底。 导电粘合剂材料可以将电气元件电连接到基板上的端子或其他电导体。 导电粘合剂材料可以通过将加热的气体流引导到材料上或通过加热材料通过其上放置有基底的支撑结构来固化。 非导电粘合剂材料可以以比导电粘合剂更大的粘合强度将电元件附接到基底。 不导电粘合剂材料也可以通过将加热气体流引导到材料上或通过加热材料通过其上放置有基底的支撑结构来固化。 非导电粘合剂材料可以覆盖导电粘合剂材料。

公开(公告)号：WO2008028171A2

公开(公告)日：2008-03-06

申请号：PCT/US2007/077467

申请日：2007-09-01

Applicant: FORMFACTOR, INC. ,  SPORCK, A., Nicholas ,  HENSON, Roy, J.

Inventor： SPORCK, A., Nicholas ,  HENSON, Roy, J.

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/07385

Abstract: A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.

Abstract translation: 包括设置成接触电子装置的多个探针的接触器装置可电连接到测试信号源。 可以激活开关，将连接到测试信号源的连接电连接到被设置为接触多个电子设备的第一组的第一组电连接的探针中的选定的一个或第二组电连接 探针中的一个被设置为接触多个电子设备的第二组。

公开(公告)号：WO2010077482A1

公开(公告)日：2010-07-08

申请号：PCT/US2009/065424

申请日：2009-11-21

Applicant: FORMFACTOR, INC. ,  FAN, Li ,  GRITTERS, John K.

Inventor： FAN, Li ,  GRITTERS, John K.

IPC: H01L21/66

CPC classification number: G01R3/00 ,  G01R1/06711 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: A process for making contact elements for a probe card assembly includes steps of forming a first continuous trench in a substrate along a first direction, and forming simultaneously a plurality of tip structures adjacent one to another in the first continuous trench in a second direction substantially normal to the first direction, each of the tip structures being part of, or adapted to be part of at least one corresponding contact element capable of forming an electrical contact with a terminal of an electronic device.

Abstract translation: 用于制造探针卡组件的接触元件的方法包括以下步骤：沿着第一方向在衬底中形成第一连续沟槽，同时在第一连续沟槽中沿第二方向同时形成多个尖端结构 到第一方向，每个尖端结构是能够形成与电子设备的端子的电接触的至少一个对应的接触元件的一部分或者适于其中的一部分。

公开(公告)号：WO2010065352A2

公开(公告)日：2010-06-10

申请号：PCT/US2009/065425

申请日：2009-11-21

Applicant: FORMFACTOR, INC. ,  HOBBS, Eric, D.

Inventor： HOBBS, Eric, D.

IPC: H01L21/68

CPC classification number: G01R31/2889

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract translation: 第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。 对准特征和约束可以被配置为当对准特征被插入到约束中时，使第一设备和第二设备对齐。 对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。 定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。