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公开(公告)号：WO2015130607A1
公开(公告)日：2015-09-03
申请号：PCT/US2015/017088
申请日：2015-02-23
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： CHEN, Tianniu , JIANG, Ping , KORZENSKI, Michael B.
CPC classification number: C25C1/20 , C22B3/065 , C22B3/08 , C22B3/22 , C22B3/44 , C22B11/04 , C22B11/042 , C23F1/30 , Y02P10/214 , Y02P10/234
Abstract: Compositions and processes for leaching noble metals from materials comprising said noble metals. Advantageously, the halide-based composition is environmentally friendly and effectively removes noble metals at room temperature without the need for high pressures and electrodes.
Abstract translation: 用于从包含所述贵金属的材料中浸出贵金属的组合物和方法。 有利地，基于卤化物的组合物是环境友好的，并且在室温下有效地除去贵金属，而不需要高压和电极。
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公开(公告)号：WO2015119925A1
公开(公告)日：2015-08-13
申请号：PCT/US2015/014203
申请日：2015-02-03
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： LIU, Jun , THOMAS, Elizabeth , FRYE, Donald
IPC: C11D7/60 , H01L21/304
CPC classification number: H01L21/02074 , C11D7/04 , C11D7/06 , C11D7/10 , C11D7/12 , C11D7/16 , C11D7/261 , C11D7/265 , C11D7/267 , C11D7/3245 , C11D7/34 , C11D7/36 , C11D11/0047
Abstract: An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The compositions achieve highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material, copper interconnect material, or cobalt-containing materials.
Abstract translation: 一种不含胺的组合物和用于从具有所述残留物和污染物的微电子装置清洁化学后机械抛光（CMP）残留物和污染物的方法。 该组合物可以在不影响低k电介质材料，铜互连材料或含钴材料的情况下从微电子器件的表面高效清洁后CMP残留物和污染物质。
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3.发明申请APPARATUS AND METHOD FOR DIRECT CONTACT PRESSURE DISPENSING USING FLOATING LIQUID EXTRACTION ELEMENT 审中-公开使用浮选液体提取元件进行直接接触压力分配的装置和方法
公开(公告)号：WO2015066448A1
公开(公告)日：2015-05-07
申请号：PCT/US2014/063378
申请日：2014-10-31
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： TOM, Glenn, M.
IPC: B01F3/00
CPC classification number: B65D88/548 , B65D90/046 , B65D2590/046 , B67D7/0272
Abstract: A direct contact pressure dispensing apparatus including a skimmer arranged to float on liquid within a container and defining at least one liquid extraction opening positioned below an upper level of liquid in the container, and a material extraction hose coupled between the skimmer and an outlet port of the container. Withdrawal of liquid proximate to a gas/liquid interface reduces or inhibits saturation of liquid with pressurization gas. The skimmer can translate along a vertical support rod. A pressurizable reservoir can be arranged between the pressure dispensing container and a locus of use for the liquid.
Abstract translation: 一种直接接触压力分配装置，包括分离器，其设置成浮动在容器内的液体上并且限定位于容器内的液面上方的至少一个液体提取开口，以及连接在撇渣器和出口之间的材料抽出软管 容器 在靠近气体/液体界面的情况下提取液体会降低或抑制加压气体的液体饱和度。 撇渣器可以沿垂直支撑杆平移。 可以在压力分配容器和用于液体的地点之间布置可加压的储存器。
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4.发明申请AQUEOUS FORMULATIONS FOR REMOVING METAL HARD MASK AND POST-ETCH RESIDUE WITH Cu/W COMPATIBILITY 审中-公开用Cu / W兼容性去除金属硬掩模和脱水后残留物的水性配方
公开(公告)号：WO2015017659A1
公开(公告)日：2015-02-05
申请号：PCT/US2014/049153
申请日：2014-07-31
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： CHEN, Li-Min , LIPPY, Steven , WHITE, Daniela , COOPER, Emanuel, I.
IPC: C09K15/02
CPC classification number: B81C1/00539 , C09K13/08 , C09K13/10 , G03F7/405 , H01L21/02063 , H01L21/31144 , H01L21/32134
Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions are low pH and contain at least one oxidizing agent and at least one etchant as well as corrosion inhibitors to minimize metal erosion and passivating agents to protect dielectric materials.
Abstract translation: 可用于相对于金属导电（例如钨）选择性去除氮化钛和/或光致抗蚀剂蚀刻残余材料的组合物，以及来自其上具有其的微电子器件的绝缘材料。 去除组合物是低pH值并含有至少一种氧化剂和至少一种蚀刻剂以及腐蚀抑制剂以最小化金属侵蚀和钝化剂以保护电介质材料。
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公开(公告)号：WO2015006738A1
公开(公告)日：2015-01-15
申请号：PCT/US2014/046421
申请日：2014-07-11
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： WARE, Donald, D. , KOLAND, Amy , WILSON, Richard, Lee
CPC classification number: B67D1/1252 , B67D1/0802 , B67D7/0261 , B67D7/0288 , B67D7/72 , B67D2001/0828
Abstract: A shippable liquid storage and dispensing apparatus includes a collapsible liner arranged within a container, with a dispense head coupled to the container, suitable for handling oxygen- and moisture-sensitive materials. The dispense head includes a pressurization gas passage, a pressurization gas valve, a liquid passage, a liquid valve, a liner gas passage, and a liner gas valve, wherein each valve may have an associated quick connect fitting. The dispense head remains attached to the container during inert gas purging, liner filling, container shipment, and liquid dispensing. Pressurized inert gas may be maintained in the liner overlying liquid-containing material during shipment of the coupled dispense head and container. The container may have an extended chime to provide a protective zone that contains the entirety of the dispense head.
Abstract translation: 可运输的液体储存和分配装置包括布置在容器内的可折叠衬里，其中分配头联接到容器，适于处理氧气和湿气敏感材料。 分配头包括加压气体通道，加压气体阀，液体通道，液体阀，衬里气体通道和衬里气体阀，其中每个阀可以具有相关联的快速连接配件。 在惰性气体吹扫，衬管填充，集装箱装运和液体分配期间，分配头保持附接到容器。 加压的惰性气体可以在联合分配头和容器的运输期间保持在覆盖液体材料的衬里中。 容器可以具有延长的钟声，以提供包含整个分配头的保护区。
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Patent Agency Ranking6.发明申请
公开(公告)号：WO2014186538A1
公开(公告)日：2014-11-20
申请号：PCT/US2014/038125
申请日：2014-05-15
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： LIU, Jun , SUN, Laisheng
CPC classification number: C11D11/0047 , C11D1/008 , C11D3/0042 , C11D3/2072 , C11D3/2086 , C11D3/2096 , C11D3/30 , C11D3/33 , H01L21/02057 , H01L21/02065
Abstract: A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one surfactant. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
Abstract translation: 一种去除组合物和用于从其上具有所述颗粒和污染物的微电子装置清洁化学后机械抛光（CMP）污染物和二氧化铈颗粒的方法。 除去组合物包括至少一种表面活性剂。 该组合物可从微电子器件的表面高效地除去二氧化铈颗粒和CMP污染物质，而不损害低k电介质，氮化硅或含钨材料。
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公开(公告)号：WO2014070877A1
公开(公告)日：2014-05-08
申请号：PCT/US2013/067487
申请日：2013-10-30
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： KUSZ, Matt , CHISM, Richard , MUSOLF, Bruce
CPC classification number: B67D1/0802 , B05B9/047 , B05B11/048 , B05B15/30 , B29C45/14 , B65D83/32 , B67D7/0255
Abstract: A dip tube assembly having a tubular body portion and a coupler overmolded to a first end of the tubular body portion, the coupler configured for removable coupling with the mouth of a container storing contents therein. Also disclosed are a method of making the overmolded dip tube assembly and a container system including the overmolded dip tube assembly. In some embodiments, the tubular body portion and/or the coupler may include retention features molded into a surface thereof at an overmold interface between the tubular body portion and the coupler.
Abstract translation: 一种汲取管组件，其具有管状主体部分和耦合器，所述耦合器包覆模制到所述管状主体部分的第一端，所述联接器构造成用于与容纳其中的内容物的容器的口部可拆卸地联接。 还公开了制造包覆成型的汲取管组件的方法和包括二次模制的汲取管组件的容器系统。 在一些实施例中，管状主体部分和/或耦合器可以包括在管状主体部分和耦合器之间的包覆模制界面处模制到其表面中的保持特征。
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公开(公告)号：WO2013181521A9
公开(公告)日：2013-12-05
申请号：PCT/US2013/043592
申请日：2013-05-31
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： HENDRIX, Bryan, C. , GREGG, John, N. , BATTLE, Scott, L. , ΝΑITO, Donn, K. , BARTOSH, Kyle , CLEARY, John, M. , CHEON, Sebum
IPC: C23C16/44 , C23C16/458
Abstract: Systems, reagent support trays, particle suppression devices, and methods are disclosed. In one aspect, a system includes a vaporizer vessel having one or more interior walls enclosing an interior volume and a plurality of reagent support trays configured to be vertically stackable within the interior volume. Each of the plurality of reagent support trays is configured to be vertically stackable within the interior volume to form a stack of reagent support trays. One or more of the plurality of reagent support trays is configured to redirect a flow of a gas passing between adjacent reagent support trays in the stack of reagent support trays to cause the flow of gas to interact with the source reagent material in a particular reagent support tray before passing into a next of the plurality of reagent support trays in the stack of reagent support trays.
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9.发明申请MANUFACTURING METHOD FOR GENERALLY CYLINDRICAL THREE-DIMENSIONAL CONFORMAL LINERS 审中-公开一般圆柱三维一致衬管的制造方法
公开(公告)号：WO2013166018A1
公开(公告)日：2013-11-07
申请号：PCT/US2013/038872
申请日：2013-04-30
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： RICHTER, Royce , NIELSON, Bradd, Donald , KATARZYNSKI, Jacek , BRUNOTT, Edward , EASTWOOD, Gary
CPC classification number: B32B27/28 , B21D39/028 , B21D51/18 , B21D51/26 , B21D51/2623 , Y10T428/13
Abstract: A method for manufacturing a liner, the method including forming a tubular body portion having a top circumferential edge, a bottom circumferential edge, and a weld seam or seams extending from the top circumferential edge to the bottom circumferential edge; stretching the tubular body near the top circumferential edge and welding a top liner sheet portion along the stretched top circumferential edge, the top liner sheet portion having a fitment welded thereto; and stretching the tubular body near the bottom circumferential edge and welding a bottom liner sheet portion along the stretched bottom circumferential edge. The weld between the tubular body portion and the top liner sheet portion may be effected with the inner wetted surfaces of each portion in contact. Similarly, the weld between the tubular body portion and the bottom liner sheet portion is effected with the inner wetted surfaces of each portion in contact.
Abstract translation: 一种衬套的制造方法，该方法包括形成具有顶部圆周边缘的管状主体部分，底部周边边缘和从顶部周边边缘延伸到底部周边边缘的焊缝或接缝; 在顶部圆周边缘附近拉伸管状体并且沿着拉伸的顶部周边边缘焊接顶部衬垫片部分，顶部衬垫片部分具有焊接到其上的配件; 并且在所述底部周边边缘附近拉伸所述管状体，并且沿着所述延伸的底部周向边缘焊接底部衬垫片部分。 管状主体部分和顶部衬垫片部分之间的焊接可以在接触每个部分的内部润湿表面的情况下实现。 类似地，管状主体部分和底部衬垫片部分之间的焊接是通过接触每个部分的内部润湿表面实现的。
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10.发明申请POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE 审中-公开具有改进的障碍层相容性和清洁性能的后CMP制剂
公开(公告)号：WO2013142250A1
公开(公告)日：2013-09-26
申请号：PCT/US2013/031299
申请日：2013-03-14
Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
Inventor： LIU, Jun , HURD, Trace Quentin , SUN, Laisheng , MEDD, Steven , JENQ, Shrane Ning
IPC: C11D3/28 , H01L21/304 , C11D3/30 , C11D3/60
CPC classification number: C11D7/3209 , C11D3/0042 , C11D3/0073 , C11D7/265 , C11D7/268 , C11D7/3218 , C11D7/3245 , C11D7/3281 , C11D7/34 , C11D11/0047 , H01L21/02074 , H01L21/7684 , H01L21/76843 , H01L23/53238 , H01L2924/0002 , H01L2924/00
Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one azole corrosion inhibitor, at least one reducing agent, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers, wherein the barrier layers are substantially devoid of tantalum or titanium.
Abstract translation: 一种清洁组合物和用于从具有所述残余物和污染物的微电子装置清洁后化学机械抛光（CMP）残留物和污染物的清洁组合物和方法。 清洁组合物包括至少一种季碱，至少一种胺，至少一种唑类腐蚀抑制剂，至少一种还原剂和至少一种溶剂。 该组合物可与微电子器件的表面高效地清洁后CMP残留物和污染物质，同时与阻挡层相容，其中阻挡层基本上不含钽或钛。
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